JPH04131966U - metal core board - Google Patents

Abstract

(57) [Summary] [Purpose] To increase the heat conduction efficiency to a metal core substrate without intervening a heat conduction medium. [Structure] Convex portion 6 that is convex on the side where electronic component 2 is mounted
is provided on the metal core substrate 1 in correspondence with the mounting position of the electronic component 2, so that the case 3 of the mounted electronic component 2 and the metal core substrate 1 are brought into direct contact.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

The present invention relates to a metal core substrate forming a heat conductive cooling means.

0002

[Conventional technology]

FIG. 3 is an explanatory diagram showing a state in which electronic components are mounted using a conventional metal core board. FIG. 3 shows a case where surface-mounted electronic components are used. 20 is a metal core board, and 21 is externally composed of a case 22 and leads 23. An electronic component 24 electrically connects the lead 23 and the printed wiring of the metal core board 20. What is the solder that connects the bottom surface of the case 22 of the electronic component 21 and the surface of the metal core board 20? It is in a non-contact state. In this case, the heat generated by the operation of the electronic component 21 on the metal core substrate 20 is The conduction path is such that the heat 25 generated from the electronic component 21 is transmitted to the lead 23, and the solder 24 to the metal core substrate 20.

0003 Figure 4 shows how pin insertion type electronic components are mounted using a conventional metal core board. It is an explanatory diagram. 26 is a metal core board, and 27 is externally composed of a case 28 and leads 29. An electronic component 30 is a ring of the electronic component 27 inserted into the hole 31 of the metal core board 26. This is solder that electrically connects the board 29 to the metal core board 26 side, and is the solder of the electronic component 27. The bottom surface of the case 28 and the surface of the metal core substrate 26 are in a non-contact state. In this case, the heat generated by the operation of the electronic components 27 on the metal core board 26 is The conduction path is such that the heat 32 generated from the electronic component 27 is transmitted to the lead 29, and the solder 30 to the metal core substrate 26.

0004 Here, FIG. 5 is an explanatory diagram of the main part showing the mounting state of the pin insertion type electronic component. In the case of a pin insertion type electronic component 27 as shown in 4, the shape of the lead 29 is On the 8 side, the width is such that it cannot be inserted into the hole 31 of the metal core board 26. There is a step A, and the tip side is tapered so that it can be inserted into the hole 31. others Therefore, when the electronic component 27 is mounted on the metal core board 26, the bottom surface 28a of the case 28 and A gap B is formed between the metal core substrate 26 and the surface thereof. From this, Figure 6 shows a conventional metal core board with measures to increase heat conduction efficiency. FIG. 2 is an explanatory diagram showing a mounting state of a pin insertion type electronic component using an electronic component 27; In order to efficiently conduct heat to the metal core substrate 26, the bottom surface 28a of the case 28 and the metal A thermally conductive sheet 33 with good thermal conductivity is inserted into the gap B between the electronic part and the core board 26. The heat 32 generated from the product 27 is added to the lead 29 and transmitted through this conductive sheet 33. It is assumed that the metal core substrate 26 is conductive.

[0005]

[Problem that the idea aims to solve]

However, with the conventional technology described above, the heat conduction path of electronic components is The main heat conduction is from the board, and the heat conduction from the case is due to the gap between it and the metal core board. Because of this, air is used as the heat transfer medium, which is inefficient. Therefore, there is a problem that the electronic components cannot be cooled sufficiently. . In addition, a thermal conductive sheet is used as a thermal conductive medium between the electronic component case and the metal core board. By inserting it into the gap between If so, the efficiency of heat conduction will be improved, but it is necessary to insert a heat conductive sheet for each electronic component. In addition, thermally conductive sheets tailored to the shape and size of electronic components are needed. Since this is necessary, there is a problem in that workability becomes extremely poor.

[0006] The idea of this invention is that the heat conduction efficiency is poor because there are few heat conduction paths, The use of a heat conductive medium to increase heat conduction efficiency may result in poor workability. It was developed to solve the problem of heat conduction of electronic components mounted on metal core substrates. Increase the number of paths, thereby eliminating the need for a heat transfer medium and eliminating the work involved. The purpose is to

[0007]

[Means to solve the problem] In order to achieve this purpose, the present invention is designed to prevent electronic components from being exposed outside the case. It is electrically connected to the electronic component through the lead, and the electronic component is The mounted electronics are mounted on a metal core substrate that conducts heat from the A convex portion on the side where electronic components are mounted to conduct heat through contact with the component case. is provided corresponding to the electronic component mounting position.

[0008]

[Effect]

The present invention having the above-described configuration has the following advantages: When electronic components are mounted on a metal core substrate, The metal core board at the mounting point has a convex shape, so the case of the electronic component and the metal core are The substrates are in contact. This allows the heat from the electronic components to be transferred to the electronic component case without going through a heat conduction medium. conducts directly from the metal core substrate to the metal core substrate.

[0009]

【Example】

An embodiment of the present invention will be described below with reference to the drawings. Figure 1 shows a mounting structure for electronic components using a metal core board according to an embodiment of the present invention. In FIG. 1, a surface-mounted electronic component will be used for explanation. 1 is a metal core board, 2 is an electronic component that externally consists of a case 3 and leads 4. , 5 is solder that electrically connects the lead 4 and the printed wiring of the metal core board 1. Ru. The metal core substrate 1 has the bottom surface of the case 3 of the electronic component 2 and the surface of the metal core substrate 1. In order to make direct contact, a convex portion 6 that is convex on the side where the electronic component 2 is mounted is pre-contacted with the electric current. It is formed in accordance with the mounting location of the child component 2. Note that this convex portion 6 is formed by pressing. It is supposed to be formed by a mechanical tool, etc., and once a mold is made, it can be easily formed.

0010 In this case, the heat generated by the operation of the electronic component 2 is transferred to the metal core substrate 1. The conduction path is such that the heat 7 generated from the electronic component 2 is transmitted to the lead 4 through the solder 5. It will be conducted to the metal core substrate 1. Furthermore, since the case 3 is in direct contact with the metal core substrate 1, the heat 7 is transferred to the case 3. is conducted directly from the metal core substrate 1 to the metal core substrate 1.

[0011] FIG. 2 is an explanatory diagram showing the mounting structure of electronic components using the metal core substrate of this example. In FIG. 2, a pin insertion type electronic component will be used for explanation. 8 is a metal core board, 9 is an electronic device which externally consists of a case 10 and leads 11. Component 12 is the lead 11 of the electronic component 9 inserted into the hole 13 of the metal core board 8. This is solder that electrically connects the metal core board 8 to the metal core board 8 side. The metal core substrate 8 includes the bottom surface of the case 10 of the electronic component 9 and the surface of the metal core substrate 8. In order to make direct contact with It is formed in accordance with the mounting location of the electronic component 9. Note that this convex portion 14 is It will be formed by a process such as a non-stick process, and once a mold is made, it can be easily formed. Wear.

0012 In this case, the heat generated by the operation of the electronic components 9 is transferred to the metal core substrate 8. The conduction path is such that heat 15 generated from the electronic component 9 is transmitted to the lead 11 and the solder 12 is It will be conducted to the metal core substrate 8 through the metal core substrate 8. Furthermore, since the case 10 is in direct contact with the metal core board 8, heat 15 is transferred to the case 10. It is conducted directly from the bus 10 to the metal core substrate 8.

[0013]

[Effect of the idea]

As explained above, the present invention is designed to connect the leads protruding from the case of electronic components to the outside. It is electrically connected to electronic components through the The case of mounted electronic components is The convex part is placed on the side where the electronic component is mounted so that it makes contact with the electronic component and conducts heat. When electronic components are mounted on a metal core board, they are provided in accordance with the mounting position. The case of the electronic component and the metal core board are in contact without any intervening thermal conductive medium. becomes. This allows the heat of the electronic components to be conducted directly from the electronic component case to the metal core board. be done.

[0014] Here, when comparing the thermal conductivity between the conventional technology and the present invention, it is found that the conventional technology There is a gap between the core board and the electronic component case, and there is a gap between the core board and the electronic component case. Heat conduction occurs through air to the metal core substrate, but air heat transfer The conductivity is 0.0216 kcal/mh°C. In addition, when a heat conductive sheet is used as a heat conductive medium, the thermal conductivity of the heat conductive sheet is is generally about 2 kcal/mh°C. In contrast, in the case of the present invention, the metal core substrate is made of iron, aluminum, copper, etc. The thermal conductivity of iron is 30kcal/mh℃, and that of aluminum is 190kcal. /mh℃, copper has a thermal conductivity of 332kcal/mh℃, which is higher than that of conventional air or conductive sheets. It can be seen that it is much higher in comparison.

[0015] In this way, a protrusion is provided on the metal core board to connect the electronic component case and the metal core board. By bringing the electronic components into contact with each other, the heat of the electronic components is efficiently transferred to the metal core board. This has the effect of promoting cooling of electronic components. In addition, thermal conductive media such as conductive sheets, which were conventionally required to increase thermal conductivity. Since there is no need to use the board, work efficiency during board assembly can be improved. It has the effect of

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram showing a mounting structure of a surface-mounted electronic component using a metal core substrate according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing a mounting structure of a pin insertion type electronic component using a metal core substrate according to an embodiment of the present invention.

FIG. 3 is an explanatory diagram showing a mounting state of a surface-mount type electronic component using a conventional metal core substrate.

FIG. 4 is an explanatory diagram showing a mounting state of a pin insertion type electronic component using a conventional metal core board.

FIG. 5 is an explanatory diagram of main parts showing a mounting state of a pin insertion type electronic component.

FIG. 6 is an explanatory diagram showing a state in which a pin insertion type electronic component is mounted using a conventional metal core board, which takes measures to increase heat conduction efficiency.

[Explanation of symbols]

1 Metal core substrate 2 Electronic parts 3 cases 4 lead 6 Convex part

Claims (1)

[Scope of utility model registration request] [Claim 1] A metal core board that is electrically connected to an electronic component via a lead extending outside from a case of the electronic component, and that conducts heat from the electronic component to cool the electronic component. A metal core substrate characterized in that a convex portion corresponding to the electronic component mounting position is provided on the electronic component mounting side so as to contact the case of the mounted electronic component and conduct heat conduction. .