JPH0432536B2 - - Google Patents

Info

Publication number
JPH0432536B2
JPH0432536B2 JP61202838A JP20283886A JPH0432536B2 JP H0432536 B2 JPH0432536 B2 JP H0432536B2 JP 61202838 A JP61202838 A JP 61202838A JP 20283886 A JP20283886 A JP 20283886A JP H0432536 B2 JPH0432536 B2 JP H0432536B2
Authority
JP
Japan
Prior art keywords
tablet
resin
mold
lower punches
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61202838A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6358846A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP20283886A priority Critical patent/JPS6358846A/ja
Publication of JPS6358846A publication Critical patent/JPS6358846A/ja
Publication of JPH0432536B2 publication Critical patent/JPH0432536B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
    • B30B15/022—Moulds for compacting material in powder, granular of pasta form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/58—Details
    • B29C45/586—Injection or transfer plungers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/58—Details
    • B29C45/62—Barrels or cylinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/065—Press rams

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP20283886A 1986-08-29 1986-08-29 半導体封止用樹脂のタブレツト製造装置 Granted JPS6358846A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20283886A JPS6358846A (ja) 1986-08-29 1986-08-29 半導体封止用樹脂のタブレツト製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20283886A JPS6358846A (ja) 1986-08-29 1986-08-29 半導体封止用樹脂のタブレツト製造装置

Publications (2)

Publication Number Publication Date
JPS6358846A JPS6358846A (ja) 1988-03-14
JPH0432536B2 true JPH0432536B2 (de) 1992-05-29

Family

ID=16464024

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20283886A Granted JPS6358846A (ja) 1986-08-29 1986-08-29 半導体封止用樹脂のタブレツト製造装置

Country Status (1)

Country Link
JP (1) JPS6358846A (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8312612B2 (en) 2002-04-11 2012-11-20 Blue Sky Vision Partners, Llc Refurbished punch tip and method for manufacture and refurbishing
US7033156B2 (en) 2002-04-11 2006-04-25 Luka Gakovic Ceramic center pin for compaction tooling and method for making same
JP5516653B2 (ja) * 2006-10-06 2014-06-11 日立化成株式会社 タブレット成形金型、ならびにタブレット、光半導体素子搭載用基板の製造方法および光半導体装置。

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5850281A (ja) * 1981-09-22 1983-03-24 日産自動車株式会社 ウインドガラス昇降装置におけるバランス機構
JPS58193106A (ja) * 1982-05-06 1983-11-10 京セラ株式会社 粉体成形型
JPS6140353A (ja) * 1984-07-31 1986-02-26 Shin Etsu Chem Co Ltd 半導体封止用樹脂タブレツトの製造方法および製造装置
JPS6150733U (de) * 1984-09-10 1986-04-05

Also Published As

Publication number Publication date
JPS6358846A (ja) 1988-03-14

Similar Documents

Publication Publication Date Title
AU2003245820B2 (en) Method for producing highly porous metallic moulded bodies close to the desired final contours
EP0516165B1 (de) Verfahren zur herstellung eines harten sinterkörpers
JP3479738B2 (ja) 半導体パッケージと、それに用いる放熱基板の製造方法
US3785038A (en) Process of working a sintered powder metal compact
JPS6358846A (ja) 半導体封止用樹脂のタブレツト製造装置
US2794241A (en) Fabrication of intricate shapes from beryllium
JPH0416015B2 (de)
BR0314079A (pt) Método de preparação de componentes com base de ferro pela compactação a elevadas pressões
KR100612611B1 (ko) 반도체 조립용 캐필러리의 제조방법
Ramakrishnan et al. A compaction study on ceramic powders
JPH0415621B2 (de)
US5989483A (en) Method for manufacturing powder metallurgical tooling
JPS60180966A (ja) 高温安定な、高密度セラミツク成形体の製法
JPS58193106A (ja) 粉体成形型
Oh et al. Effect of the Mold Material and Powder Particle on the Precision of BIP Method
JP2001081525A (ja) サーメット及び非酸化物系セラミックス
SU1560405A1 (ru) Пресс-форма дл гор чего прессовани порошковых материалов
JP2672193B2 (ja) 液圧金型圧縮法
Luk Advances in binder-treatment technology-statistical data on ancorbond plus
JPS61190043A (ja) Ｉｃ製造設備用金型部品
RU36280U1 (ru) Деталь металлургического оборудования из порошковых материалов
JP2001181705A (ja) 粉末成形方法
JPH06145715A (ja) 粉末による部品の製造方法
JPH02120268A (ja) セラミックス焼結体の製造方法
JP3078356B2 (ja) 粉末加圧成形方法