JPH0395642U - - Google Patents

Info

Publication number
JPH0395642U
JPH0395642U JP1990002992U JP299290U JPH0395642U JP H0395642 U JPH0395642 U JP H0395642U JP 1990002992 U JP1990002992 U JP 1990002992U JP 299290 U JP299290 U JP 299290U JP H0395642 U JPH0395642 U JP H0395642U
Authority
JP
Japan
Prior art keywords
region
workpiece
bonding
atmospheric gas
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990002992U
Other languages
English (en)
Japanese (ja)
Other versions
JPH087633Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990002992U priority Critical patent/JPH087633Y2/ja
Publication of JPH0395642U publication Critical patent/JPH0395642U/ja
Application granted granted Critical
Publication of JPH087633Y2 publication Critical patent/JPH087633Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires

Landscapes

  • Wire Bonding (AREA)
JP1990002992U 1990-01-17 1990-01-17 ワイヤボンディング装置の雰囲気構造 Expired - Lifetime JPH087633Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990002992U JPH087633Y2 (ja) 1990-01-17 1990-01-17 ワイヤボンディング装置の雰囲気構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990002992U JPH087633Y2 (ja) 1990-01-17 1990-01-17 ワイヤボンディング装置の雰囲気構造

Publications (2)

Publication Number Publication Date
JPH0395642U true JPH0395642U (fr) 1991-09-30
JPH087633Y2 JPH087633Y2 (ja) 1996-03-04

Family

ID=31506835

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990002992U Expired - Lifetime JPH087633Y2 (ja) 1990-01-17 1990-01-17 ワイヤボンディング装置の雰囲気構造

Country Status (1)

Country Link
JP (1) JPH087633Y2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006323433A (ja) * 2005-05-17 2006-11-30 Dainippon Printing Co Ltd 入場者管理システム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006323433A (ja) * 2005-05-17 2006-11-30 Dainippon Printing Co Ltd 入場者管理システム

Also Published As

Publication number Publication date
JPH087633Y2 (ja) 1996-03-04

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Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term