JPH0397929U - - Google Patents
Info
- Publication number
- JPH0397929U JPH0397929U JP1990006646U JP664690U JPH0397929U JP H0397929 U JPH0397929 U JP H0397929U JP 1990006646 U JP1990006646 U JP 1990006646U JP 664690 U JP664690 U JP 664690U JP H0397929 U JPH0397929 U JP H0397929U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- circuit board
- mounting structure
- view
- spacer member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
Description
第１図は陽極基板にＩＣチツプが実装された蛍
光表示管の正面図、第２図は第１図の−切断
線における断面図、第３図は第２図におけるＩＣ
チツプ付近の拡大図、第４図は第１図の蛍光表示
管においてＩＣチツプを実装する前の陽極基板の
平面図、第５図ａ，ｂは配線の露出面積によつて
ＩＣチツプと陽極基板の間隔が変化することを示
した断面図、第６図は本考案の一実施例を示す要
部断面図である。 １……回路基板としての陽極基板、１２……Ｉ
Ｃチツプ、１３……ハンダバンプ、１４……樹脂
、１５……スペーサ部材。
光表示管の正面図、第２図は第１図の−切断
線における断面図、第３図は第２図におけるＩＣ
チツプ付近の拡大図、第４図は第１図の蛍光表示
管においてＩＣチツプを実装する前の陽極基板の
平面図、第５図ａ，ｂは配線の露出面積によつて
ＩＣチツプと陽極基板の間隔が変化することを示
した断面図、第６図は本考案の一実施例を示す要
部断面図である。 １……回路基板としての陽極基板、１２……Ｉ
Ｃチツプ、１３……ハンダバンプ、１４……樹脂
、１５……スペーサ部材。
Claims (1)
- 【実用新案登録請求の範囲】 ハンダバンプを用いて回路基板の表面にＩＣチ
ツプを実装するＩＣチツプの実装構造において、 回路基板の上面とＩＣチツプの間隔を規制する
スペーサ部材を回路基板とＩＣチツプの間に設け
たことを特徴とするＩＣチツプの実装構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990006646U JPH0397929U (ja) | 1990-01-27 | 1990-01-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990006646U JPH0397929U (ja) | 1990-01-27 | 1990-01-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0397929U true JPH0397929U (ja) | 1991-10-09 |
Family
ID=31510317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990006646U Pending JPH0397929U (ja) | 1990-01-27 | 1990-01-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0397929U (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57173953A (en) * | 1981-04-21 | 1982-10-26 | Seiko Epson Corp | Semiconductor device |
-
1990
- 1990-01-27 JP JP1990006646U patent/JPH0397929U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57173953A (en) * | 1981-04-21 | 1982-10-26 | Seiko Epson Corp | Semiconductor device |