JPH04105302A - Thick film resistor forming method - Google Patents
Thick film resistor forming methodInfo
- Publication number
- JPH04105302A JPH04105302A JP2223092A JP22309290A JPH04105302A JP H04105302 A JPH04105302 A JP H04105302A JP 2223092 A JP2223092 A JP 2223092A JP 22309290 A JP22309290 A JP 22309290A JP H04105302 A JPH04105302 A JP H04105302A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- resistance value
- resistor
- film resistor
- film resistors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は厚膜基板の抵抗体形成の抵抗体混合の簡素化
に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] This invention relates to simplifying the mixing of resistors in the formation of resistors on thick film substrates.
第３図及び第４図は従来の厚膜抵抗の概略図であり、図
において、（１）と（２）は導体パターン、（３）は厚
膜印刷抵抗、（５）は基材である。Figures 3 and 4 are schematic diagrams of conventional thick film resistors, in which (1) and (2) are conductor patterns, (3) is a thick film printed resistor, and (5) is a base material. .
次に必要な抵抗値を得る手段について説明する。Next, the means for obtaining the necessary resistance value will be explained.
第３図において、抵抗値Ｒ（Ω）は次式で与えられる。In FIG. 3, the resistance value R (Ω) is given by the following equation.
Ｒ＝ Ｒｓ Ｘ −・・・・・−・・・・・・・
・・ （式１）ここで、 Ｒｓはシート抵抗値（ａ７ａ
） 、 Ａは抵抗体の長さ、Ｌは抵抗体の幅である一通
常シート抵抗値は １０ Ω／口 、 １００Ω／口
、 ＩＫ Ω／口 、 １０Ｋ Ω／口 、 １
００にΩ／口と不連続な値であるため、その中間の値が
要求される場合には％Ａ／Ｌを変えるか、２種類以上の
シート抵抗を混合する必要がある。ただしＡがある値以
下の場合は端子効果により抵抗値Ｒのばらつきが大きく
なり、また、ＡＸＬつまり抵抗体の面積が小さくなると
許容消費電力も小さくなる。このため形状を小さくシ念
い場合等には混合（ブレンド）Ｋより所定のシート抵抗
を得る方法が用いられている。R= Rs
... (Formula 1) Here, Rs is the sheet resistance value (a7a
), A is the length of the resistor, and L is the width of the resistor. The normal sheet resistance value is 10 Ω/hole, 100 Ω/hole.
, IK Ω/mouth, 10K Ω/mouth, 1
Since the value is discontinuous from 00 to Ω/mm, if a value in between is required, it is necessary to change %A/L or mix two or more types of sheet resistance. However, if A is below a certain value, the variation in resistance value R increases due to the terminal effect, and as AXL, that is, the area of the resistor decreases, allowable power consumption also decreases. For this reason, when it is important to make the shape small, a method of obtaining a predetermined sheet resistance by blending K is used.
従来の厚膜抵抗形成では所定の抵抗値を得るために、印
刷の前に２種以上の抵抗ペーストを混合し、必要なシー
ト抵抗値を作ることが必要でありまた、得られるシート
抵抗値のばらつきを押えることが難かしいなどの問題点
があった。In conventional thick film resistor formation, in order to obtain a predetermined resistance value, it is necessary to mix two or more types of resistor paste before printing to create the required sheet resistance value. There were problems such as difficulty in suppressing variations.
この発明は上記のような問題点を解消するためになされ
たもので、混合工程を行うことなく、所定のシート抵抗
値を得ることを目的とする。This invention was made to solve the above-mentioned problems, and its purpose is to obtain a predetermined sheet resistance value without performing a mixing process.
この発明に係る厚膜抵抗体形成法は、厚膜抵抗体を重ね
て印刷して形成するようにしたものである。The method for forming a thick film resistor according to the present invention is to form thick film resistors by printing them one on top of the other.
この発明における厚膜抵抗体形成法は、厚膜抵抗体を重
ねて形成することにより、必要なシート抵抗値が得られ
る。In the method for forming a thick film resistor according to the present invention, a necessary sheet resistance value can be obtained by stacking thick film resistors.
以下、この発明の一実施例を図について説明する。第１
図、第２図において、（５）はセラミック等の基材、（
１）と（２）は（５）の上に形成された導体パターン、
（８）は（１）と（２）の両方に接触するように形成さ
れた厚膜抵抗体、（４）は（８）の上に形成された厚膜
抵抗体である。An embodiment of the present invention will be described below with reference to the drawings. 1st
In Fig. 2, (5) is a base material such as ceramic, (
1) and (2) are conductor patterns formed on (5),
(8) is a thick film resistor formed so as to be in contact with both (1) and (2), and (4) is a thick film resistor formed on (8).
上記のように構成された厚膜抵抗体形成法の作用を以下
に説明する。あらかじめ形成された導体パターン（１）
（２）上に厚膜抵抗体（８）を形成し、さらに（８＋
の上に厚膜抵抗体（４）を形成する。この場合、合成抵
抗値Ｒｔは次式で得られる。The operation of the thick film resistor forming method configured as described above will be explained below. Pre-formed conductor pattern (1)
(2) A thick film resistor (8) is formed on top of the (8+
A thick film resistor (4) is formed thereon. In this case, the combined resistance value Rt is obtained by the following equation.
Ｒ１３１Ｒ４１
Ｆｔｔ＝−
ＲＣ３１＋ＲＩ４１
・・・・・・・・・・・・ （２）式
Ｒ（３１＝ Ｒｓｔ３１ Ｌ（３１・・・・・・・・
−・・（８）式Ａ（４）
Ｒ１４１＝ Ｒｓｋｌ Ｌ、、 ・・・・・・
・・・・・・ （４）成上式でＲ（３）は厚膜抵抗体（
８）の抵抗値（Ω）、Ｒｓ（３ｉは（３）のシート抵抗
値ｔ Ａｆ３）は（８）の長さ、Ｌ（３）は（８）の
幅であり、Ｒ（４１Ｆｉ厚膜抵抗体（４）の抵抗値（Ω
）、Ｒｓ（４１は（４）のシート抵抗値（Ω／Ｃ：Ｉ
）、Ａ（４）は（４）の長さ、Ｌ（４）は（４）の幅で
ある。上記（２）式、（８）式、（４）式によりＲｓ（
３１ｔ Ｒｓ（４） Ｉ Ａ＋３１ 、 Ａ（４） 、
ｕ３） ｌ ｕ４）を任意に選ぶことにより、自由に
所定の合成抵抗値Ｒｔを得ることが可能となる。R131R41 Ftt=- RC31+RI41 ・・・・・・・・・・・・ (2) Formula R(31= Rst31 L(31・・・・・・・・・
-...(8) Formula A(4) R141=Rskl L,,...
...... (4) In the formation ceremony, R (3) is a thick film resistor (
8) resistance value (Ω), Rs (3i is the sheet resistance value t of (3), Af3) is the length of (8), L (3) is the width of (8), R (41Fi thick film resistor Resistance value (Ω) of body (4)
), Rs (41 is the sheet resistance value (Ω/C:I) of (4)
), A(4) is the length of (4), and L(4) is the width of (4). According to the above equations (2), (8), and (4), Rs(
31t Rs(4) I A+31, A(4),
By arbitrarily selecting u3) l and u4), it becomes possible to freely obtain a predetermined combined resistance value Rt.
なお、上記実施例では厚膜抵抗体を２回形成するものを
示したが、２回以上形成してもよい。In the above embodiment, the thick film resistor is formed twice, but it may be formed twice or more.
また、上記実施例では厚膜抵抗体を重ねて形成する場合
について説明したが、２種類以上の厚膜抵抗坏を並列に
形成しても同様の効果を奏する。Further, in the above embodiments, the case where thick film resistors are formed one on top of the other has been described, but the same effect can be obtained even if two or more types of thick film resistors are formed in parallel.
以上のように、この発明によれば必要な抵抗値を得る之
めに抵抗ペーストの混合（ブレンド）工程を行う必要が
ないため、安価に、また精度の高いものが得られる効果
がある。As described above, according to the present invention, there is no need to perform a mixing (blending) process of resistor paste in order to obtain the required resistance value, so that it is possible to obtain a resistor with high precision at low cost.
第１図はこの発明の一実施例による厚膜抵抗体形成法を
示す上面図、第２図は第１図の断面図である。第３図は
従来の厚膜抵抗体印刷法を示す上面図、第４図は第３図
の断面図である。
図において、 （１）（２）は導体配線、（８）（４）
は厚膜抵抗体、（６）は基材。
なお、図中、同一符号は同一 又は相当部分を示す。FIG. 1 is a top view showing a method for forming a thick film resistor according to an embodiment of the present invention, and FIG. 2 is a sectional view of FIG. 1. FIG. 3 is a top view showing a conventional thick film resistor printing method, and FIG. 4 is a sectional view of FIG. 3. In the figure, (1) (2) are conductor wiring, (8) (4)
(6) is a thick film resistor, and (6) is a base material. In addition, the same symbols in the figures indicate the same or equivalent parts.
Claims (1)
配線基板において、同一抵抗に対して２回又はそれ以上
の印刷を行い、任意の抵抗値を有する厚膜抵抗を形成し
たことを特徴とする厚膜抵抗体形成法。A wiring board made of ceramic or the like as a base material and on which a thick film resistor is printed, characterized in that the same resistor is printed twice or more to form a thick film resistor having an arbitrary resistance value. Thick film resistor formation method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2223092A JPH04105302A (en) | 1990-08-24 | 1990-08-24 | Thick film resistor forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2223092A JPH04105302A (en) | 1990-08-24 | 1990-08-24 | Thick film resistor forming method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04105302A true JPH04105302A (en) | 1992-04-07 |
Family
ID=16792709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2223092A Pending JPH04105302A (en) | 1990-08-24 | 1990-08-24 | Thick film resistor forming method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04105302A (en) |
-
1990
- 1990-08-24 JP JP2223092A patent/JPH04105302A/en active Pending
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