JPS63131128U - - Google Patents
Info
- Publication number
- JPS63131128U JPS63131128U JP1987023132U JP2313287U JPS63131128U JP S63131128 U JPS63131128 U JP S63131128U JP 1987023132 U JP1987023132 U JP 1987023132U JP 2313287 U JP2313287 U JP 2313287U JP S63131128 U JPS63131128 U JP S63131128U
- Authority
- JP
- Japan
- Prior art keywords
- wire bonding
- tip
- thin metal
- pore
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07521—Aligning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例を示す要部断面側面
図である。 １，１ａ……金ワイヤ、２……ワイヤ保持用ク
ランパー、３……ワイヤ切断用クランパー、４…
…キヤピラリー、５……キヤピラリーホルダ、６
……接地線、７……半導体素子、８……容器、９
……容器支持台、１０：接地線、４１……細孔、
４２……先端部。
図である。 １，１ａ……金ワイヤ、２……ワイヤ保持用ク
ランパー、３……ワイヤ切断用クランパー、４…
…キヤピラリー、５……キヤピラリーホルダ、６
……接地線、７……半導体素子、８……容器、９
……容器支持台、１０：接地線、４１……細孔、
４２……先端部。
Claims (1)
- 先端部へ抜ける細孔を有するキヤピラリーを備
え、前記細孔に金属細線を通して前記先端部へ導
出し、半導体素子の電極と外部接続用電極とを前
記金属細線により接続するワイヤボンデイング装
置において、前記キヤピラリーを導電性材料で形
成し、かつ接地したことを特徴とするワイヤボン
デイング装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987023132U JPS63131128U (ja) | 1987-02-18 | 1987-02-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987023132U JPS63131128U (ja) | 1987-02-18 | 1987-02-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63131128U true JPS63131128U (ja) | 1988-08-26 |
Family
ID=30821170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987023132U Pending JPS63131128U (ja) | 1987-02-18 | 1987-02-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63131128U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014200113B4 (de) | 2013-01-10 | 2022-03-24 | Ihi Corporation | Elektrischer Turbolader |
-
1987
- 1987-02-18 JP JP1987023132U patent/JPS63131128U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014200113B4 (de) | 2013-01-10 | 2022-03-24 | Ihi Corporation | Elektrischer Turbolader |