JPS5881942U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5881942U
JPS5881942U JP1981177167U JP17716781U JPS5881942U JP S5881942 U JPS5881942 U JP S5881942U JP 1981177167 U JP1981177167 U JP 1981177167U JP 17716781 U JP17716781 U JP 17716781U JP S5881942 U JPS5881942 U JP S5881942U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
package
semiconductor chip
chip
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981177167U
Other languages
English (en)
Inventor
理 石原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1981177167U priority Critical patent/JPS5881942U/ja
Publication of JPS5881942U publication Critical patent/JPS5881942U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の半導体装置に使われたフリップチップボ
ンディング法を示す説明図、第２図は本考案の一実施例
を示す金リボンの断面図である。 図中１は半導体チップ、２はメッキ層、３はパッケージ
、３１は金属ベース、３２はセラミック、３３はメタラ
イズ層、４１は本考案の金リボン、４．２は金リボン本
体、４３は高融点金属、４４は半田層である。図中間−
附号は同一、又は相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体チップをパッケージにフリップチップボンディン
    グす之ものにおいて前記半導体チップと前記パッケージ
    との間に、半田材をコーティングした金リボンを介在さ
    せ、ボンディングすることを特徴とする半導体装置。　
    　　　゛
JP1981177167U 1981-11-27 1981-11-27 半導体装置 Pending JPS5881942U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981177167U JPS5881942U (ja) 1981-11-27 1981-11-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981177167U JPS5881942U (ja) 1981-11-27 1981-11-27 半導体装置

Publications (1)

Publication Number Publication Date
JPS5881942U true JPS5881942U (ja) 1983-06-03

Family

ID=29970804

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981177167U Pending JPS5881942U (ja) 1981-11-27 1981-11-27 半導体装置

Country Status (1)

Country Link
JP (1) JPS5881942U (ja)

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