JPH0415262U - - Google Patents
Info
- Publication number
- JPH0415262U JPH0415262U JP5504790U JP5504790U JPH0415262U JP H0415262 U JPH0415262 U JP H0415262U JP 5504790 U JP5504790 U JP 5504790U JP 5504790 U JP5504790 U JP 5504790U JP H0415262 U JPH0415262 U JP H0415262U
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- thickness
- ceramic substrate
- integrated circuit
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Description
第１図はこの考案の実施例の要部を示す縦断面
図、第２図はこの考案を得る途中の段階で考えら
れたＨＩＣの要部を示す縦断面図、第３図は第２
図の印刷抵抗体３の平面図、第４図は従来のＨＩ
Ｃの要部を示す縦断面図である。
図、第２図はこの考案を得る途中の段階で考えら
れたＨＩＣの要部を示す縦断面図、第３図は第２
図の印刷抵抗体３の平面図、第４図は従来のＨＩ
Ｃの要部を示す縦断面図である。
Claims (1)
- 【実用新案登録請求の範囲】 スルホールセラミツク基板の一方の面に回路部
品が実装され、他方の面に印刷抵抗体が形成され
た混成集積回路において、 絶縁体層が上記スルホールセラミツク基板の他
方の面に上記印刷抵抗体及びその近傍を除いて形
成され、 その絶縁体層の厚味は上記印刷抵抗体の厚味よ
り大きく設定され、 その絶縁体層の表面がパツケージへ接着固定す
る場合の接合面とされることを特徴とする、 混成集積回路。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5504790U JPH0415262U (ja) | 1990-05-25 | 1990-05-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5504790U JPH0415262U (ja) | 1990-05-25 | 1990-05-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0415262U true JPH0415262U (ja) | 1992-02-06 |
Family
ID=31577652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5504790U Pending JPH0415262U (ja) | 1990-05-25 | 1990-05-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415262U (ja) |
-
1990
- 1990-05-25 JP JP5504790U patent/JPH0415262U/ja active Pending