JPH03101528U - - Google Patents

Info

Publication number
JPH03101528U
JPH03101528U JP948390U JP948390U JPH03101528U JP H03101528 U JPH03101528 U JP H03101528U JP 948390 U JP948390 U JP 948390U JP 948390 U JP948390 U JP 948390U JP H03101528 U JPH03101528 U JP H03101528U
Authority
JP
Japan
Prior art keywords
bonding position
window hole
semiconductor element
tab tape
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP948390U
Other languages
English (en)
Other versions
JP2525354Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990009483U priority Critical patent/JP2525354Y2/ja
Publication of JPH03101528U publication Critical patent/JPH03101528U/ja
Application granted granted Critical
Publication of JP2525354Y2 publication Critical patent/JP2525354Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係る半導体装置の実施例を示
す断面図（要部拡大図を含む）、第２図は第１図
の要部の拡大平面図である。 １……タブテープ、２……配線基板、３……半
導体素子、４……導通スルーホール、７……封止
材、Ａ……回路基板、Ａ′……ボンデイング位置
。

Claims (1)

    【実用新案登録請求の範囲】
  1. タブテープの半導体素子がボンデイングされる
    ボンデイング位置に窓孔が開孔されてその周りに
    配線基板が積層一体化され、配線基板の配線とタ
    ブテープのリードとを導通スルーホールで電気的
    に接続した回路基板と、前記ボンデイング位置に
    ボンデイングされた半導体素子と、前記窓孔を通
    じて前記ボンデイング位置の表裏両面側に充填さ
    れた封止材とを備えてなる半導体装置。
JP1990009483U 1990-01-31 1990-01-31 半導体装置 Expired - Fee Related JP2525354Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990009483U JP2525354Y2 (ja) 1990-01-31 1990-01-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990009483U JP2525354Y2 (ja) 1990-01-31 1990-01-31 半導体装置

Publications (2)

Publication Number Publication Date
JPH03101528U true JPH03101528U (ja) 1991-10-23
JP2525354Y2 JP2525354Y2 (ja) 1997-02-12

Family

ID=31513083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990009483U Expired - Fee Related JP2525354Y2 (ja) 1990-01-31 1990-01-31 半導体装置

Country Status (1)

Country Link
JP (1) JP2525354Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6867068B2 (en) 1996-10-17 2005-03-15 Seiko Epson Corporation Semiconductor device, method of making the same, circuit board, and film carrier tape

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03129745A (ja) * 1989-10-16 1991-06-03 Sumitomo Bakelite Co Ltd 半導体装置の実装方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03129745A (ja) * 1989-10-16 1991-06-03 Sumitomo Bakelite Co Ltd 半導体装置の実装方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6867068B2 (en) 1996-10-17 2005-03-15 Seiko Epson Corporation Semiconductor device, method of making the same, circuit board, and film carrier tape

Also Published As

Publication number Publication date
JP2525354Y2 (ja) 1997-02-12

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Legal Events

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LAPS Cancellation because of no payment of annual fees