JPH0395638U - - Google Patents

Info

Publication number
JPH0395638U
JPH0395638U JP1990002415U JP241590U JPH0395638U JP H0395638 U JPH0395638 U JP H0395638U JP 1990002415 U JP1990002415 U JP 1990002415U JP 241590 U JP241590 U JP 241590U JP H0395638 U JPH0395638 U JP H0395638U
Authority
JP
Japan
Prior art keywords
semiconductor element
insulating tape
height
lead
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990002415U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990002415U priority Critical patent/JPH0395638U/ja
Publication of JPH0395638U publication Critical patent/JPH0395638U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例を示す樹脂封止型半導
体装置の構成図、、第２図は従来の樹脂封止型半
導体装置の構成図である。 １１……リード、１２……テープ、１３……ボ
ンデイングワイヤ、１４……半導体素子、１５…
…接着剤、１６……モールド樹脂、１９……テー
プサポート、１９ａ……支持部。

Claims (1)

  1. 【実用新案登録請求の範囲】 (a) 薄い板状体からなる絶縁性テープと、 (b) 該絶縁性テープ上にマウントされる半導体
    素子と、 (c) 該絶縁性テープの周りに枠状に固定される
    テープサポートと、 (d) 該テープサポートと離れて配置されたリー
    ドとを設け、 (e) 前記半導体素子をダウンセツトして、該半
    導体素子の高さと前記リードの高さとの高低差を
    低減してなる樹脂封止型半導体装置。
JP1990002415U 1990-01-17 1990-01-17 Pending JPH0395638U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990002415U JPH0395638U (ja) 1990-01-17 1990-01-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990002415U JPH0395638U (ja) 1990-01-17 1990-01-17

Publications (1)

Publication Number Publication Date
JPH0395638U true JPH0395638U (ja) 1991-09-30

Family

ID=31506292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990002415U Pending JPH0395638U (ja) 1990-01-17 1990-01-17

Country Status (1)

Country Link
JP (1) JPH0395638U (ja)

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