JPH0392034U - - Google Patents

Info

Publication number
JPH0392034U
JPH0392034U JP15324089U JP15324089U JPH0392034U JP H0392034 U JPH0392034 U JP H0392034U JP 15324089 U JP15324089 U JP 15324089U JP 15324089 U JP15324089 U JP 15324089U JP H0392034 U JPH0392034 U JP H0392034U
Authority
JP
Japan
Prior art keywords
wafer
semiconductor
suction nozzle
semiconductor chip
stand
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15324089U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15324089U priority Critical patent/JPH0392034U/ja
Publication of JPH0392034U publication Critical patent/JPH0392034U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第1図、第3図は従来の移し変え方法を示す説
明図、第2図は本考案の実施例構造図である。図
においては1は半導体ウエハ、1aは半導体チツ
プ、2は枠体(ウエハ台)、3は樹脂シート、4
は治具、5は基台、6は吸着コレツト、6a,6
bはその金属パイプ及び絶縁チユーブ、7は駆動
部、8は吸着ノズル、8aは針、9は駆動部であ
る。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体ウエハを保持するウエハ台と、前記ウエ
    ハ台の上方及び下方に上下関係に配設された半導
    体チツプ吸着コレツト及び半導体ウエハ吸着ノズ
    ルを備え、前記吸着コレツト及び吸着ノズルの連
    動作用により半導体チツプの移し変えを行う半導
    体チツプの移し変装置において、前記半導体ウエ
    ハ吸着ノズルの前記ウエハ台との接触面を円弧状
    に形成すると共に前記半導体チツプ吸着コレツト
    の先端金属パイプ内に絶縁パイプを内設したこと
    を特徴とする半導体チツプの移し変装置。
JP15324089U 1989-12-29 1989-12-29 Pending JPH0392034U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15324089U JPH0392034U (ja) 1989-12-29 1989-12-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15324089U JPH0392034U (ja) 1989-12-29 1989-12-29

Publications (1)

Publication Number Publication Date
JPH0392034U true JPH0392034U (ja) 1991-09-19

Family

ID=31699461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15324089U Pending JPH0392034U (ja) 1989-12-29 1989-12-29

Country Status (1)

Country Link
JP (1) JPH0392034U (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5850751A (ja) * 1981-09-22 1983-03-25 Shinkawa Ltd ダイ詰め換え方法
JPS6042737B2 (ja) * 1979-09-12 1985-09-25 アイシン精機株式会社 自動刺繍ミシンの制御装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6042737B2 (ja) * 1979-09-12 1985-09-25 アイシン精機株式会社 自動刺繍ミシンの制御装置
JPS5850751A (ja) * 1981-09-22 1983-03-25 Shinkawa Ltd ダイ詰め換え方法

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