JPH0413877B2 - - Google Patents

Info

Publication number
JPH0413877B2
JPH0413877B2 JP31293487A JP31293487A JPH0413877B2 JP H0413877 B2 JPH0413877 B2 JP H0413877B2 JP 31293487 A JP31293487 A JP 31293487A JP 31293487 A JP31293487 A JP 31293487A JP H0413877 B2 JPH0413877 B2 JP H0413877B2
Authority
JP
Japan
Prior art keywords
plating
silane coupling
coupling agent
coating
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP31293487A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63283096A (ja
Inventor
Minoru Tsuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of JPS63283096A publication Critical patent/JPS63283096A/ja
Publication of JPH0413877B2 publication Critical patent/JPH0413877B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP31293487A 1986-12-10 1987-12-09 樹脂組成物 Granted JPS63283096A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP29437386 1986-12-10
JP61-294373 1986-12-10

Publications (2)

Publication Number Publication Date
JPS63283096A JPS63283096A (ja) 1988-11-18
JPH0413877B2 true JPH0413877B2 (cs) 1992-03-11

Family

ID=17806875

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31293487A Granted JPS63283096A (ja) 1986-12-10 1987-12-09 樹脂組成物

Country Status (1)

Country Link
JP (1) JPS63283096A (cs)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19930782A1 (de) * 1999-07-03 2001-01-04 Bosch Gmbh Robert Verfahren zum selektiven Beschichten keramischer Oberflächenbereiche
US7631798B1 (en) * 2008-10-02 2009-12-15 Ernest Long Method for enhancing the solderability of a surface

Also Published As

Publication number Publication date
JPS63283096A (ja) 1988-11-18

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