JPH02118939U - - Google Patents

Info

Publication number
JPH02118939U
JPH02118939U JP1989026181U JP2618189U JPH02118939U JP H02118939 U JPH02118939 U JP H02118939U JP 1989026181 U JP1989026181 U JP 1989026181U JP 2618189 U JP2618189 U JP 2618189U JP H02118939 U JPH02118939 U JP H02118939U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
lead frame
thin metal
expose
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989026181U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989026181U priority Critical patent/JPH02118939U/ja
Publication of JPH02118939U publication Critical patent/JPH02118939U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例を示す樹脂封止型半導
体装置の断面図、第２図は従来の樹脂封止型半導
体装置の断面図、第３図は本考案の他の実施例を
示す樹脂封止型半導体装置の断面図、第４図は本
考案の更なる他の実施例を示す樹脂封止型半導体
装置の断面図である。 ６……半導体素子、７……リードフレーム、８
……ワイヤ、９……インナリード、１０……第１
の樹脂、１１……第２の樹脂、１２，１５，１６
……開孔部、１３……外部リード。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) (a) 極薄の金属板を所定の形状に加工した
    リードフレームの主表面上に固定された半導体素
    子と、金属細線の接続されたリードフレームの一
    部とを封止成形する第１の樹脂と、 (b) 該第１の樹脂の一部を露出させる形で封
    止成形してなる第２の樹脂を具備することを特徴
    とする樹脂封止型半導体装置。 (2) 第１の樹脂には撥水性のエポキシ樹脂を用
    い、第２の樹脂には耐熱性シリコン樹脂を用いた
    請求項(1)記載の樹脂封止型半導体装置。
JP1989026181U 1989-03-09 1989-03-09 Pending JPH02118939U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989026181U JPH02118939U (ja) 1989-03-09 1989-03-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989026181U JPH02118939U (ja) 1989-03-09 1989-03-09

Publications (1)

Publication Number Publication Date
JPH02118939U true JPH02118939U (ja) 1990-09-25

Family

ID=31247578

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989026181U Pending JPH02118939U (ja) 1989-03-09 1989-03-09

Country Status (1)

Country Link
JP (1) JPH02118939U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013004848A (ja) * 2011-06-20 2013-01-07 Semiconductor Components Industries Llc 半導体装置およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013004848A (ja) * 2011-06-20 2013-01-07 Semiconductor Components Industries Llc 半導体装置およびその製造方法

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