JPH0395642U - - Google Patents

Info

Publication number
JPH0395642U
JPH0395642U JP1990002992U JP299290U JPH0395642U JP H0395642 U JPH0395642 U JP H0395642U JP 1990002992 U JP1990002992 U JP 1990002992U JP 299290 U JP299290 U JP 299290U JP H0395642 U JPH0395642 U JP H0395642U
Authority
JP
Japan
Prior art keywords
region
workpiece
bonding
atmospheric gas
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990002992U
Other languages
English (en)
Other versions
JPH087633Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990002992U priority Critical patent/JPH087633Y2/ja
Publication of JPH0395642U publication Critical patent/JPH0395642U/ja
Application granted granted Critical
Publication of JPH087633Y2 publication Critical patent/JPH087633Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は、本考案の一実施例を示す固定用カバ
ー及び移動用カバーを除去した状態における平面
図、第２図は、同実施例の側面説明図、第３図は
、同実施例の前記固定用カバー及び移動用カバー
を装着した状態の要部平面図、第４図は半導体製
造ラインの要部を一部を示す工程ブロツク図であ
る。 １……ワイヤボンダ機構、１４……加熱領域、
１５……プレヒート領域、１６……ボンデイング
領域、１７……冷却領域、１８……レール、１９
……第１雰囲気ガス用配管、２１……ヒートコラ
ム、２２……第２雰囲気ガス用配管、２３……第
３雰囲気ガス用配管、２４……第４雰囲気ガス用
配管、２５……移動用カバー、２８……固定用カ
バー、２９……第５雰囲気ガス用配管、３０……
第６雰囲気ガス用配管、３３……第１ヒータ、３
４……第２ヒータ、３５……下部領域、３６……
第７雰囲気ガス用配管。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) ワークの搬送及び加工を行う経路を複数の
    領域に区分し、該複数の領域毎に雰囲気ガスを供
    給しワークの酸化防止用ガス供給手段を設ける一
    方、前記経路の終端領域に前記ワークに雰囲気ガ
    スを吹き付けてワークの冷却を行う冷却領域を設
    けたことを特徴とするワイヤボンデイング装置の
    雰囲気構造。 (2) 前記複数の領域は、前記経路の初端領域に
    設けられた加熱領域と、該加熱領域のワーク搬送
    方向に隣接するプレヒート領域と、該プレヒート
    領域のワーク搬送方向に隣接するボンデイング領
    域と、該ボンデイング領域の上部に設けられ、ボ
    ンデイング窓の空間に雰囲気ガスによるエアーカ
    ーテンを形成する上部酸化防止領域と、前記プレ
    ヒート領域及びボンデイング領域との下部に亙つ
    て設けられた下部酸化防止領域とであつて、前記
    ボンデイング領域のワーク搬送方向に隣接して前
    記冷却領域が設けられたことを特徴とする請求項
    １記載のワイヤボンデイング装置の雰囲気構造。
JP1990002992U 1990-01-17 1990-01-17 ワイヤボンディング装置の雰囲気構造 Expired - Lifetime JPH087633Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990002992U JPH087633Y2 (ja) 1990-01-17 1990-01-17 ワイヤボンディング装置の雰囲気構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990002992U JPH087633Y2 (ja) 1990-01-17 1990-01-17 ワイヤボンディング装置の雰囲気構造

Publications (2)

Publication Number Publication Date
JPH0395642U true JPH0395642U (ja) 1991-09-30
JPH087633Y2 JPH087633Y2 (ja) 1996-03-04

Family

ID=31506835

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990002992U Expired - Lifetime JPH087633Y2 (ja) 1990-01-17 1990-01-17 ワイヤボンディング装置の雰囲気構造

Country Status (1)

Country Link
JP (1) JPH087633Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006323433A (ja) * 2005-05-17 2006-11-30 Dainippon Printing Co Ltd 入場者管理システム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006323433A (ja) * 2005-05-17 2006-11-30 Dainippon Printing Co Ltd 入場者管理システム

Also Published As

Publication number Publication date
JPH087633Y2 (ja) 1996-03-04

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Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term