JPH039599A - Automatic apparatus for mounting electronic component - Google Patents

Abstract

PURPOSE:To enable execution of optimum correction of rotation in any condition by selecting either an open-loop corrective operation program or a closed-loop corrective operation program when rotation is corrected. CONSTITUTION:A storage device 64 storing an open-loop corrective operation program for conducting correction of rotation only one time after recognition and a closed-loop corrective operation program for enabling repetition of the correction of rotation and making a difference between a recognized angular position and a proper angular position be found within certain allowable limits, a selecting device 39 selecting either one of the programs stored in the storage device 64, and a control device making a control so that a corrective operation be conducted in accordance with the program selected by the selecting device 39, are provided. In other words, either one of the open-loop corrective operation program and the closed-loop corrective operation program stored in the storage device 64 is selected by the selecting device 39. According to this constitution, the operation of correction of rotation is executed in accordance with the selected program.

Description

DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention is a method for controlling the taking-out nozzle by a nozzle rotation device based on angular position data of a chip-shaped electronic component held in the taking-out nozzle recognized by a recognition device. The present invention relates to an automatic electronic component mounting apparatus having a function of mounting the component on a printed circuit board after rotating and correcting the component to a proper angular position.

(b) Prior Art In general, the following technology is disclosed in Japanese Patent Laid-Open No. 62-55998 as a conventional technology for this type of electronic component automatic mounting apparatus. That is, turn holders are arranged and held on the outer periphery of the intermittent rotation support body in correspondence with the intermittent rotation pitch, and a plurality of types of suction nozzles are arranged and held on each of the turn holders so as to be rotatable. A nozzle selection means selects a suction nozzle to be used by rotating a turn holder corresponding to a customer stop position on a moving path by an intermittent rotating support, and a part is supplied to the selected suction nozzle for suction. A component supply means for holding the component, a position detection means for detecting the angular position of the component held by the suction nozzle, and a suction nozzle that is suctioning the component is rotated to detect the angular position of the component using the angular position detection data. The following is an example of a component mounting apparatus in which components are mounted on a substrate by sequentially disposing nozzle rotation means for setting or correcting based on the rotational direction of the intermittent rotation support.

However, when mounting components using this device, if the angular position of the component held in the suction nozzle is detected and there is a discrepancy between the position data and the set position data, the nozzle rotation means The nozzle is rotated to align the angular position of the component before mounting. However, even if the angular position accuracy must be increased depending on the component or the mounting pattern on the board, the rotation of the nozzle will increase the accuracy. Because there was no confirmation that the angular alignment was completed beforehand, the product was sometimes installed at a position shifted from the set position on the board. Further, it was not possible to re-correct.

(c) Problems to be Solved by the Invention Accordingly, when it is necessary to improve the angular position accuracy, it is necessary to switch to a correction operation program that repeats rotation correction.

(d) Means for Solving the Problem Therefore, the present invention rotates the take-out nozzle properly using a nozzle rotation device based on the angular position data of the chip-shaped electronic component held in the take-out nozzle recognized by the recognition device. In an automatic electronic component mounting device that has a function of mounting the component on a printed circuit board after correcting the angular position, there is an open mounting system that performs rotation correction only once after the recognition.
A storage device that stores a loop correction operation program and a closed loop correction operation program that causes a difference between an angular position recognized as repeatable rotational correction and the appropriate angular position to fall within a certain tolerance range, and the storage device The present invention is provided with a selection device for selecting one of the programs stored in the computer, and a control device for controlling the correction operation to be performed in accordance with the program selected by the selection device.

Further, the present invention rotates the take-out nozzle with a nozzle rotation device based on the angular position data of the chip-shaped electronic component held in the take-out nozzle recognized by the recognition device, corrects the take-out nozzle to a proper angular position, and then prints. In an electronic component automatic mounting apparatus having a function of mounting the component on a board, an open loop correction operation program that performs rotation correction only once after the recognition, and the angular position recognized as repeatable rotation correction and the appropriate A storage device that stores a closed-loop correction operation program for keeping the difference from the angular position within a certain tolerance range, and a component that is attached to a board with any of the programs stored in the storage device. The present invention is provided with a selection device for selecting each type, and a control device for controlling the correction operation to be performed in accordance with the program selected by the selection device.

Furthermore, the present invention rotates the take-out nozzle with a nozzle rotation device based on the angular position data of the chip-shaped electronic component held in the take-out nozzle recognized by the recognition device, corrects the take-out nozzle to a proper angular position, and then prints. In an electronic component automatic mounting apparatus having a function of mounting the component on a board, an open loop correction operation program that performs rotation correction only once after the recognition, and the angular position recognized as repeatable rotation correction and the appropriate A storage device that stores a closed-loop correction operation program for keeping the difference from the angular position within a certain tolerance range, and a board on which a component is mounted on which one of the programs stored in the storage device is stored. The device is provided with a selection device that selects each time the device is worn, and a control device that controls the correction operation to be performed in accordance with the program selected by the selection device.

(*) Effect From the above configuration, either the open loop correction operation program or the closed loop correction operation program stored in the storage device is selected by the selection device, and the rotation correction is performed according to the selected program by the control device. An action is taken.

Also, the selection device and the open information stored in the storage device
Either a loop correction operation program or a closed loop correction operation program is selected for each type of component, and the rotation correction operation is performed by the control device according to the selected program.

Additionally, the selection device stores the open information stored in the storage device.
Either the loop correction operation program or the closed loop correction operation program is selected each time it is installed on the board,
The rotation correction operation is performed by the control device according to the selected program.

(f) Example Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

(1) is an XY that is moved in the X direction and Y direction by the drive of the
A printed circuit board (5) to which a chip-shaped electronic component (4) (hereinafter referred to as a chip component (4)) is mounted is placed on the table.

(6) is a parts supply table on which a large number of parts supply devices (7) are arranged in parallel, and is guided by a guide (9) by the rotation of a pole screw (8A) driven by a parts supply section servo motor (8). direction (horizontal direction in Figure 1).

(10) is a suction head part (12) as a take-out head part provided with a plurality of suction nozzles (11) as take-out nozzles for taking out and conveying the chip component (4) from the component supply device (7) on the lower surface; A rotating board with many
The rotary disk is intermittently rotated by rotation of the servo motor (13).

Further, a fitting groove (IIA) into which a fitting part (30A) described later is fitted is provided in the upper part of the suction nozzle (11), and a fitting groove (IIA) into which a contact rod (52) which will be described later comes into contact is provided. A contact portion (IIB) is provided.

(1) is a suction station that takes out chip components (4) from a component supply device (7).

(I) recognizes the state of the chip component (4) that has been completely suctioned by the suction nozzle (11) using the recognition bag e (14), and corrects the rotation of the chip component (4) based on the recognition result.
This is a nozzle rotation correction station. In this first nozzle rotation correction station (I[), SOP, QF
Correction is performed for chip components (4) with leads such as P, or chip components (4) with many leads even among those with leads. 4) is handled, and once the correction is completed, it is re-recognized by the recognition device (14), and if the correction is not completed, it is corrected again, and the above operation is continued until the correction is completed (until the error is within the range). (hereinafter referred to as closed-loop correction).

(1) is a leadless chip component such as LCC (4),
At the second nozzle rotation correction station, which performs rotation correction for the chip component (4) with leads but with few leads, correction is performed only once based on the recognition result of the recognition device (14) (hereinafter referred to as open/ (called loop correction)
.

(IV) is the first nozzle rotation correction station (I
f) or a second nozzle rotation correction station (I[
This is a mounting station where the chip component (4) is mounted onto the printed circuit board (5) after the work in step I) is completed.

(V) is a chip component that should not be mounted (V) as a result of recognition by the recognition device (14), for example, the chip component (4) is stuck upright or the chip component (4) being sucked is different. 4) is a discharge station for discharging.

(VI) is a nozzle selection station for selecting a suction nozzle (11) corresponding to the chip component (4) to be suctioned by the suction station (I), and a gear ( The rotation of the drive gear (16) as a nozzle selection means is caused by the rotation of the drive gear servo motor (15) which is moved by a drive system (not shown) and rotated after meshing with the gear. A desired suction nozzle (11) is selected.

(■) indicates the suction nozzle (
11) is an origin positioning station that adjusts the origin position of the suction nozzle (11) in the rotational direction in accordance with the orientation of the chip component (4) at the standby position when the chip component (4) is taken out.

Hereinafter, the recognition device (14) will be explained based on FIG. 2.

(17) is a COD camera that recognizes the state in which the chip component (4) is sucked by the suction nozzle (11), and the recognition device (1
4) The image obtained using the reflection of the two mirrors (19) and (20) installed in the box (18) that is waiting below the chip component (4) that has been transported upward is reflected by the lens. It is recognized through (21).

Next, the first and second nozzle rotation correction stations (I
I) (III) 1st. The second nozzle rotation positioning device (22) (23) will be described in detail. In addition, the same device (
22) and (23) have the same structure, the first nozzle rotation positioning device (22) will be explained using FIG.

(22A) is a first nozzle rotation servo motor as a drive source for rotating the suction nozzle (11) by θ, and is fitted into the bearing body (27) via the coupling (26) on the output shaft (25). Vertical movement means (60) consisting of a nozzle rotating body (28) and a nozzle rotating rod (29) to be described later
) is attached.

The above-mentioned (29) is a nozzle rotation rod that is fitted into the nozzle rotation body 28) and has a nozzle rotation fitting part (30) at the lower end.
1) A pin (32) is provided that protrudes outward. The nozzle rotation fitting part (30) is notched diagonally from both sides toward the lower end so as to fit into the fitting groove (IIA). Further, a locking portion (34) is provided for locking a spring (33) as a cushioning means between the bottom surface of the nozzle rotating body (28), and the locking portion (34)
A swing bar (37) attached via a rond end (36) is locked to a vertically moving lever (35) that is moved up and down by a cam as a drive source (not shown).
The swinging lever (3) follows the vertical movement of the vertically moving lever (35).
7) is swung up and down, the nozzle rotating rod (29
) is moved up and down while being biased by a spring (33).

Further, a ball spline may be used as the vertical movement means (60).

Next, the 3rd position of the nozzle origin positioning station (■)
The nozzle rotation positioning device (24) will be explained.

Note that structures similar to those of the first nozzle rotation positioning device (22) described above are given the same reference numbers, and explanations thereof will be omitted.

The inside of the nozzle rotation fitting part (30A) provided on the nozzle rotation rod (29) has a first cavity (5) as shown in FIG.
0), and a second cavity (51) having a smaller diameter than the first cavity (50) connected thereto is provided.

(52) is the first cavity (50) and the second cavity (51).
) is a contact rod as a braking means that is locked to the stepped part (53) of the fitting part (30A) by its locking part (54) together with the biasing force of the spring (55) in a state where the fitting part (30A) is free from rotation. Then, the tip of the corresponding contact rod (52) extending downward from the lower end of the fitting part (30A) comes into contact with the fitting groove (IIA), causing rotation of the suction nozzle (11) before fitting. to regulate. In addition, when the fitting part (30A) is rotated, the contact rod (52)
The spring (55) of the nozzle rotating rod (29) is located on the upper surface of the first cavity (50) to assist this rotation.
A thrust bearing (61) is provided as a receiver for the spring (55) to prevent the rotational force from being transmitted to the contact rod (52) due to twisting of the spring (55) due to rotation of the nozzle rotating rod (29). There is.

38) in Fig. 6 is an interface, and the rotary disk (38) is an interface.
10), recognition device (14), drive gear (16), first.
Second and third nozzle rotation positioning devices (22) (23)
(24), a counter (62), a notification device (63), etc. are connected, and each of these control elements is program-controlled by a CPU (39) serving as a control device.

(40) is a RAM as a storage device, which stores rotation center position data of each suction nozzle (11) and the recognition device (
14) and the mounting position data (X direction, Y direction, θ direction) of each chip component (4) on the printed circuit board (5), etc. are stored in each predetermined area.

A ROM (64) is a storage device that stores open-loop correction operation program data and closed-loop correction operation program data, and also stores programs related to the mounting operation of the chip component (4).

In addition, since the set position of the rotation center of the suction nozzle (11) may shift due to temperature changes, changes over time, etc., the chip component (4) will not be suctioned once a certain set temperature is exceeded or after a certain period of time has elapsed. Each suction nozzle (1
1) Recognize the f! (14) recognizes the suction nozzle (11).
) and calculate the amount of deviation of the rotation center and calculate the deviation amount as RA.
M (40) may be stored again, or the amount of deviation may be added to the rotation center position data of the suction nozzle (11).

Further, a drive circuit (41) is connected to the CPU (39), and the drive circuit (41) includes the rotary disk servo motor (13), the drive gear servo motor (15), and the first. Second and third nozzle rotation servo motors (22A) (2
3A) (24A), etc. are connected.

Below, one operator will explain the setting operation of whether to perform rotation correction of the suction nozzle (11) by closed-loop correction or open-loop correction (hereinafter referred to as closed/oven switching). Accordingly, closed/oven switching NC data for each type of chip component (4) completely displayed on the screen of a monitor television (not shown) shown in FIG. 7 is completed.

In other words, the chip component (4) with the part number 'RIJ' has leads and has a large number of leads, and the pitch between the leads is also relatively narrow, so it must be mounted with high accuracy on the pattern of the printed circuit board (5). Since rotational correction accuracy is required, the symbol r1 is used to perform closed-loop correction.
”, but the error tolerance is ±1 degree (in the data, ±
10).

Next, the chip component (4) with the part number "RlJ" has no leads and does not require much precision, so the symbol "0." is set to perform open loop correction, and the error tolerance at this time is ±2. degrees (set as ±20 in the data).

Thereafter, the closed/oven switching setting is similarly performed for each type of chip component (4).

Then, the CPU (39) determines the symbol "O1" and performs the respective correction operations.

The operation will be explained in detail below based on the drawings.

First, before performing the installation operation, check the recognition device! (14) recognizes the rotation center position of each suction nozzle (11) (based on a reference point such as the image center of the COD camera (17)), and stores the rotation center position data in RAM (40).
).

Note that the work of recognizing the center position of the suction nozzle (11) involves adsorbing a jig to the suction nozzle (11), rotating this jig with the rotation of the suction nozzle (11), and The provided hole may be recognized by a recognition device (14) at the rotation angle position of the suction nozzle (11), and the rotation center of the suction nozzle (11) may be determined from the recognition result by a calculation device (not shown).

Furthermore, we actually tested the chip component (4) while changing the mounting angle, and determined the mounting position and each suction nozzle (11).
The amount of deviation from the rotation center may be measured and the value may be input into the RAM (40) using an input device.

A component supply section servo motor (8
), the component supply table (6) is moved, and a desired component supply device (7) is placed on standby at the component take-out position.

Then, the suction nozzle (11) picks up the part number 'R' stored in the part supply device (7) at step "1" shown in the mounting program data displayed on the monitor TV shown in FIG.
The chip component (4) of the IJ is moved above, and the suction nozzle (11) sucks the chip component (4).

Next, the recognition device (14) of the first nozzle rotation correction station <II) recognizes the position of the chip component (4) from the image center of the COD camera (17) while it is being attracted to the suction nozzle (11). and its recognized position data (Xi
, Yl, θ1) are stored in the RAM (40).

Of these, the correction operation for the angle data (θ) will be explained.

Incidentally, the recognition angle data (θ1) is, for example, the angle formed by the intersection line formed by extending one side of the image center and a reference end face of the chip component (4).

The mounting angle data (θ1) of the mounting position data stored in the RAM (40) and the recognition angle data (θ
1) by a comparison device (not shown), and if there is a deviation amount, the calculation device calculates the deviation amount (θ1-01) and stores it in the RAM (40), and performs rotation correction. Here, the RIJ chip component (4) is
Closed loop correction is performed based on the data so that the error tolerance range is within ±1 degree (set as ±10 in the data).

Hereinafter, the rotation correction operation in the θ direction of the suction nozzle (11) at the first nozzle rotation correction station (II) will be explained based on the rotation correction operation flowchart of FIG.

First, after the rotary disk (10) stops rotating, the vertically moving lever (35) is lowered by the drive of the cam, the swinging lever lever (37) swings downward, and the nozzle rotation fitting part (3
0) comes into contact with the tapered part of the fitting groove (IIA> provided in the upper part of the suction nozzle (11) while being biased by the spring (33), and then the first nozzle rotation motor (22A)
is rotated by the amount of deviation (θ1-θl), thereby rotating the suction nozzle (11) and aligning the chip component (4). After this alignment correction is completed, the recognition device (14) again recognizes the suction state of the chip component (4), confirms that it has been rotated by the amount of deviation (θ, -01), and confirms that the error after correction is in the RAM ( 40), the rotary disk (10) is rotated again and the suction head (12) is moved to the next station.

Then, the printed circuit board (5) is moved in XY by the XY child table 1) at the suction station (IV), and the chip component (4) is mounted at a predetermined position coordinate (XI, Yl).

Further, the correction work is continued until the error after the correction falls within the permissible range. Of course, there is a possibility that the error will not fall within the allowable range no matter how many times it is repeated, so the number of times to repeat is set, and the counter (62) counts the number of corrections to obtain the set number of times (N times). Make it possible to repeat the correction until it becomes correct.

Note that if the error is not within the allowable range even after repeating the correction N times, the apparatus is abnormally stopped and the operator is notified by the notification device (63).

Next, the chip component (4) that has been determined by the recognition device (14) to not be installed continues to rotate on the rotary disk (10) and is moved to the discharge station (V), where it is discharged. . That is, chip parts (4) that do not fall within the above-mentioned range may be discharged at the discharge station (V) without abnormally stopping the apparatus.

The suction nozzle (11) to be used next at the next nozzle selection station (VI) rotates after the drive gear 6) meshes with a gear (not shown) provided on the suction head (12). The suction head section (12) is rotated as the suction head section (12) is selected.

At the next nozzle origin position alignment station <■), the origin position of the selected suction nozzle (11) is adjusted. Immediately, the suction is performed at the first or second nozzle rotation correction station <II) (III). Since the rotation of the nozzle (11) was corrected according to the amount of deviation, the origin of the rotation direction of the suction nozzle (11), which is the reference when picking up the chip part (4), is different, and the The origin positions must match.

Therefore, the rotation stop position of the third nozzle rotation servo motor (24A) is set, and the nozzle rotation positioning device (24) is driven to align the origin positions of the suction nozzles (11> in the rotational direction. That is, For example, the fitting 1 (30A)
Even if the fitting groove (IIA) and the fitting groove (IIA) intersect, the fitting part (30A) is first lowered while fully rotating, and the contact rod (52) is urged downward by the spring (55).
) comes into contact with the abutted part (IIB) (see Fig. 10),
Then, by pressing the abutted part (IIB) downward, the rotation of the abutting rod (52) by the fitting part (30A) is released, and the fitting part (30A) immediately moves to the abutting rod (52). )
The suction nozzle (11) rotates with the rotation of the mating part (30A) until the mating part (30A) and the mating groove (IIA) are mated by the contact rod (52). The rotation of the fitting part (30A), that is, the rotational force of the nozzle rotating rod (29), is controlled by the thrust bearing cross 1 so that the fitting part (30A) is not rotated.
), but the ball (61B)
) is prevented from being transmitted to the lower part (61C), and the fitting part (30A) has a maximum of 180 [
degree) and until it stops, the directions of the fitting portion (30A) and the fitting groove (IIA) match. Therefore, the fitting part (30A) and the fitted groove (IIA) are connected to the spring (55).
), the fitting part (30A) is fitted while being pressed by the
The suction nozzle (11) is rotated by the rotation of the suction nozzle (11), and at the rotation stop position, the fitting part (30A) and the fitting groove (IIA) can be aligned in the same direction and stopped (see Fig. 11). After stopping, the suction nozzle (11) is always prepared at the origin position.

Incidentally, the origin position is stored in RAM (40), and the calculation device calculates the value and the amount of rotation during the correction, subtracts the value from 180 degrees, and rotates the nozzle by that value. The suction nozzle (11) may be aligned with the origin position by rotating the rotational servo motor (24A) so that the direction of the fitted groove (LIA) matches the direction of the origin position.

Furthermore, the suction nozzle (11
) may be aligned with the origin position.

Next, in step "2" according to the program data, the chip part 4) with part number 1R1 is picked up, the chip part (4) is recognized by the recognition device (14), and the recognition result and mounting angle data (θ , ) and the suction nozzle (1
1) Open loop correction is performed at the second nozzle rotation correction station (III). The allowable error range at this time is ±2 degrees.

First, the recognition device (14) recognizes the adsorbed state of the chip component (4), and if it is necessary to perform correction, the second nozzle rotation positioning of the second nozzle rotation correction station (III) is performed. This is done using the device (23).

The correction work is carried out in the same manner as the first nozzle rotation positioning device (22). Here, the correction is performed at the second nozzle rotation correction station (I[) because only one station (the first Nozzle rotation correction station (■
This is because performing a plurality of operations (recognition and correction operations) in )) takes time, and the correction operations may be performed separately at the first nozzle rotation correction station (It).

Then, the chip component (4) is mounted at a predetermined position coordinate (x,,y,) on the printed circuit board (5).

Thereafter, the work of mounting the chip components (4) is continued in the same manner.

In addition, in the explanation at the time of rotation correction, since the directions of the nozzle rotation fitting part (30) and the fitting groove (11A) are the same as shown in FIG. Although it has been explained that the mating part (30) and the mating groove (IIA) are eccentric by simply moving down (see Fig. 12), the mating will not occur. If the tapered surfaces of the mating part (30) and the mating groove (11A) are in contact with each other on one side, then when the mating part (30) is rotated, the direction of the tapered surface of the mating part (30) will change. Since the fitting groove can be rotated in a direction that coincides with this, the suction nozzle (11) can be rotated in the desired direction.

Therefore, a cylindrical chip component (4
For a directional suction nozzle (IID) in which a V-shaped groove (IIC) for suctioning A) is formed, for example, the fitting groove (IIA) and the 7-shaped groove (IIC) can be set in the same direction. By doing so, the axial direction of the cylindrical chip component (4A) of the component supply device (7) can match the 7-shaped groove (IIC) according to the packaging style of the component (4A), and the 7-shaped groove (IIC) can be Matching groove (I
The stopping direction of IA) becomes the stopping direction of the figure 7 groove (IIC), allowing reliable component suction.

Next, another embodiment of the nozzle rotation positioning device will be described based on FIG. 14.

(42) (43) is the nozzle rotation fitting part (30)
An X-direction linear guide and a Y-direction linear guide provided on the upper part connect the X-direction linear guide (4) to the linear guide locking part (44) provided at the lower end of the nozzle rotating rod (29).
The rail (42A) of 2) is fixed, and the linear guide (
The rail (43A) of the Y-direction linear guide (43) is fixed to the movable block (42B) of the linear guide (42), and the fitting part (3) is fixed to the movable block (43B) of the linear guide (43).
0) is fixed. In addition, the linear guide (42)
(43) has stoppers (45A) (45B) (46A) that restrict the swinging within the fitted groove (IIA).
(the other not shown) are provided respectively.

As a result, when the fitting part (30) is fitted into the fitting groove (IIA), if there is eccentricity etc. between the fitting part (30) and the fitting groove (IIA), the spring (
33), the X and Y direction linear guides (42) and (43) are able to flexibly move in the X''y5 and Y directions, respectively, so that the fitting portion (30) and the fitting groove (IIA
) is eliminated, and the radial load on the suction nozzle (11) is reduced.

Further, the linear guide may be provided in only one direction, and in this case as well, the load in the radial direction applied to the suction nozzle (11) is reduced.

In the above embodiment, the spring (33) as a cushioning means was provided on the fitting part (30) side, but the fitting groove (33) was provided on the fitting part (30) side.
It may be provided on the IIA) side, that is, on the suction nozzle (11) side. In this case, for example, the spring may be inserted into the fitting groove (IIA).
It may be provided between the lower surface of the upper part of the suction nozzle (11) in which the suction nozzle (11) is formed and the upper surface of the suction head section (12).

Further, the above-mentioned brake means may be provided on the suction head section (12) side and brought into contact with the upper part of the suction nozzle (11) to restrict rotation of the suction nozzle (11).

In the above embodiment, closed/oven switching data was provided for each type of chip component (4), but
Another embodiment in which closed/oven switching data is provided for each mounting data will be described below with reference to FIGS. 15 and 16.

Figure 15 shows the chip parts (4) completely displayed on the monitor TV.
) is part data showing the type of parts.

FIG. 16 shows program data in which closed/oven switching data is set for each mounting data.

Based on these data, in step 'IJl' 2J, open loop correction is carried out so that the error tolerance is 2 degrees and ±1 degree 50 minutes, respectively, and in step '3.
The chip components (4), which have been closed-loop corrected so that the angle is 10 minutes, are mounted on the printed circuit board (5) at predetermined position coordinates (x,, y,) (XI, yt), (x-, ys), respectively. do.

Thereafter, the mounting operation continues in the same manner.

In this embodiment, the error tolerance range is set for each chip component (4) (see FIGS. 7 and 15), but the error tolerance range may be set uniformly (for example, ±1 degree).

Furthermore, as shown by the dotted line in FIG. 6, a closed/oven changeover switch (65) may be provided to allow the operator to select at once which rotation correction to perform for all chip components (4). .

(G) Effects of the Invention As described above, the present invention enables the optimum rotation correction program to be selected under any conditions by selecting either the open-loop correction operation program or the closed-loop correction operation program during rotation correction. Rotation correction can be performed.

[Brief explanation of the drawing]

1 and 6 are a plan view and a configuration circuit diagram of an electronic component automatic mounting apparatus to which the present invention is applied, FIG. 2 is a side view of the first nozzle rotation correction station, and FIG. 3 is a side view of the first nozzle rotation correction station. A perspective view of the positioning device, FIG. 4 is a perspective view of the third nozzle rotation positioning device, FIG. 5 is a partially enlarged view of FIG. 4, and FIG. Figure 8 is a diagram showing the closed/oven switching NC data, Figure 8 is a diagram showing the installation program data also displayed on the monitor TV screen, Figure 9 is a diagram showing the rotation correction operation flowchart, Figures 10 and 11 are Figure 12 is a diagram showing the fitting of the fitting part and groove to be fitted, Figure 12 is a diagram showing the eccentric state of the fitting part and groove to be fitted, and Figure 13 is a diagram showing the orientation of a cylindrical chip component. A diagram showing a certain suction nozzle, FIG. 14 is a perspective view of a nozzle rotation positioning device of another embodiment, and FIGS. 15 and 16.
The figure is a diagram showing a display screen of a monitor television showing another example of closed/oven switching setting data. (11) (LID)...Suction nozzle, (14)...
- Recognition device, (22) (23) (24)... 1st. Second. Third nozzle rotation positioning device, (22A) (2
3A) (24A)... 1st. 2nd ° Third nozzle rotation servo motor, (39)... cPU, (4
0)...RAM, (62)...Counter, (
65)...Closed/oven selector switch.

Claims (3)

[Claims] (1) Based on the angular position data of the chip-shaped electronic component held in the take-out nozzle recognized by the recognition device, the take-out nozzle is rotated by the nozzle rotation device and corrected to the appropriate angular position, and then transferred to the printed circuit board. In an electronic component automatic mounting device having a function of mounting the component, an open-loop correction operation program that performs rotation correction only once after the recognition, an angular position recognized as repeatable rotation correction, and the appropriate angular position. a storage device that stores a closed-loop correction operation program that causes the difference between
An automatic electronic component mounting apparatus comprising: a control device for controlling a correction operation according to a program selected by the selection device. (2) Based on the angular position data of the chip-shaped electronic component held in the take-out nozzle recognized by the recognition device, the take-out nozzle is rotated by the nozzle rotation device and corrected to the appropriate angular position, and then transferred to the printed circuit board. In an electronic component automatic mounting device having a function of mounting the component, an open-loop correction operation program that performs rotation correction only once after the recognition, an angular position recognized as repeatable rotation correction, and the appropriate angular position. a storage device that stores a closed-loop correction operation program for keeping the difference between the 1. An automatic electronic component mounting apparatus comprising: a selection device that selects each program, and a control device that controls a correction operation to be performed in accordance with a program selected by the selection device. (3) Based on the angular position data of the chip-shaped electronic component held in the take-out nozzle recognized by the recognition device, the take-out nozzle is rotated by the nozzle rotation device and corrected to the appropriate angular position, and then transferred to the printed circuit board. In an electronic component automatic mounting device having a function of mounting the component, an open-loop correction operation program that performs rotation correction only once after the recognition, an angular position recognized as repeatable rotation correction, and the appropriate angular position. a storage device that stores a closed-loop correction operation program for keeping the difference between the 1. An automatic electronic component mounting apparatus comprising: a selection device that selects each mounting; and a control device that controls a correction operation to be performed in accordance with a program selected by the selection device.