JPH04132122A - Electric contact - Google Patents
Electric contactInfo
- Publication number
- JPH04132122A JPH04132122A JP2252505A JP25250590A JPH04132122A JP H04132122 A JPH04132122 A JP H04132122A JP 2252505 A JP2252505 A JP 2252505A JP 25250590 A JP25250590 A JP 25250590A JP H04132122 A JPH04132122 A JP H04132122A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- electrical contact
- contact
- diffusion layer
- plated
- Prior art date
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Abstract
Description
【発明の詳細な説明】
〔概 要〕
不活性ガスと共にガラス管中に封入されてなるリードス
イッチの電気接点に関し、
輪中負荷領域のみならず重負荷領域においても長期間の
使用に耐え、しかも従来の標準型電気接点に比べて安価
な電気接点の提供を目的とし、Fe−Ni系磁性材料か
らなる接点基台とCu−Ni拡散層と表面層からなり、
接点基台上にめっきされたCuとNiを拡散処理してC
u−Ni拡散層が形成され、拡散層上にRhをめっきし
て表面層が形成されてなるように構成する。[Detailed Description of the Invention] [Summary] The electrical contacts of a reed switch are sealed in a glass tube together with an inert gas, and can withstand long-term use not only in the wheel load area but also in the heavy load area. With the aim of providing an electrical contact that is cheaper than conventional standard electrical contacts, it consists of a contact base made of Fe-Ni magnetic material, a Cu-Ni diffusion layer, and a surface layer.
Diffusion treatment of Cu and Ni plated on the contact base
A u-Ni diffusion layer is formed, and a surface layer is formed by plating Rh on the diffusion layer.
本発明は不活性ガスと共にガラス管中に封入されてなる
リードスイッチの電気接点に関する。The present invention relates to an electrical contact for a reed switch sealed in a glass tube together with an inert gas.
リードスイッチは磁性材料からなるリード片とガラス管
からなり、通常ロジウム(Rh)やルテニウム(Ru)
や金(Au)などの貴金属材料が、リード片の先端近傍
にめっきされて電気接点を構成している。A reed switch consists of a reed piece made of magnetic material and a glass tube, and is usually made of rhodium (Rh) or ruthenium (Ru).
A noble metal material such as silver or gold (Au) is plated near the tip of the lead piece to form an electrical contact.
しかしかかる貴金属材料は貴重な資源であり高価である
。そこでリードスイッチの動作特性を低下させることな
く、貴金属材料の使用量を削減できる電気接点の開発が
要望されている。However, such precious metal materials are valuable resources and expensive. Therefore, there is a need for the development of an electrical contact that can reduce the amount of precious metal materials used without degrading the operating characteristics of the reed switch.
第4図は従来の標準型電気接点における層構成を示す側
断面図、第5図は従来の低コスト型電気接点における層
構成を示す側断面図である。FIG. 4 is a side cross-sectional view showing the layer structure of a conventional standard electrical contact, and FIG. 5 is a side cross-sectional view showing the layer structure of a conventional low-cost electrical contact.
従来の標準型電気接点は第4図に示す如(リード片即ち
接点基台lが、鉄(Fe)−ニッケル(Ni)系磁性材
料(パーマロイ)からなり、接点基台l上にIμm程度
のAuをめっきして形成された導電性密着層2と、導電
性密着層2の上に3μm程度のRhをめっきして形成さ
れた表面層3を具えている。A conventional standard electrical contact is shown in Fig. 4 (the lead piece, or contact base l, is made of iron (Fe)-nickel (Ni) based magnetic material (permalloy), and a layer of about I μm is placed on the contact base l. The conductive adhesive layer 2 is formed by plating Au, and the surface layer 3 is formed by plating Rh with a thickness of about 3 μm on the conductive adhesive layer 2.
このように接点基台1の上に3μm程度のRhからなる
表面層3を有する電気接点は、輪中負荷領域のみならず
重負荷領域に対しても長期間の使用に耐えることができ
る。As described above, the electrical contact having the surface layer 3 made of Rh with a thickness of about 3 μm on the contact base 1 can withstand long-term use not only in the ring load area but also in the heavy load area.
一方、高価なRhの使用をさけた従来の低コスト型電気
接点は第5図に示す如く、Fe−Ni系磁性材料からな
る接点基台l上に直接Cu−Ni拡散層4が形成されて
いる。Cu−Ni拡散層4はCuとNiをめっきし拡散
処理することによって得られるが、Cu −Ni拡散層
4はそのまま表面層として使用可能でRh等からなる表
面層3が不要になる。On the other hand, in a conventional low-cost electrical contact that avoids the use of expensive Rh, as shown in FIG. 5, a Cu-Ni diffusion layer 4 is formed directly on a contact base l made of Fe-Ni magnetic material. There is. The Cu--Ni diffusion layer 4 is obtained by plating and diffusing Cu and Ni, but the Cu--Ni diffusion layer 4 can be used as it is as a surface layer, making the surface layer 3 made of Rh or the like unnecessary.
また接点基台1上に直接CuとNiをめっきし拡散処理
すると、CuとNiが接点基台lの内部にまで拡散する
ため導電性密着層2が不要になる。このように表面層3
と導電性密着層2を不要にすることによって電気接点の
製造コストを、従来の標準型電気接点の60%程度に低
減することができる。Furthermore, when Cu and Ni are directly plated and diffused on the contact base 1, the conductive adhesive layer 2 becomes unnecessary because the Cu and Ni diffuse into the interior of the contact base 1. In this way, surface layer 3
By eliminating the need for the conductive adhesive layer 2, the manufacturing cost of the electrical contact can be reduced to about 60% of that of a conventional standard electrical contact.
上述の如〈従来の低コスト型電気接点は標準型電気接点
に比べて安価で、輪中負荷領域においては標準型電気接
点よりも長い期間の使用に耐える。As mentioned above, conventional low-cost electrical contacts are less expensive than standard electrical contacts and last longer than standard electrical contacts in the mid-wheel load area.
しかし、Cu−Ni拡散層を構成するCuやNiはRh
に比べて融点が低いため、放電を伴う重負荷領域では寿
命が極めて短くなるという問題があった。However, Cu and Ni constituting the Cu-Ni diffusion layer are Rh
Since it has a lower melting point than that of , it has a problem that its life is extremely short in heavy load areas that involve electric discharge.
本発明の目的は輪中負荷領域のみならず重負荷領域にお
いても長期間の使用に耐え、しかも従来の標準型電気接
点に比べて安価な電気接、叙を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide an electrical contact that can withstand long-term use not only in the wheel load range but also in the heavy load range, and that is less expensive than conventional standard electrical contacts.
第1図は本発明になる電気接点の原理を示す側断面図で
ある。なお全図を通し同じ対象物は同一記号で表してい
る。FIG. 1 is a side sectional view showing the principle of the electrical contact according to the present invention. The same objects are represented by the same symbols throughout the figures.
上記課題はFe−Ni系磁性材料から□なる接点基台l
とCu−Ni拡散層4と表面層3からなり、接点基台l
上にめっきされたCuとNiを拡散処理してCu−Ni
拡散層4が形成され、拡散層4上にRhをめっきして表
面層3が形成されてなる本発明の電気接点によって達成
される。The above problem is a contact base l made of Fe-Ni magnetic material.
It consists of a Cu-Ni diffusion layer 4 and a surface layer 3, and the contact base l
Cu-Ni is formed by diffusion treatment of Cu and Ni plated on top.
This is achieved by the electrical contact of the present invention in which a diffusion layer 4 is formed and a surface layer 3 is formed by plating Rh on the diffusion layer 4.
第1図において接点基台上にCu−Ni拡散層を形成し
てなる電気接点は、輪中負荷領域では表面層゛が無くて
も長期間の使用に耐え安価である。また拡散層上の表面
層は重負荷領域における特性を改警するためのもので、
例えば2μm以下の極く薄いRh層であってもその目的
を達成可能である。In FIG. 1, the electrical contact formed by forming a Cu--Ni diffusion layer on a contact base can be used for a long period of time and is inexpensive in the in-wheel load region even without a surface layer. In addition, the surface layer on the diffusion layer is intended to improve the characteristics in heavy load areas.
For example, even a very thin Rh layer of 2 μm or less can achieve the purpose.
このようにFe−Ni系磁性材料からなる接点基台とC
u−Ni拡散層と表面層からなり、接点基台上にめっき
されたCuとNiを拡散処理してCu−Ni拡散層が形
成され、拡散層上にRhをめっきして表面層が形成され
てなる本発明の電気接点は、製造コストを従来の標準型
電気接点の80%程度に低減することができる。In this way, the contact base made of Fe-Ni magnetic material and C
Consisting of a u-Ni diffusion layer and a surface layer, the Cu-Ni diffusion layer is formed by diffusion treatment of Cu and Ni plated on the contact base, and the surface layer is formed by plating Rh on the diffusion layer. The electrical contact of the present invention can reduce manufacturing costs to about 80% of conventional standard electrical contacts.
即ち、輪中負荷領域のみならず重負荷領域においても長
期間の使用に耐え、しかも従来の標準型電気接点に比べ
て安価な電気接点を実現することができる。In other words, it is possible to realize an electrical contact that can withstand long-term use not only in the wheel load range but also in the heavy load range, and that is less expensive than conventional standard electrical contacts.
以下添付図により本発明の実施例について説明する。第
2図は本発明の一実施例における層構成を示す側断面図
、第3図は従来の標準型電気接点と一実施例の特性を示
す図である。Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 2 is a side cross-sectional view showing the layer structure in one embodiment of the present invention, and FIG. 3 is a diagram showing the characteristics of a conventional standard electrical contact and one embodiment.
第2図において本発明の一実施例はFe−Ni系磁性材
料からなる接点基台l上に、めっきされたCuとNiを
拡散処理して得たCu−Ni拡散層4が直接形成されて
おり、0.5μm程度の厚さにめつきされたAuからな
る導電性密着層2を介して、Cu−Ni拡散層4の上に
2μm程度のRhからなる表面層3が形成されている。In FIG. 2, one embodiment of the present invention is such that a Cu-Ni diffusion layer 4 obtained by diffusion treatment of plated Cu and Ni is directly formed on a contact base l made of Fe-Ni magnetic material. A surface layer 3 made of Rh and having a thickness of about 2 μm is formed on the Cu--Ni diffusion layer 4 via a conductive adhesion layer 2 made of Au plated to a thickness of about 0.5 μm.
第3図は負荷抵抗に印加された直流lOV O,5Aの
電流を開閉したとき、即ち、放電を伴う重負荷領域にお
ける電気接点の寿命を示しており、図において横軸は電
気接点の開閉回数、縦軸は累積故障率である。従来の標
準型電気接点は破線で示す如く70万回位開閉すると、
それ以降は累積故障率が急増し500万回位の開閉で殆
どが故障するのに対し、上記実施例に示す電気接点は実
線で示す如(500万回位の開閉に耐えることができる
。Figure 3 shows the life of an electrical contact when a DC 1OV O, 5A current applied to a load resistor is switched on and off, that is, in a heavy load region with discharge. , the vertical axis is the cumulative failure rate. Conventional standard electrical contacts open and close approximately 700,000 times, as shown by the broken line.
After that, the cumulative failure rate increases rapidly, and most of the contacts fail after about 5 million times of switching, whereas the electrical contacts shown in the above embodiment can withstand about 5 million times of switching, as shown by the solid line.
このようにFe−Ni系磁性材料からなる接点基台とC
u−Ni拡散層と表面層からなり、接点基台上にめっき
されたCuとNiを拡散処理してCu−Ni拡散層が形
成され、拡散層上にRhをめっきして表面層が形成され
てなる本発明の電気接点によって、輪中負荷領域のみな
らず重負荷領域においても長期間の使用に耐え、しかも
従来の標準型電気接点に比べて安価な電気接点を実現す
ることができる。In this way, the contact base made of Fe-Ni magnetic material and C
Consisting of a u-Ni diffusion layer and a surface layer, the Cu-Ni diffusion layer is formed by diffusion treatment of Cu and Ni plated on the contact base, and the surface layer is formed by plating Rh on the diffusion layer. By means of the electrical contact of the present invention, it is possible to realize an electrical contact that can withstand long-term use not only in the wheel load range but also in the heavy load range, and that is cheaper than conventional standard electrical contacts.
上述の如く本発明によれば輪中負荷領域のみならず重負
荷領域においても長期間の使用に耐え、しかも従来の標
準型電気接点に比べて安価な電気接点を提供することが
できる。As described above, according to the present invention, it is possible to provide an electrical contact that can be used for a long period of time not only in a wheel load range but also in a heavy load range, and is moreover inexpensive compared to conventional standard electrical contacts.
第1図は本発明になる電気接点の原理を示す側断面図、
第2図は本発明の一実施例における層構成を示す側断面
図、
第3図は従来の標準型電気接点と一実施例の特性を示す
図、
第4図は従来の標準型電気接点における層構成を示す側
断面図、
第5図は従来の低コスト型電気接点における層構成を示
す側断面図、
である。図において
■は接点基台、 2は導電性密着層、3は表面層、
4はCu−Ni拡散層、をそれぞれ表す。
第
凹
本発明の一火垢例1〔おける層構成にホ可■り断面国第
2 図
技来の標7型電気桜盾、と−史論例の特性と爪ず間第
3 図Fig. 1 is a side sectional view showing the principle of the electrical contact according to the present invention, Fig. 2 is a side sectional view showing the layer structure in an embodiment of the invention, and Fig. 3 is a conventional standard electrical contact and one implementation. FIG. 4 is a side sectional view showing the layer structure of a conventional standard electrical contact; FIG. 5 is a side sectional view showing the layer structure of a conventional low-cost electrical contact. In the figure, ■ is the contact base, 2 is the conductive adhesive layer, 3 is the surface layer,
4 represents a Cu--Ni diffusion layer, respectively. Concave Example 1 of the Inventive Fire Scaling Example 1 [Possible cross-sectional view of the layer structure in the country No. 2 Figure 7 type electric cherry shield of the past, and the characteristics of the history example and Tsumezuma No. 2
3 diagram
Claims (1)
u−Ni拡散層(4)と表面層(3)からなり、該接点
基台(1)上にめっきされたCuとNiを拡散処理して
該Cu−Ni拡散層(4)が形成され、該拡散層(4)
上にRhをめっきして該表面層(3)が形成されてなる
ことを特徴とする電気接点。 2)接点基台(1)上にめっきされたCuとNiを拡散
処理し形成したCu−Ni拡散層(4)と、表面層(3
)との間に導電性密着層(2)を介在させてなる請求項
1記載の電気接点。[Claims] 1) Contact base (1) made of Fe-Ni magnetic material and C
Consisting of a u-Ni diffusion layer (4) and a surface layer (3), the Cu-Ni diffusion layer (4) is formed by diffusing Cu and Ni plated on the contact base (1), The diffusion layer (4)
An electrical contact characterized in that the surface layer (3) is formed by plating Rh on top. 2) A Cu-Ni diffusion layer (4) formed by diffusing Cu and Ni plated on the contact base (1), and a surface layer (3).
2. The electrical contact according to claim 1, wherein a conductive adhesive layer (2) is interposed between the conductive adhesive layer (2) and the conductive adhesive layer (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2252505A JPH0748329B2 (en) | 1990-09-20 | 1990-09-20 | Electrical contact |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2252505A JPH0748329B2 (en) | 1990-09-20 | 1990-09-20 | Electrical contact |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04132122A true JPH04132122A (en) | 1992-05-06 |
| JPH0748329B2 JPH0748329B2 (en) | 1995-05-24 |
Family
ID=17238311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2252505A Expired - Fee Related JPH0748329B2 (en) | 1990-09-20 | 1990-09-20 | Electrical contact |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0748329B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013258041A (en) * | 2012-06-12 | 2013-12-26 | Oki Sensor Device Corp | Manufacturing method of reed switch and reed switch |
-
1990
- 1990-09-20 JP JP2252505A patent/JPH0748329B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013258041A (en) * | 2012-06-12 | 2013-12-26 | Oki Sensor Device Corp | Manufacturing method of reed switch and reed switch |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0748329B2 (en) | 1995-05-24 |
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