JPH0415839U - - Google Patents

Info

Publication number
JPH0415839U
JPH0415839U JP1990058396U JP5839690U JPH0415839U JP H0415839 U JPH0415839 U JP H0415839U JP 1990058396 U JP1990058396 U JP 1990058396U JP 5839690 U JP5839690 U JP 5839690U JP H0415839 U JPH0415839 U JP H0415839U
Authority
JP
Japan
Prior art keywords
wire
rod
capillary
bonded
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990058396U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990058396U priority Critical patent/JPH0415839U/ja
Publication of JPH0415839U publication Critical patent/JPH0415839U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例に係るワイヤボンデ
イング装置の特徴となるクランパの一部破断斜視
図、第２図は第１図Ｉ−Ｉ線に沿つた断面図、第
３図はクランパの動作を示す第１図Ｉ−Ｉ線に沿
つた断面図、第４図は従来のワイヤボンデイング
装置の概略構成図、第５図は従来のワイヤボンデ
イング装置におけるクランパの横断面図である。 １……スプール、２……ワイヤ、６……キヤピ
ラリ、８……クランパ、８１……ロツド、８１ａ
……押圧部、８４……棒体。

Claims (1)

  1. 【実用新案登録請求の範囲】 スプールから繰出されキヤピラリに挿通された
    ワイヤをキヤピラリ先端で被ボンデイング物に押
    圧してボンデイングし、キヤピラリ上方に配置し
    たクランパによりワイヤをクランプしてワイヤを
    切断するワイヤボンデイング装置において、 上記クランプは、ワイヤに対して交差配置され
    た棒体と、略Ｌ字状に折曲され、一旦部乃至折曲
    部がワイヤを介して棒体と平行配置されて棒体に
    対し近接離反してワイヤをクランプするロツドと
    で構成されたことを特徴とするワイヤボンデイン
    グ装置。
JP1990058396U 1990-05-31 1990-05-31 Pending JPH0415839U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990058396U JPH0415839U (ja) 1990-05-31 1990-05-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990058396U JPH0415839U (ja) 1990-05-31 1990-05-31

Publications (1)

Publication Number Publication Date
JPH0415839U true JPH0415839U (ja) 1992-02-07

Family

ID=31583968

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990058396U Pending JPH0415839U (ja) 1990-05-31 1990-05-31

Country Status (1)

Country Link
JP (1) JPH0415839U (ja)

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