JPH0415248U - - Google Patents

Info

Publication number
JPH0415248U
JPH0415248U JP1990054745U JP5474590U JPH0415248U JP H0415248 U JPH0415248 U JP H0415248U JP 1990054745 U JP1990054745 U JP 1990054745U JP 5474590 U JP5474590 U JP 5474590U JP H0415248 U JPH0415248 U JP H0415248U
Authority
JP
Japan
Prior art keywords
lead frame
lead
semiconductor element
optical semiconductor
header
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990054745U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990054745U priority Critical patent/JPH0415248U/ja
Publication of JPH0415248U publication Critical patent/JPH0415248U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示すリードフレー
ムの斜視図、第２図は同じくその要部側面図、第
３図は同じくその凹凸の表面粗さを示す図、第４
図は第１１図に示す先行技術のリードフレームの
凹凸の表面粗さを示す図、第５図は従来のリード
フレームの表面粗さを示す図、第６図は本考案の
リードフレームの接着強度を示す図、第７図は従
来のリードフレームの接着強度を示す図、第８図
は本考案のリードフレームその引張り強度を示す
図、第９図は従来のリードフレームの引張り強度
を示す図、第１０図は従来のリードフレームの斜
視図、第１１図は先行技術のリードフレームの斜
視図、第１２図は光結合装置の断面図、第１３図
は同じくその斜視図である。 ２０……光半導体素子、２６……ヘツダー部、
２７，２９……リード部、２７ａ，２９ａ……接
触面、３０……凹凸。

Claims (1)

    【実用新案登録請求の範囲】
  1. 光半導体素子が搭載されるヘツダー部と、外部
    と入出力するリード部とを備え、前記ヘツダー部
    に光半導体素子が搭載された後、熱膨張係数の異
    なるモールド樹脂により二重モールドされるリー
    ドフレームにおいて、前記リード部のモールド樹
    脂との接触面と、前記ヘツダー部とに凹凸が設け
    られたことを特徴とするリードフレーム。
JP1990054745U 1990-05-25 1990-05-25 Pending JPH0415248U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990054745U JPH0415248U (ja) 1990-05-25 1990-05-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990054745U JPH0415248U (ja) 1990-05-25 1990-05-25

Publications (1)

Publication Number Publication Date
JPH0415248U true JPH0415248U (ja) 1992-02-06

Family

ID=31577083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990054745U Pending JPH0415248U (ja) 1990-05-25 1990-05-25

Country Status (1)

Country Link
JP (1) JPH0415248U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6849930B2 (en) 2000-08-31 2005-02-01 Nec Corporation Semiconductor device with uneven metal plate to improve adhesion to molding compound
EP2574441A1 (en) 2011-09-28 2013-04-03 Hitachi Automotive Systems, Ltd. Composite molded body of metal member and molded resin member, and surface processing method of metal member

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6849930B2 (en) 2000-08-31 2005-02-01 Nec Corporation Semiconductor device with uneven metal plate to improve adhesion to molding compound
EP2574441A1 (en) 2011-09-28 2013-04-03 Hitachi Automotive Systems, Ltd. Composite molded body of metal member and molded resin member, and surface processing method of metal member

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