JPH0396041U - - Google Patents

Info

Publication number
JPH0396041U
JPH0396041U JP1990004045U JP404590U JPH0396041U JP H0396041 U JPH0396041 U JP H0396041U JP 1990004045 U JP1990004045 U JP 1990004045U JP 404590 U JP404590 U JP 404590U JP H0396041 U JPH0396041 U JP H0396041U
Authority
JP
Japan
Prior art keywords
inner lead
width
bumps
covered
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990004045U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990004045U priority Critical patent/JPH0396041U/ja
Publication of JPH0396041U publication Critical patent/JPH0396041U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)
JP1990004045U 1990-01-19 1990-01-19 Pending JPH0396041U (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990004045U JPH0396041U (2) 1990-01-19 1990-01-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990004045U JPH0396041U (2) 1990-01-19 1990-01-19

Publications (1)

Publication Number Publication Date
JPH0396041U true JPH0396041U (2) 1991-10-01

Family

ID=31507814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990004045U Pending JPH0396041U (2) 1990-01-19 1990-01-19

Country Status (1)

Country Link
JP (1) JPH0396041U (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002299376A (ja) * 2001-01-23 2002-10-11 Shibaura Mechatronics Corp ボンディング装置及びボンディンク方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002299376A (ja) * 2001-01-23 2002-10-11 Shibaura Mechatronics Corp ボンディング装置及びボンディンク方法

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