JPH041094A - Ic card - Google Patents

Abstract

PURPOSE:To reduce the transmission degree of bending stress from the other region of a card to the region of an IC module and to protect the IC module by forming a groove part so as to divide the region of the IC module from the other region of the card. CONSTITUTION:The module area of an IC card A is divided by the groove part 6 provided to the base material 3 of the card. This constitution can be formed by the simplest method such that a groove is cut in the homogenous base material 3 of the card. When the card material is made partially thin by the groove part 6, the IC card A is bent along the groove part 6 even when large bending stress acts on the IC card A. As a result, no bending stress is almost transmitted to the IC module area. Further, the groove part 6 is formed to the surface of the card base material 3 but may be formed to the rear thereof. Furthermore, the groove part 6 may be formed by embedding a flexible material different from the card base material 3 in the base material.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC card with an IC module mounted or built therein.

[Conventional technology]

FIG. 5 is a vertical cross-sectional view of a conventional IC card, and the conventional IC card A shown in this figure has an IC in a part of the card base material 3, which is composed of an overcoat 1 and a center core sheet 2. A hole is made for inserting the module 4, and the IC module 4 is bonded with an adhesive 5 so that its surface and the surface of the card base material 3 are substantially flush with each other.

[Problem to be solved by the invention]

In the conventional IC card mentioned above, when carrying the IC card, etc.
When bending force is applied to card A, card base material 3 deforms,
Pressure is applied to the IC module 4.

When pressure is applied to the IC module 4, pressure is applied to the internal IC chip, and the thin and fragile IC chip may be destroyed by this internal pressure. Further, pressure may be applied to a portion of the bonding wire, causing it to break.

This invention solves the problem of IC bending that the conventional products had.
The purpose of the present invention is to solve the problem of module destruction and thereby provide an IC card with excellent bending durability.

[Means to solve the problem]

In an IC card in which an IC module is provided within the card, a groove is formed to separate the IC module area from other areas of the card, and this groove separates the IC module from other areas of the card.
Protects the IC module by reducing the transmission of bending stress to the C module area.

〔Example〕

Embodiments of the present invention will be described below based on the drawings.

Note that the same parts as in the conventional example shown in FIG. 5 are given the same reference numerals, and redundant explanation will be omitted.

FIG. 1 is a longitudinal sectional view of an IC card according to the present invention, and as is clear from this figure, in the present invention, the IC module 4
This area is characterized by being separated from other areas by a groove 6.

FIGS. 2, 3, and 4 are plan views of IC cards showing different embodiments, respectively.

In the first embodiment shown in FIG. 2, a U-shaped groove 6 is formed on the card base 3 outside the IC module 4. As shown in FIG.

Further, in the second embodiment shown in FIG.
A groove 6 is formed so as to surround the entire circumference.

Furthermore, in the third embodiment shown in FIG.
is formed.

As explained above, in the present invention, the module area for the IC card is divided by the groove 6 provided in the card base material 3. In its simplest form, this structure can be formed by digging grooves into the homogeneous card base material 3. If the card material is partially made thinner by the grooves 6, the IC card A will bend along the grooves 6 even when a large bending stress is applied to the card A. As a result, almost no bending stress is transmitted to the IC module area. This can prevent destruction of the IC chip, breakage of the bonding wire, etc.

In each of the above embodiments, the groove portion 6 is formed on the front surface of the card base material 3, but it may be formed on the back surface.

Further, the groove portion 6 may be filled with a flexible material different from that of the card base material 3.

〔Effect of the invention〕

As explained above, in the present invention, a groove is provided to separate the IC module area from other areas, and this groove absorbs bending.
Chip destruction, bonding wire breakage, etc. can be prevented.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal cross-sectional view of the RC card according to the present invention, FIG.
3 and 4 are plan views of rc cards according to each embodiment,
FIG. 5 is a longitudinal sectional view of a conventional IC card. 3...Card base material, 4...IC module, 6...
・Groove. Figure 1 Figure 2, A No Tsuba Figure 3

Claims (1)

[Claims] An IC card in which an IC module is provided in a card base material, characterized in that a groove portion is formed in the card base material to separate an IC module area from other areas.