JPS62152131A - 樹脂封止形半導体装置用モ−ルド金型 - Google Patents

樹脂封止形半導体装置用モ−ルド金型

Info

Publication number
JPS62152131A
JPS62152131A JP60297795A JP29779585A JPS62152131A JP S62152131 A JPS62152131 A JP S62152131A JP 60297795 A JP60297795 A JP 60297795A JP 29779585 A JP29779585 A JP 29779585A JP S62152131 A JPS62152131 A JP S62152131A
Authority
JP
Japan
Prior art keywords
mold
resin
semiconductor device
gate
young
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60297795A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0415621B2 (de
Inventor
Susumu Ueno
進 上野
Masaru Kaneda
優 金田
Shinichi Shimizu
清水　真一
Tetsuo Yoshida
哲夫 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin-Etsu Chemical Co Ltd
Original Assignee
Shin-Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin-Etsu Chemical Co Ltd filed Critical Shin-Etsu Chemical Co Ltd
Priority to JP60297795A priority Critical patent/JPS62152131A/ja
Publication of JPS62152131A publication Critical patent/JPS62152131A/ja
Publication of JPH0415621B2 publication Critical patent/JPH0415621B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP60297795A 1985-12-25 1985-12-25 樹脂封止形半導体装置用モ−ルド金型 Granted JPS62152131A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60297795A JPS62152131A (ja) 1985-12-25 1985-12-25 樹脂封止形半導体装置用モ−ルド金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60297795A JPS62152131A (ja) 1985-12-25 1985-12-25 樹脂封止形半導体装置用モ−ルド金型

Publications (2)

Publication Number Publication Date
JPS62152131A true JPS62152131A (ja) 1987-07-07
JPH0415621B2 JPH0415621B2 (de) 1992-03-18

Family

ID=17851266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60297795A Granted JPS62152131A (ja) 1985-12-25 1985-12-25 樹脂封止形半導体装置用モ−ルド金型

Country Status (1)

Country Link
JP (1) JPS62152131A (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07137082A (ja) * 1993-11-16 1995-05-30 Towa Kk 樹脂成形用金型
US5882692A (en) * 1994-07-06 1999-03-16 Sony Corporation Resin molding apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07137082A (ja) * 1993-11-16 1995-05-30 Towa Kk 樹脂成形用金型
US5882692A (en) * 1994-07-06 1999-03-16 Sony Corporation Resin molding apparatus

Also Published As

Publication number Publication date
JPH0415621B2 (de) 1992-03-18

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