JPH0414930Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a semiconductor opener device.

[Conventional technology]

2. Description of the Related Art Conventionally, when analyzing semiconductor (I/C) defects or performing quality checks, a method has been used to expose the chip by applying a dissolving solution, such as heated hot sulfuric acid, to the semiconductor package.

A semiconductor package is placed and set on an etch plate of an opener device, and the solution is sprayed from a spray nozzle and hits the package.

[Problem that the invention attempts to solve]

In such an apparatus, the setting portion of the etch plate on which the semiconductor package is placed and set is formed in a shape corresponding to the shape of the semiconductor package,
Correctly positioned and sealed. This prevents the solution injected from below from scattering all around.

In this case, if the shape of the semiconductor package is different, the setting portion of the etch plate will not be able to match, resulting in problems such as seal leakage during injection. Semiconductor packages are now manufactured in various shapes depending on their function and purpose of use. Therefore, in order to accommodate various semiconductor packages, it is conceivable to prepare a plurality of opener devices, for example, but this requires a large investment in equipment, which is not desirable in terms of cost.

Therefore, the object of this invention is to provide a semiconductor opener device that has versatility and can be used with various semiconductor packages.

[Means to solve the problem]

In order to achieve the above object, the present invention provides an opener device that sprays a solution from a spray nozzle onto a semiconductor package set on an etching block to expose the chip, and the etching block is provided with a setting section. An etching block cover is attached, and an etching plate having a package positioning portion that can correspond to the shape of the semiconductor package is detachably attached to and supported on the setting portion of the cover.

[Effect]

In such an opener device, the semiconductor package is correctly positioned and placed by setting it in the package positioning section.

Next, if the semiconductor package is different,
An etching plate having a positioning portion having the same shape as the package is attached to the setting portion of the etching block cover. This makes it possible to handle various semiconductor packages by replacing the etch plate.

〔Example〕

Hereinafter, one embodiment of this invention will be described in detail with reference to the drawings of FIGS. 1 to 10.

In the figure, 1 indicates the body of the opener device 3. In addition to the semiconductor opening 5, the fuselage 1 includes a storage tank section 7 that stores sulfuric acid, a preheater section 9 that heats the sulfuric acid sent from the tank section 7 to about 250°C, and a preheater section 9 that heats the sulfuric acid sent from the tank section 7 to about 250°C. A waste liquid cooling section 11 that cools the heated sulfuric acid that has been heated to approximately 100°C using a cooling fan, and a waste liquid tank section 1 that temporarily stores the waste liquid.
3 are arranged.

The semiconductor opening 5 is formed by an etching block 15 and a casing 17 disposed below the block 15.
and a pump device 19 disposed within the casing 17.

The casing 17 is made of a material that is magnetically permeable and heat-resistant and acid-resistant, and serves as a storage tank in which a predetermined amount of sulfuric acid is stored. The casing 17 has a preheating heater section 9.
An intake port 23 that continues to the sulfuric acid storage tank 7 via the sulfuric acid storage tank 7 and an outlet port 25 that continues to the waste liquid storage tank section 13 via the waste liquid cooling section 11 are provided.

The sulfuric acid in the casing 17 fed through the intake port 23 is heated to approximately
Raised to 290℃. Note that the power supply section of the heater is managed and controlled by a temperature sensor (not shown) so that the temperature of the sulfuric acid is approximately 290°C.

A drive motor 27 is located at the bottom of the casing 17.
A rotating magnet 31 is mounted and supported on the output shaft 29 of the motor. Further, an impeller 33 is disposed facing the magnet 31 and having a magnet 33a embedded within the casing 17.

The impeller 33 is rotated by the magnetic force of the rotating magnet 31 and is made of a heat-resistant and acid-resistant synthetic resin material.

The upper part of the main body of the impeller 33 is a conical part 37, and the blade plate 4 is formed in a radial direction from a convex part 39 in the center part.
1 is provided.

The vane plate 41 is shaped to send upward the sulfuric acid taken in from an intake port (not shown) provided at the bottom of the guide case 35 when it rotates. The guide case 35 is made of a material that allows magnetic force to pass through, and the impeller 3
3, and the injection nozzle 4 at the tip
3 is desired below the etching block 15.

A through hole 45 is provided in the etching block 15 from which the tip of the injection nozzle 43 is visible, and an etching block cover 47 is fixed to the block 45.

A ring-shaped set portion 49 is formed on the upper surface of the etch block cover 47, and an opening 51 corresponding to the through hole 45 is provided in the center portion.

A separately formed etching plate 53 is detachably attached to the setting portion 49 of the etching block cover 47.

The etch plate 53 is formed into a disk shape, and a package positioning portion 55 having the same shape as a semiconductor package is provided at a position corresponding to the opening 51 of the etch block cover 47.

A plurality of etch plates 53 are prepared, and the package positioning portion 55 of each etch plate 53 has a shape corresponding to the shape of various semiconductor packages.

Note that 57 indicates a cover that can be opened and closed using the hinge 59 as a fulcrum. A holder 61 for holding the semiconductor is provided inside.

In the opener device constructed in this manner, a semiconductor package is set in the package positioning portion 55 of the etch plate 53 and a dissolving solution is injected from the injection nozzle 43, thereby dissolving the semiconductor package and exposing the chip.

Next, if the semiconductor package is different,
By removing the previously used etch plate 53 and installing a new etch plate 53 in the setting section 49, it is possible to adapt to different semiconductor packages. In this case, the semiconductor package is correctly positioned and no seal leakage occurs. Further, the opener device only requires preparing various types of plates 53.

[Effect of idea]

As explained above, the semiconductor opener device of this invention can be used for various semiconductor packages simply by preparing various types of etch plates. Moreover, since the package can be positioned reliably, seal leaks will not occur.

[Brief explanation of the drawing]

Fig. 1 is a partially sectional side view of the main parts of a semiconductor opener device embodying this invention, Fig. 2 is a plan view of the etching block cover, and Fig. 3 is the same as that shown in Fig. 2.
4 is a bottom view of the same as above, FIG. 5 is a plan view of the etching plate, FIG. 6 is a sectional view taken along the - line of FIG. 5, FIG. 7 is a plan view of another etching plate, and FIG. 8 7 is a sectional view taken along the - line in FIG. 7, FIG. 9 is a schematic partial sectional view of the entire structure, and FIG. 10 is a schematic plan view of the same. Explanation of main drawing symbols: 15... Etch block, 43... Injection nozzle, 47... Etch block cover, 49... Set portion, 53... Etch plate.

Claims (1)

[Scope of utility model registration request] In an opener device that sprays a dissolving solution from a spray nozzle onto a semiconductor package set on an etch block to expose the chip, an etch block cover having a set portion is attached to the etch block, and the set portion of the cover is provided with: A semiconductor opener device is characterized in that an etching plate is removably mounted and supported and has a package positioning part that can correspond to the shape of a semiconductor package.