JPH0410346U - - Google Patents

Info

Publication number
JPH0410346U
JPH0410346U JP1990050897U JP5089790U JPH0410346U JP H0410346 U JPH0410346 U JP H0410346U JP 1990050897 U JP1990050897 U JP 1990050897U JP 5089790 U JP5089790 U JP 5089790U JP H0410346 U JPH0410346 U JP H0410346U
Authority
JP
Japan
Prior art keywords
joined
parts
lead frame
inner lead
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990050897U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990050897U priority Critical patent/JPH0410346U/ja
Publication of JPH0410346U publication Critical patent/JPH0410346U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01308—Manufacture or treatment of die-attach connectors using permanent auxiliary members, e.g. using alignment marks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の電子部品用リードフレームの
第１の実施例に係る構成を示す平面図、第２図は
第１図のＢ−Ｂ線に係る断面図、第３図は第１の
実施例の電子部品用リードフレームに半導体素子
が配設された状態を示す断面図、第４図ａ，ｂは
第２の実施例の構成を示す断面図、第５図は第３
の実施例の構成を示す断面図、第６図は従来の技
術に係る電子部品用リードフレームの平面図、第
７図は第６図に係るＡ−Ａ線断面図である。 １１……タブ部、１１ａ，１１ｂ，１１ｃ，１
１ｄ……突起部位、１２……インナーリード部、
１２ａ，１２ｂ……インナーリード、１３……導
電性接着剤、１４……半導体素子、１５ａ，１５
ｂ……配線ワイヤ。

Claims (1)

  1. 【実用新案登録請求の範囲】 少なくとも部品が接合される部品配設部位と、
    インナーリードとを備え、 前記部品配設部位の接合位置の周囲に、接合さ
    れる部品方向に突出した突起部位が設けられるこ
    とを特徴とする電子部品用リードフレーム。
JP1990050897U 1990-05-16 1990-05-16 Pending JPH0410346U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990050897U JPH0410346U (ja) 1990-05-16 1990-05-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990050897U JPH0410346U (ja) 1990-05-16 1990-05-16

Publications (1)

Publication Number Publication Date
JPH0410346U true JPH0410346U (ja) 1992-01-29

Family

ID=31569846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990050897U Pending JPH0410346U (ja) 1990-05-16 1990-05-16

Country Status (1)

Country Link
JP (1) JPH0410346U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54159532U (ja) * 1978-04-27 1979-11-07
WO2013018485A1 (ja) * 2011-08-01 2013-02-07 株式会社三井ハイテック リードフレーム及びリードフレームの製造方法並びにこれを用いた半導体装置
JP2024515156A (ja) * 2021-03-10 2024-04-05 ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト 側壁を有する基板、基板を含むパワー半導体モジュール、および基板の製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54159532U (ja) * 1978-04-27 1979-11-07
WO2013018485A1 (ja) * 2011-08-01 2013-02-07 株式会社三井ハイテック リードフレーム及びリードフレームの製造方法並びにこれを用いた半導体装置
JP2013033822A (ja) * 2011-08-01 2013-02-14 Mitsui High Tec Inc リードフレーム及びリードフレームの製造方法並びにこれを用いた半導体装置
CN103718291A (zh) * 2011-08-01 2014-04-09 株式会社三井高科技 引线框、引线框的制造方法和使用该引线框的半导体装置
JP2024515156A (ja) * 2021-03-10 2024-04-05 ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト 側壁を有する基板、基板を含むパワー半導体モジュール、および基板の製造方法
US12568838B2 (en) 2021-03-10 2026-03-03 Hitachi Energy Ltd Base plate having sidewall, power semiconductor module comprising the base plate and method for producing the base plate

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