JPH04178264A - Flux coating applicator - Google Patents

Abstract

PURPOSE:To apply the minimum quantity of flux required for soldering to only a part to be applied with the flux by inserting leads of electronic parts by a holding member into grooves provided on the upper surface of a movable member in which the flux is filled up and applying the flux thereto. CONSTITUTION:The holding member 8 holding the electronic parts 7 is moved to the position where the leads 7a and grooves 6 are opposed to each other by a driving mechanism and a package 7b of the electronic parts 7 is lowered vertically till the position not to come into contact with the upper surface of the movable member 2. Accordingly, the flux 10 filled up in the grooves 6 is applied to places where the leads 7a come into contact with a pattern of a printed board. When the flux 10 is applied to the leads 7a, the holding member 8 is moved to the position where the electronic parts 7 of the printed board to which these electronic parts 7 are fitted are fitted while the electronic parts 7 being held by the driving mechanism and the electronic parts 7 are fitted thereto. Accordingly, the minimum quantity of flux required can be applied to the leads 7a.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a flux coating device for applying flux to the leads of electronic components in a step before soldering the electronic components to a printed circuit board.

BACKGROUND OF THE INVENTION Generally, when soldering electronic components to a printed circuit board, flux is applied to the pattern on the printed circuit board or to the leads of the electronic component in order to improve the adhesion of the solder.

Conventionally, in the process before soldering electronic components such as microcomputers (hereinafter referred to as microcomputers),
As shown in FIG. 2, flux was applied with a brush or the like to an area 25 on the printed circuit board surrounded by a dashed-dotted line, including the no-turns 24 of the printed circuit board to which the leads 21a of the electronic component 21 were soldered.

Problem to be Solved by the Invention However, when applying the flux using a brush or the like, the amount of slack applied by the operator is not constant, and the flux is applied to areas other than the area 25, for example, the electronic component 2.
The area 26 at the bottom of the package 21b of No. 1 may also be coated. In addition, the printed circuit board is cleaned to remove excess flux after the soldering process, but if flux is applied to the bottom of the package 21b of the electronic component 21 as described above, this flux is completely removed. could not be removed completely, and the printed circuit board and pad...

Flux remains between the cage 21b and the cage 21b. In addition, especially for microcomputers, the leads 21a and packages 21b are coated with wax after soldering to avoid moisture. This results in problems such as the electronic components 21 rotting due to the influence of moisture. Therefore, there is a problem in that the number of work steps is increased, such as drying the printed circuit board at high temperature in order to dry the flux that has not been completely removed, leading to an increase in costs.

An object of the present invention is to provide an excellent flux applicator which can solve the above problems and can reliably apply the minimum amount of flux necessary for soldering only to the areas to which flux is to be applied. It is something to do.

Means for Solving the Problems In order to achieve the above objects, the present invention provides a member having a groove on its upper surface, a recessed portion of a size and shape capable of accommodating said member on its upper surface, and stores flux in this recessed portion. a container for filling the groove with flux by driving the member and storing the member in the recess; and a driving means for holding an electronic component and inserting a lead of the electronic component into the groove. It is equipped with a holding mechanism that applies flux to the

Therefore, according to the present invention, a member having a groove on its upper surface is housed in a recess of a container containing flux, thereby filling the groove with flux, and inserting the lead of an electronic component into the groove using a holding mechanism. This has the effect of applying flux to the leads.

Embodiment FIGS. 1 and 2 are cross-sectional views showing the step of applying flux to the leads of an electronic component and the preparation step thereof, respectively, in an embodiment of the present invention, and these are sectional views shown at I-1 in FIG.
FIG. Further, FIG. 3 is a plan view of this embodiment. In FIGS. 1 to 3, reference numeral 1 denotes a flux container for storing flux 9, and a recessed portion of a size and shape capable of accommodating the movable member 2 is provided in the upper part. Reference numeral 2 denotes a movable member that is driven vertically up and down via an arm 3 by a cylinder 4 operated by hydraulic pressure or air pressure. 5 is a fixture for fixing the flux container 1 to the outer tube of the cylinder 4; 6 is a groove provided on the upper surface of the movable member 2; the size and shape are such that the lead 7a of the electronic component 7 is accommodated therein; It is provided. Reference numeral 8 denotes a holding member that holds the electronic component 7. The electronic component 7 is taken out from the component tray (not shown) by a drive mechanism (not shown), moved to a position where the lead 7a faces the groove 6, and is moved to this position. The electronic component 7 is moved up and down using the steps, and the electronic component is further moved onto the printed circuit board and mounted. Further, the apparatus in this embodiment is installed in a component mounting line, and is used in a process before mounting electronic components 7 on printed circuit boards.

Next, the operation of the above embodiment will be explained. First, as shown in FIG. 2, the movable member 2 is moved to the arm 3 by the cylinder 4.
It moves vertically downward by being driven through the flux container 1, and is stored until its upper surface is hidden by the flux 9 contained in the flux container 1, and the groove 6 is filled with the flux 10. When the groove 6 is filled with the flux 10, the movable member 2 is moved vertically upward by the operation of the cylinder 4 and comes to rest at the position shown in FIG. At this time, the holding member 8 holding the electronic component 7 is moved by the drive mechanism to a position where the leads 7a and the grooves 6 face each other, and the package 7b of the electronic component 7 is vertically lowered to a position where it does not come into contact with the upper surface of the movable member 2. let Therefore, the flux 10 filled in the groove 6 is applied to the portion of the lead 7a that contacts the pattern of the printed circuit board.

Once the flux 10 is applied to the lead 7a, the holding member 8, while holding the electronic component 7, is moved by the drive mechanism to the position where the electronic component 7 is attached to the printed circuit board to which the electronic component 7 is attached. Attach it to the printed circuit board. Furthermore, in the next process, the lead 7a
The soldering process is done.

As described above, according to this embodiment, the lead 7a of the electronic component 7 is inserted by the holding member 8 into the groove 6 provided on the upper surface of the movable member 2 filled with the flux 10, and the flux 10 is applied to the lead. The required minimum amount of flux can be applied to 7a. In addition, since the minimum amount of flux required is applied, the flux does not get into places that are difficult to remove even after cleaning, such as between the electronic component package and the printed circuit board, and unnecessary flux is removed. Since there is no need to add a process such as drying the printed circuit board at high temperature, it has the effect of leading to cost reduction.

Effects of the Invention As is clear from the above embodiments, the present invention involves inserting the lead of an electronic component into a groove provided on the top surface of a movable member filled with flux using an electronic component holding mechanism, and applying flux to the lead. This allows the minimum amount of slack to be applied. Furthermore, since the minimum amount of flux required is applied, flux does not get into areas that are difficult to remove even with cleaning, such as between electronic component packages and printed circuit boards, and it is possible to remove unnecessary flux. Since there is no need to add a process such as drying the printed circuit board at high temperature, it has the effect of leading to cost reduction.

[Brief explanation of the drawing]

1 and 2 are cross-sectional views showing the stage of applying flux to the leads of an electronic component and the preparation stage, respectively, in one embodiment of the present invention, FIG. 3 is a plan view of this embodiment, and FIG. 4 a 4 is a perspective view of an electronic component such as a microcomputer, and FIG. 4 is a plan view of a printed circuit board to which flux has been conventionally applied. 1... Flux container, 2... Movable member, 3... Arm, 4... Cylinder,
5...Fixing tool, 6...Groove, 7...
...Electronic parts, 7a... Leads, 7b...
...Package, 8...Holding member, 9.10.
·····flux. Name of agent: Patent attorney Akira Koeji and two others Figure 1 Figure 2 Figure 6

Claims (2)

[Claims] (1) A member having a groove on its upper surface, a container having a recess of a size and shape that can accommodate the member on the upper surface and storing flux in the recess, and driving the member to place the member in the recess. A flux application device comprising: a driving means for filling the groove with flux by housing the electronic component; and a holding mechanism for holding an electronic component, inserting a lead of the electronic component into the groove, and applying flux to the lead. (2) The flux applicator according to claim 1, further comprising a member having a groove on its upper surface having a size and shape capable of accommodating leads of electronic components.