JPH0748329B2 - Electrical contact - Google Patents
Electrical contactInfo
- Publication number
- JPH0748329B2 JPH0748329B2 JP2252505A JP25250590A JPH0748329B2 JP H0748329 B2 JPH0748329 B2 JP H0748329B2 JP 2252505 A JP2252505 A JP 2252505A JP 25250590 A JP25250590 A JP 25250590A JP H0748329 B2 JPH0748329 B2 JP H0748329B2
- Authority
- JP
- Japan
- Prior art keywords
- electrical contact
- layer
- contact
- diffusion layer
- surface layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Contacts (AREA)
Description
【発明の詳細な説明】 〔概要〕 不活性ガスと共にガラス管中に封入されてなるリードス
イッチの電気接点に関し、 軽中負荷領域のみならず重負荷領域においても長期間の
使用に耐え、しかも従来の標準型電気接点に比べて安価
な電気接点の提供を目的とし、 Fe−Ni系磁性材料からなる接点基台とCu−Ni拡散層と表
面層からなり、接点基台上にめっきされたCuとNiを拡散
処理してCu−Ni拡散層が形成され、拡散層上にRhをめっ
きして表面層が形成されてなるように構成する。DETAILED DESCRIPTION OF THE INVENTION [Outline] The present invention relates to an electrical contact of a reed switch sealed in a glass tube together with an inert gas, which can withstand long-term use not only in a light and medium load region but also in a heavy load region. With the aim of providing electrical contacts at a lower cost than the standard type electrical contacts of, the contact base made of Fe-Ni magnetic material, the Cu-Ni diffusion layer, and the surface layer. And Ni are diffused to form a Cu-Ni diffusion layer, and Rh is plated on the diffusion layer to form a surface layer.
本発明は不活性ガスと共にガラス管中に封入されてなる
リードスイッチの電気接点に関する。The present invention relates to an electric contact of a reed switch which is enclosed in a glass tube together with an inert gas.
リードスイッチは磁性材料からなるリード片とガラス管
からなり、通常ロジウム（Rh）やルテニウム（Ru）や金
（Au）などの貴金属材料が、リード片の先端近傍にめっ
きされて電気接点を構成している。しかしかかる貴金属
材料は貴重な資源であり高価である。そこでリードスイ
ッチの動作特性を低下させることなく、貴金属材料の使
用量を削減できる電気接点の開発が要望されている。A reed switch consists of a reed piece made of a magnetic material and a glass tube. Usually, a noble metal material such as rhodium (Rh), ruthenium (Ru) or gold (Au) is plated near the tip of the reed piece to form an electrical contact. ing. However, such precious metal materials are valuable resources and expensive. Therefore, there is a demand for the development of an electrical contact that can reduce the amount of precious metal used without deteriorating the operating characteristics of the reed switch.
第４図は従来の標準型電気接点における層構成を示す側
断面図、第５図は従来の低コスト型電気接点における層
構成を示す側断面図である。FIG. 4 is a side sectional view showing a layer structure in a conventional standard type electric contact, and FIG. 5 is a side sectional view showing a layer structure in a conventional low cost type electric contact.
従来の標準型電気接点は第４図に示す如くリード片即ち
接点基台１が、鉄（Fe）−ニッケル（Ni）系磁性材料
（パーマロイ）からなり、接点基台１上に１μｍ程度の
Auをめっきして形成された導電性密着層２と、導電性密
着層２の上に３μｍ程度のRhをめっきして形成された表
面層３を具えている。このように接点基台１の上に３μ
ｍ程度のRhからなる表面層３を有する電気接点は、軽中
負荷領域のみならず重負荷領域に対しても長期間の使用
に耐えることができる。As shown in FIG. 4, a conventional standard type electrical contact has a lead piece, that is, a contact base 1 made of an iron (Fe) -nickel (Ni) magnetic material (permalloy).
It comprises a conductive adhesion layer 2 formed by plating Au and a surface layer 3 formed by plating Rh of about 3 μm on the conductive adhesion layer 2. In this way, 3μ on the contact base 1
The electrical contact having the surface layer 3 made of Rh of about m can withstand long-term use not only in light and medium load areas but also in heavy load areas.
一方、高価なRhの使用をさけた従来の低コスト型電気接
点は第５図に示す如く、Fe−Ni系磁性材料からなる接点
基台１上に直接Cu−Ni拡散層４が形成されている。Cu−
Ni拡散層４はCuとNiをめっきし拡散処理することによっ
て得られるが、Cu−Ni拡散層４はそのまま表面層として
使用可能でRh等からなる表面層３が不要になる。On the other hand, the conventional low-cost type electric contact avoiding the use of expensive Rh has a Cu-Ni diffusion layer 4 formed directly on the contact base 1 made of Fe-Ni magnetic material as shown in FIG. There is. Cu-
The Ni diffusion layer 4 can be obtained by plating Cu and Ni and performing a diffusion treatment, but the Cu-Ni diffusion layer 4 can be used as it is as a surface layer, and the surface layer 3 made of Rh or the like is unnecessary.
また接点基台１上に直接CuとNiをめっきし拡散処理する
と、CuとNiが接点基台１の内部にまで拡散するため導電
性密着層２が不要になる。このように表面層３と導電性
密着層２を不要にすることによって電気接点の製造コス
トを、従来の標準型電気接点の60％程度に低減すること
ができる。Further, when Cu and Ni are directly plated on the contact base 1 and subjected to a diffusion treatment, Cu and Ni diffuse into the inside of the contact base 1, so that the conductive adhesion layer 2 is not necessary. By eliminating the surface layer 3 and the conductive adhesive layer 2 in this manner, the manufacturing cost of the electrical contact can be reduced to about 60% of the conventional standard type electrical contact.
上述の如く従来の低コスト型電気接点は標準型電気接点
に比べて安価で、軽中負荷領域においては標準型電気接
点よりも長い期間の使用に耐える。しかし、Cu−Ni拡散
層を構成するCuやNiはRhに比べて融点が低いため、放電
を伴う重負荷領域では寿命が極めて短くなるという問題
があった。As described above, the conventional low-cost type electric contact is cheaper than the standard type electric contact and can be used for a longer period than the standard type electric contact in the light and medium load regions. However, since Cu and Ni forming the Cu-Ni diffusion layer have a lower melting point than Rh, there is a problem that the life becomes extremely short in a heavy load region accompanied by discharge.
本発明の目的は軽中負荷領域のみならず重負荷領域にお
いても長期間の使用に耐え、しかも従来の標準型電気接
点に比べて安価な電気接点を提供することにある。An object of the present invention is to provide an electrical contact that can be used for a long period of time not only in a light and medium load region but also in a heavy load region, and that is cheaper than a conventional standard type electrical contact.
第１図は本発明になる電気接点の原理を示す側断面図で
ある。なお全図を通し同じ対象物は同一記号で表してい
る。FIG. 1 is a side sectional view showing the principle of the electrical contact according to the present invention. Note that the same object is denoted by the same symbol throughout the drawings.
上記課題はFe−Ni系磁性材料からなる接点基台１とCu−
Ni拡散層４と表面層３からなり、接点基台１上にめっき
されたCuとNiを拡散処理してCu−Ni拡散層４が形成さ
れ、拡散層４上にRhをめっきして表面層３が形成されて
なる本発明の電気接点によって達成される。The above problems are the contact base 1 made of Fe-Ni magnetic material and Cu-
It consists of a Ni diffusion layer 4 and a surface layer 3. Cu and Ni plated on the contact base 1 are diffused to form a Cu-Ni diffusion layer 4, and Rh is plated on the diffusion layer 4 to form a surface layer. This is achieved by the electrical contacts of the present invention in which 3 is formed.
第１図において接点基台上にCu−Ni拡散層を形成してな
る電気接点は、軽中負荷領域では表面層が無くても長期
間の使用に耐え安価である。また拡散層上の表面層は重
負荷領域における特性を改善するためのもので、例えば
２μｍ以下の極く薄いRh層であってもその目的を達成可
能である。In FIG. 1, the electrical contact formed by forming a Cu-Ni diffusion layer on the contact base is durable in the light and medium load region without a surface layer and can be used for a long time and is inexpensive. The surface layer on the diffusion layer is for improving the characteristics in the heavy load region, and the object can be achieved even with an extremely thin Rh layer having a thickness of 2 μm or less, for example.
このようにFe−Ni系磁性材料からなる接点基台とCu−Ni
拡散層と表面層からなり、接点基台上にめっきされたCu
とNiを拡散処理してCu−Ni拡散層が形成され、拡散層上
にRhをめっきして表面層が形成されてなる本発明の電気
接点は、製造コストを従来の標準型電気接点の80％程度
に低減することができる。Thus, the contact base made of Fe-Ni magnetic material and Cu-Ni
Cu consisting of a diffusion layer and a surface layer, plated on the contact base
And Ni are diffused to form a Cu-Ni diffusion layer, and the surface layer is formed by plating Rh on the diffusion layer, and the manufacturing cost is 80% of that of a conventional standard type electrical contact. % Can be reduced.
即ち、軽中負荷領域のみならず重負荷領域においても長
期間の使用に耐え、しかも従来の標準型電気接点に比べ
て安価な電気接点を実現することができる。That is, it is possible to realize an electrical contact that can withstand long-term use not only in the light-medium load region but also in the heavy load region, and that is cheaper than the conventional standard type electrical contact.
以下添付図により本発明の実施例について説明する。第
２図は本発明の一実施例における層構成を示す側断面
図、第３図は従来の標準型電気接点と一実施例の特性を
示す図である。An embodiment of the present invention will be described below with reference to the accompanying drawings. FIG. 2 is a side sectional view showing a layer structure in one embodiment of the present invention, and FIG. 3 is a view showing characteristics of a conventional standard type electrical contact and one embodiment.
第２図において本発明の一実施例はFe−Ni系磁性材料か
らなる接点基台１上に、めっきされたCuとNiを拡散処理
して得たCu−Ni拡散層４が直接形成されており、0.5μ
ｍ程度の厚さにめっきされたAuからなる導電性密着層２
を介して、Cu−Ni拡散層４の上に２μｍ程度のRhからな
る表面層３が形成されている。Referring to FIG. 2, in one embodiment of the present invention, a Cu-Ni diffusion layer 4 obtained by diffusing plated Cu and Ni is directly formed on a contact base 1 made of an Fe-Ni magnetic material. Cage, 0.5μ
Conductive adhesion layer 2 made of Au plated to a thickness of about m
The surface layer 3 made of Rh having a thickness of about 2 μm is formed on the Cu—Ni diffusion layer 4 via the via.
第３図は負荷抵抗に印加された直流10V0.5Aの電流を開
閉したとき、即ち、放電を伴う重負荷領域における電気
接点の寿命を示しており、図において横軸は電気接点の
開閉回数、縦軸は累積故障率である。従来の標準型電気
接点は破線で示す如く70万回開閉すると、それ以降は累
積故障率が急増し500万回位の開閉で殆どが故障するの
に対し、上記実施例に示す電気接点は実線で示す如く50
0万回位の開閉に耐えることができる。Fig. 3 shows the life of the electrical contacts when a current of 10V0.5A applied to the load resistance is opened / closed, that is, in the heavy load area accompanied by discharge. The vertical axis is the cumulative failure rate. When the conventional standard type electrical contact opens and closes 700,000 times as shown by the broken line, the cumulative failure rate increases sharply thereafter, and most of the failures occur at the opening and closing of about 5 million times, whereas the electrical contact shown in the above embodiment is a solid line. As shown in 50
Can withstand opening and closing about 0,000 times.
このようにFe−Ni系磁性材料からなる接点基台とCu−Ni
拡散層と表面層からなり、接点基台上にめっきされたCu
とNiを拡散処理してCu−Ni拡散層が形成され、拡散層上
にRhをめっきして表面層が形成されてなる本発明の電気
接点によって、軽中負荷領域のみならず重負荷領域にお
いても長期間の使用に耐え、しかも従来の標準型電気接
点に比べて安価な電気接点を実現することができる。Thus, the contact base made of Fe-Ni magnetic material and Cu-Ni
Cu consisting of a diffusion layer and a surface layer, plated on the contact base
Cu-Ni diffusion layer is formed by diffusion treatment of Ni and Ni, and by the electrical contact of the present invention in which a surface layer is formed by plating Rh on the diffusion layer, not only in the light / medium load region but also in the heavy load region. It is possible to realize an electrical contact that can withstand long-term use and is cheaper than the conventional standard type electrical contact.
上述の如く本発明によれば軽中負荷領域のみならず重負
荷領域においても長期間の使用に耐え、しかも従来の標
準型電気接点に比べて安価な電気接点を提供することが
できる。As described above, according to the present invention, it is possible to provide an electrical contact that can be used for a long period of time not only in the light and medium load region but also in the heavy load region, and is cheaper than the conventional standard type electrical contact.
第１図は本発明になる電気接点の原理を示す側断面図、 第２図は本発明の一実施例における層構成を示す側断面
図、 第３図は従来の標準型電気接点と一実施例の特性を示す
図、 第４図は従来の標準型電気接点における層構成を示す側
断面図、 第５図は従来の低コスト型電気接点における層構成を示
す側断面図、 である。図において １は接点基台、２は導電性密着層、３は表面層、４はCu
−Ni拡散層、 をそれぞれ表す。FIG. 1 is a side sectional view showing the principle of an electric contact according to the present invention, FIG. 2 is a side sectional view showing a layer structure in an embodiment of the present invention, and FIG. 3 is an embodiment with a conventional standard type electric contact. FIG. 4 is a side sectional view showing a layer structure of a conventional standard type electric contact, and FIG. 5 is a side sectional view showing a layer structure of a conventional low cost type electric contact. In the figure, 1 is a contact base, 2 is a conductive adhesion layer, 3 is a surface layer, and 4 is Cu.
-Ni diffusion layer, respectively.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 馬場 正典 神奈川県川崎市中原区上小田中1015番地 富士通株式会社内 (72)発明者 荻原 春幸 神奈川県川崎市中原区上小田中1015番地 富士通株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Masanori Baba, 1015 Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture, Fujitsu Limited (72) Inventor Haruyuki Ogihara, 1015, Kamedotachu, Nakahara-ku, Kawasaki City, Kanagawa Prefecture, Fujitsu Limited
Claims (2)
とCu−Ni拡散層（４）と表面層（３）からなり、 該接点基台（１）上にめっきされたCuとNiを拡散処理し
て該Cu−Ni拡散層（４）が形成され、 該拡散層（４）上にRhをめっきして該表面層（３）が形
成されてなることを特徴とする電気接点。1. A contact base (1) made of an Fe-Ni magnetic material.
And a Cu-Ni diffusion layer (4) and a surface layer (3). The Cu-Ni diffusion layer (4) is formed by diffusing Cu and Ni plated on the contact base (1). An electric contact characterized in that the surface layer (3) is formed by plating Rh on the diffusion layer (4).
拡散処理し形成したCu−Ni拡散層（４）と、表面層
（３）との間に導電性密着層（２）を介在させてなる請
求項１記載の電気接点。2. A conductive adhesion layer (2) is provided between a surface layer (3) and a Cu-Ni diffusion layer (4) formed by diffusing Cu and Ni plated on a contact base (1). 2. The electrical contact according to claim 1, wherein
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2252505A JPH0748329B2 (en) | 1990-09-20 | 1990-09-20 | Electrical contact |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2252505A JPH0748329B2 (en) | 1990-09-20 | 1990-09-20 | Electrical contact |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04132122A JPH04132122A (en) | 1992-05-06 |
| JPH0748329B2 true JPH0748329B2 (en) | 1995-05-24 |
Family
ID=17238311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2252505A Expired - Fee Related JPH0748329B2 (en) | 1990-09-20 | 1990-09-20 | Electrical contact |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0748329B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5968093B2 (en) * | 2012-06-12 | 2016-08-10 | 株式会社沖センサデバイス | Reed switch manufacturing method and reed switch |
-
1990
- 1990-09-20 JP JP2252505A patent/JPH0748329B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04132122A (en) | 1992-05-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR19980033263A (en) | Terminal materials and terminals | |
| US2812406A (en) | Electrical contact | |
| JPS6154119A (en) | Small-sized switch | |
| JPH0748329B2 (en) | Electrical contact | |
| US3596030A (en) | Composite electric element of silver-cadmium oxide alloy contact | |
| JPS6059687B2 (en) | Silver, palladium alloy spatter contacts | |
| GB1473249A (en) | Electrical switching contacts | |
| JPH05159656A (en) | Reed switch | |
| JPS5942066B2 (en) | Rhenium-cobalt alloy contacts | |
| JPS6347089B2 (en) | ||
| JPS6326908A (en) | Lead switch | |
| JPH0514367B2 (en) | ||
| JPH0323623Y2 (en) | ||
| JPH0327311Y2 (en) | ||
| JPS6012620A (en) | Method of producing contact | |
| JPH0570247B2 (en) | ||
| JPH0548333Y2 (en) | ||
| JPH0480486B2 (en) | ||
| JPH01260721A (en) | Electric contact | |
| JPS5810338A (en) | Method of producing lead piece for lead switch | |
| JPS5848969B2 (en) | electrical contacts | |
| JPH06223696A (en) | Contact structure of electromagnetic relay | |
| JPS6312332B2 (en) | ||
| JPS607020A (en) | Method of producing electric contactor | |
| JPS6310415A (en) | Electric contact element |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080524 Year of fee payment: 13 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090524 Year of fee payment: 14 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090524 Year of fee payment: 14 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100524 Year of fee payment: 15 |
|
| LAPS | Cancellation because of no payment of annual fees |