JPH0415621B2 - - Google Patents

Info

Publication number
JPH0415621B2
JPH0415621B2 JP60297795A JP29779585A JPH0415621B2 JP H0415621 B2 JPH0415621 B2 JP H0415621B2 JP 60297795 A JP60297795 A JP 60297795A JP 29779585 A JP29779585 A JP 29779585A JP H0415621 B2 JPH0415621 B2 JP H0415621B2
Authority
JP
Japan
Prior art keywords
mold
resin
gate
semiconductor device
young
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60297795A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62152131A (ja
Inventor
Susumu Ueno
Masaru Kaneda
Shinichi Shimizu
Tetsuo Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin-Etsu Chemical Co Ltd
Original Assignee
Shin-Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin-Etsu Chemical Co Ltd filed Critical Shin-Etsu Chemical Co Ltd
Priority to JP60297795A priority Critical patent/JPS62152131A/ja
Publication of JPS62152131A publication Critical patent/JPS62152131A/ja
Publication of JPH0415621B2 publication Critical patent/JPH0415621B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP60297795A 1985-12-25 1985-12-25 樹脂封止形半導体装置用モ−ルド金型 Granted JPS62152131A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60297795A JPS62152131A (ja) 1985-12-25 1985-12-25 樹脂封止形半導体装置用モ−ルド金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60297795A JPS62152131A (ja) 1985-12-25 1985-12-25 樹脂封止形半導体装置用モ−ルド金型

Publications (2)

Publication Number Publication Date
JPS62152131A JPS62152131A (ja) 1987-07-07
JPH0415621B2 true JPH0415621B2 (de) 1992-03-18

Family

ID=17851266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60297795A Granted JPS62152131A (ja) 1985-12-25 1985-12-25 樹脂封止形半導体装置用モ−ルド金型

Country Status (1)

Country Link
JP (1) JPS62152131A (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07137082A (ja) * 1993-11-16 1995-05-30 Towa Kk 樹脂成形用金型
JPH0820046A (ja) * 1994-07-06 1996-01-23 Sony Corp 樹脂成形用金型

Also Published As

Publication number Publication date
JPS62152131A (ja) 1987-07-07

Similar Documents

Publication Publication Date Title
Kong et al. Warpage in plastic packages: effects of process conditions, geometry and materials
TW518698B (en) Die used for resin-sealing and molding an electronic component
US20110042857A1 (en) Method of evaluating adhesion property, low-adhesion material, and mold for molding resin
KR100932636B1 (ko) 알루미나 복합체 캐필러리의 제조방법
JPS62152131A (ja) 樹脂封止形半導体装置用モ−ルド金型
JPS62206842A (ja) 樹脂封止形半導体装置用トランスフア−成形機
US5650177A (en) Resin molding apparatus
JPS5993315A (ja) モ−ルド型
JPH0432536B2 (de)
KR101634132B1 (ko) 분말 야금법(pm)에 대한 치과용 보철물 성형재료 제조방법
KR100334242B1 (ko) 와이어 본딩용 캐필러리 소결제, 이를 이용한 와이어본딩용 캐필러리 소결체의 제조 방법 및 이를 적용한 와이어 본딩용 캐필러리 제조 방법
JPS61167515A (ja) モ−ルド装置
JPS6230013A (ja) マルチプランジヤ型レジンモ−ルド装置のポツト
JPS63203262A (ja) 金型
JPH0683890B2 (ja) 成形機用耐摩耗部材の製造方法
JPS60165339A (ja) ダイカスト金型部材用w基焼結合金
KR100791222B1 (ko) 사출성형법을 이용한 투광성 캐필러리 제조방법 및 이를이용한 투광성 캐필러리
JPS6255112A (ja) マルチプランジヤ型レジンモ−ルド装置のプランジヤ
JPH10310467A (ja) ワイヤボンディング装置のボールボンディングキャピラリー用アルミナ・炭化珪素ナノ複合体及びその製造方法
KR100376965B1 (ko) 트림 펀치
GB1192617A (en) Particulate Resins and Moulding Process Utilising them
KR100199292B1 (ko) 반도체 칩 패키지 몰딩 장치
TWI291209B (en) Mold
JPS61190043A (ja) Ic製造設備用金型部品
JPS62125636A (ja) Ic樹脂モ−ルド用プランジヤ−