JPH04179191A - Manufacture of wiring board - Google Patents
Manufacture of wiring boardInfo
- Publication number
- JPH04179191A JPH04179191A JP30260290A JP30260290A JPH04179191A JP H04179191 A JPH04179191 A JP H04179191A JP 30260290 A JP30260290 A JP 30260290A JP 30260290 A JP30260290 A JP 30260290A JP H04179191 A JPH04179191 A JP H04179191A
- Authority
- JP
- Japan
- Prior art keywords
- palladium
- board
- plating
- substrate
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 70
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 35
- 238000007747 plating Methods 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 30
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000010949 copper Substances 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- 239000012286 potassium permanganate Substances 0.000 claims abstract description 10
- 239000003054 catalyst Substances 0.000 claims abstract description 7
- VRXOQUOGDYKXFA-UHFFFAOYSA-N hydroxylamine;sulfuric acid Chemical compound ON.ON.OS(O)(=O)=O VRXOQUOGDYKXFA-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000000126 substance Substances 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 39
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 239000000654 additive Substances 0.000 claims description 6
- 230000000996 additive effect Effects 0.000 claims description 6
- 238000007654 immersion Methods 0.000 claims description 4
- 238000005406 washing Methods 0.000 claims description 4
- 238000011282 treatment Methods 0.000 abstract description 7
- 239000003984 copper intrauterine device Substances 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 14
- 239000011889 copper foil Substances 0.000 description 8
- 229920001971 elastomer Polymers 0.000 description 6
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 5
- 239000005751 Copper oxide Substances 0.000 description 5
- 229910000431 copper oxide Inorganic materials 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- -1 polyethylene Polymers 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- XZXYQEHISUMZAT-UHFFFAOYSA-N 2-[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenol Chemical compound CC1=CC=C(O)C(CC=2C(=CC=C(C)C=2)O)=C1 XZXYQEHISUMZAT-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229940107816 ammonium iodide Drugs 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明発明は配線板の製造法し、さらに詳しくはアディ
ティブ法による高密度配線板の製造法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a wiring board, and more particularly to a method for manufacturing a high-density wiring board by an additive method.
近年、電子機器の小型、軽量化に伴い配線板にも配線の
高密度化が要求されており、それに伴って配線１１や配
線間隔が狭くなっている。現在、配線板の配線形成法で
は、樹脂基板上に銅箔を積層し、その銅箔上の回路とな
るべき部分にエツチングレジストを形成し、不要部分の
銅箔をウェットエツチングするサブトラクト法が主流で
ある。しかし、エツチングが等方的に進行しやすいため
レジスト下部の銅もエンチングされるいわゆる″サイド
エツチング“′現象が発生する。In recent years, as electronic devices become smaller and lighter, wiring boards are required to have higher wiring densities, and accordingly, the wiring 11 and the wiring spacing are becoming narrower. Currently, the mainstream method for forming wiring on wiring boards is the subtract method, in which copper foil is laminated on a resin substrate, an etching resist is formed on the copper foil where the circuit should be formed, and the unnecessary portions of the copper foil are wet-etched. It is. However, since the etching tends to proceed isotropically, the so-called "side etching" phenomenon occurs in which the copper under the resist is also etched.
このため、微細配線をサブトラクト法で形成する際、配
線の細りゃ断線等が生しやずいという問題がある。For this reason, when forming fine wiring by the subtract method, there is a problem in that the thinner the wiring is, the more likely it is to break.
一方サブトラクト法と異なる配線形成法の一つに以下に
示すアディティブ法がある。この方法では、樹脂基板表
面にめっき触媒であるパラジウムを付着させた後、回路
とならない部分にめっきレジストを形成し、回路となる
部分に化学めっきによりめっき銅を形成し、めっきレジ
ストを剥離後、基板表面の不要なパラジウムを除去する
ことにより、配線が形成される。このアディティブ法で
は配線形状はめっきレジストの形状に依存する。このめ
っきレジストは直進性の高いＵＶ光を使用するフォトレ
ジストが用いられるため異方性が高く垂直な側壁形状を
有するフォトレジストを容易に形成することができる。On the other hand, one of the wiring formation methods different from the subtract method is the additive method described below. In this method, after depositing palladium as a plating catalyst on the surface of a resin substrate, plating resist is formed on the parts that will not form a circuit, plated copper is formed by chemical plating on the parts that will form a circuit, and after peeling off the plating resist, Wiring is formed by removing unnecessary palladium from the surface of the substrate. In this additive method, the wiring shape depends on the shape of the plating resist. Since this plating resist uses a photoresist that uses highly linear UV light, it is possible to easily form a photoresist with high anisotropy and a vertical sidewall shape.
このため号イドエツチングの問題か少なく、微細配線形
成性に優れた加工法となっている。For this reason, there are fewer problems with side etching, making it a processing method with excellent ability to form fine wiring.
このアディティブ法の製造工程の一つであるめっきレジ
ス］・剥離後の基板表面の不要なパラジウムを除去する
工程において、従来、以下に示す方法が行われていた。In the step of removing unnecessary palladium from the surface of the substrate after peeling (plating resist), which is one of the manufacturing steps of this additive method, the following method has conventionally been carried out.
］）基板をヨウ素、ヨウ化アンモニウム溶液に浸漬し、
パラジウムを溶解する方法。]) Immerse the substrate in an iodine, ammonium iodide solution,
How to dissolve palladium.
２）基板を過マンガン酸カリウム溶液に浸漬し、パラジ
ウムを溶解する方法。2) A method in which the substrate is immersed in a potassium permanganate solution to dissolve palladium.
３）ＲＩＥ（リアクティブイオンエンチング）等の真空
排気装置を用いて、パラジウムを基板表面から離脱させ
る方法。3) A method of separating palladium from the substrate surface using a vacuum evacuation device such as RIE (reactive ion etching).
しかしながら、前述した従来のパラジウムの除去法には
以下に示す問題点があった。However, the conventional palladium removal method described above has the following problems.
１）ヨウ素、ヨウ化アンモニウム溶液に浸漬する方法で
は、パラジウム溶解と同時に銅も溶解するため、配線の
細りゃ断線が発生しやすい。1) In the method of immersing the wire in an iodine or ammonium iodide solution, copper is also dissolved at the same time as palladium is dissolved, which tends to cause wire breakage if the wire becomes thin.
２）過マンガン酸カリウム溶液に浸漬する方法では、樹
脂基板を浸漬すると樹脂表面が酸化され、その表面が微
細な凹凸形状となる。この樹脂酸化がパラジウムの熔解
より速く進むため、樹脂酸化層の凹部に存在するパラジ
ウムに処理液が接触しにくく、部分的にパラジウム残り
が発生する。2) In the method of immersing the resin substrate in a potassium permanganate solution, when the resin substrate is immersed, the resin surface is oxidized and the surface becomes finely uneven. Since this resin oxidation proceeds faster than palladium melting, it is difficult for the processing liquid to come into contact with the palladium present in the recesses of the resin oxidation layer, and palladium remains partially.
３）真空排気装置を用いる方法では、ウエツ１−処理に
比べ装置が高価なことや、処理できる基板枚数に制限が
生じやすいこと等から配線板製造コストが高く。3) In the method using a vacuum evacuation device, the manufacturing cost of the wiring board is high because the device is more expensive than the wet one-processing, and the number of substrates that can be processed is likely to be limited.
本発明は銅を溶解することなく安価に不要部分のパラジ
ウムを高度に除去することができる配線板の製造法を折
供するものである。The present invention provides a method for manufacturing wiring boards that can inexpensively remove unnecessary portions of palladium to a high degree without dissolving copper.
本発明者らは、基板表面上のパラジウムの除去について
鋭意研究を行った結果、基板を過マンガン酸カリウム溶
液に浸漬した後、さらに特定の処理を組み合わせて行う
ことによって、前記問題点が解決されることを見出し、
この知見に基づいて本発明を完成するに至った。As a result of intensive research into the removal of palladium on the surface of a substrate, the inventors of the present invention found that the above problem was solved by immersing the substrate in a potassium permanganate solution and then performing a specific treatment in combination. I discovered that
Based on this knowledge, we have completed the present invention.
すなわち、本発明は樹脂基板表面にめっき触媒であるパ
ラジウムを付着させた後、回路とならない部分にめっき
レジストを形成し、回路となる部分に化学めっきにより
めっき銅を形成し、次いでめっきレジストを剥離した後
、基板表面に残存する不要なパラジウムを除去するアデ
ィティブ法による配線板の製造法Ｇこおいて、めっきレ
ジストを剥離した後の基板表面に残存するパラジウムの
除去を、基板の過マンガン酸カリウムを含む溶液への浸
漬と、これに続く超音波水洗と硫酸ヒト−キシアンモニ
ウムを含むｆ４液への浸漬とにより行うこと特徴とする
配線板の製造法を提供するものである。That is, in the present invention, after depositing palladium, which is a plating catalyst, on the surface of a resin substrate, plating resist is formed on the parts that will not form a circuit, plated copper is formed by chemical plating on the parts that will form a circuit, and then the plating resist is peeled off. After the plating resist is peeled off, the palladium remaining on the substrate surface is removed using potassium permanganate from the substrate. The present invention provides a method for manufacturing a wiring board, which is characterized in that the process is carried out by immersion in a solution containing:
本発明が通用できる樹脂基板としては、エポキシ樹脂、
フェノール樹脂、ポリイミド樹脂、ポリエステル樹脂等
の熱硬化性樹脂や、ポリエチレン、フッ素樹脂、ポリエ
ーテルサルフォン、ポリエーテルイミド等の熱可塑性樹
脂やＮＢＲ、アクリルゴム、シリコンゴム、ポリエチレ
ンゴム、ポリイソプレンゴム、ポリボロピレンゴム、ポ
リスチレンゴム等のゴム性樹脂からなるもの及び前述し
た熱硬化性樹脂、熱可塑性樹脂、ゴム性樹脂等と紙基材
、ガラス布、ガラス不織布、無機フィラー等を複合して
得られたもの等が挙げられる。Examples of resin substrates to which the present invention can be applied include epoxy resin,
Thermosetting resins such as phenolic resin, polyimide resin, polyester resin, thermoplastic resins such as polyethylene, fluororesin, polyethersulfone, polyetherimide, NBR, acrylic rubber, silicone rubber, polyethylene rubber, polyisoprene rubber, Products made of rubber resins such as polyboropyrene rubber and polystyrene rubber, or composites of the aforementioned thermosetting resins, thermoplastic resins, rubber resins, etc., with paper base materials, glass cloth, glass nonwoven fabrics, inorganic fillers, etc. Examples include those that were given.
本発明が適用できる除去可能なパラジウムの基板への付
着方法はあえて限定されるものではない。The method of attaching removable palladium to a substrate to which the present invention can be applied is not intentionally limited.
塩化パラジウム溶液中に基板を浸漬して、基板表面に吸
着させる方法、またあらかしめ基板材料中にパラジウム
を分散させておく方法等により基板表面に付着され、レ
ジスト剥離時に基板表面に残存しているものはいずれも
除去可能である。It is attached to the substrate surface by immersing the substrate in a palladium chloride solution and adsorbing it to the substrate surface, or by dispersing palladium in the preheated substrate material, and remains on the substrate surface when the resist is removed. Everything can be removed.
パラジウム除去時には、まず、基板を過マンガン酸カリ
ウムを含む溶液に浸漬する（処理Ａ）。次に超音波水洗
しく処理Ｂ）、その後硫酸ヒドロキシアンモニウムを含
む溶液に浸漬する（処理Ｃ）。When removing palladium, the substrate is first immersed in a solution containing potassium permanganate (processing A). Next, it is subjected to ultrasonic water washing (treatment B), and then immersed in a solution containing hydroxyammonium sulfate (treatment C).
また、処理Ａを行った後、処理Ｃを行い、その後処理Ｂ
を施しても良い。必要であれば、順次、処理Ａ、処理Ｂ
、処理Ｃを複数回繰り返しても良く、また順次処理Ａ、
処理Ｃ１処理Ｂを複数回繰り返しても良い。Also, after processing A, processing C is performed, and then processing B
may be applied. If necessary, process A and B in sequence.
, processing C may be repeated multiple times, and processing A,
Processing C1 and processing B may be repeated multiple times.
処理Ａは、例えばターフ４３３８Ｃ（化工機商事製）２
０〜１００ｇ／ｆを用いて５０〜９０°Ｃ５１〜２０分
間行う。処理Ｂは、水温０〜１００°Ｃ２処理時間１〜
１０分行う。処理Ｃは、例えばエングレートＭＬＢ４９
８（メルテソクス社製）３０〜］ ２０ｍｌ／ｉ＋ｃ
ｏ ｎ Ｃ，ｌ−１２ｓ０．２−２−１Ｏ，／Ｅを用い
て４０〜８０’Ｃ１１〜１０分間行う。Treatment A is, for example, Turf 4338C (manufactured by Kakoki Shoji) 2
It is carried out using 0-100g/f at 50-90°C for 51-20 minutes. Treatment B is water temperature 0-100°C2 treatment time 1-
Do this for 10 minutes. Processing C is, for example, Engrate MLB49.
8 (manufactured by Meltesox) 30~] 20ml/i+c
on C, l-12s0.2-2-1O, /E for 40-80'C11-10 minutes.
［作用〕
本発明によるパラジウム除去工程において、基板を過マ
ンガン酸カリウムを含む溶液に浸漬することで、基板表
面に形成された凹凸形状を有する樹脂酸化層は、次に基
板を超音波水洗すること及び硫酸ヒドロキシアンモニウ
ムを含む溶液に浸漬することにより、基板表面から除去
することができるので、凹凸形状を存した樹脂酸化層に
存在していたパラジウムを基板表面からほぼ完全に排除
することができる。[Operation] In the palladium removal process according to the present invention, the resin oxide layer having an uneven shape formed on the substrate surface by immersing the substrate in a solution containing potassium permanganate can be removed by ultrasonic water washing of the substrate. Since palladium can be removed from the substrate surface by immersing it in a solution containing hydroxyammonium sulfate, palladium present in the resin oxide layer with an uneven shape can be almost completely removed from the substrate surface.
以下、本発明を実施例に基づいて詳細に説明するが、本
発明はこれに限定されるものではない。Hereinafter, the present invention will be explained in detail based on Examples, but the present invention is not limited thereto.
実施例１
第１〜第８図は本発明の実施例の工程を説明するための
断面図である。通常の配線板に用いる３５μｍの銅箔１
の片面に以下に示す条件で、第１図に示すように、酸化
銅２を形成する。Example 1 FIGS. 1 to 8 are cross-sectional views for explaining the steps of an example of the present invention. 35μm copper foil used for normal wiring boards 1
As shown in FIG. 1, copper oxide 2 is formed on one side of the substrate under the following conditions.
［組成］ ＮａＯＨ：１５ｇ／Ｉ！。[composition] NaOH: 15g/I! .
Ｎａ５Ｐ○、−１２Ｈ２０：３０ｇ／ｆｆＮａＣｌ○２
： ８０ ｇ ／ １純水
：全量で１１となる量［条件〕
液温度 二８５°Ｃ銅箔浸漬時間
：１２０秒酸化銅を形成後、第２図に示す
ように銅箔の酸化銅を形成した面に複数枚のガラス入り
エポキシプリプレグＥ、−６７（日立化成工業、商品名
）を接するように配置し、加熱加圧して樹脂基板３を有
する積層体構造物とする。そして、第３図に示すように
通常の配線板製造工程で用いられているＮＣドリルマシ
ンで所望の位置に貫通孔４を設ける。その後、第４図に
示すように、塩化第２銅水溶液を用いて銅箔及び酸化銅
を化学的に除去し樹脂基板３とする。この樹脂基板をめ
っき触媒吸着液であるＭＳ−１０１Ｂ（日立化成工業、
商品名）に浸漬後、めっき密着促進剤であるＡＤＰ２０
１、（日立化成工業、商品名）に浸漬して、第５図に示
すように樹脂基板表面にめっき触媒であるパラジウム５
を付着させる。次に基板表面に、ドライフィルムレジス
トであるフオテツク５Ｒ−３０００（日立化成工業、商
品名）を貼り合わせ、露光・現像して第６図に示すめっ
きレジスト６を形成する。その後、以下の無電解鋼めっ
き液に浸漬して、第７図に示すめっき銅７を形成する。Na5P○, -12H20: 30g/ffNaCl○2
: 80 g/1 pure water
: Amount that makes the total amount 11 [Conditions] Liquid temperature 285°C Copper foil immersion time
: After forming copper oxide for 120 seconds, multiple sheets of glass-filled epoxy prepreg E, -67 (Hitachi Chemical Co., Ltd., trade name) were placed in contact with the surface of the copper foil on which copper oxide was formed, as shown in Figure 2. Then, heat and pressure are applied to form a laminate structure having a resin substrate 3. Then, as shown in FIG. 3, a through hole 4 is formed at a desired position using an NC drill machine used in a normal wiring board manufacturing process. Thereafter, as shown in FIG. 4, the copper foil and copper oxide are chemically removed using a cupric chloride aqueous solution to obtain a resin substrate 3. This resin substrate was coated with a plating catalyst adsorption liquid, MS-101B (Hitachi Chemical Co., Ltd.,
After soaking in ADP20, a plating adhesion promoter,
1. (Hitachi Chemical Co., Ltd., trade name) to coat the surface of the resin substrate with palladium 5, which is a plating catalyst, as shown in Figure 5.
Attach. Next, a dry film resist, FOOTEC 5R-3000 (trade name, manufactured by Hitachi Chemical Co., Ltd.), is bonded to the surface of the substrate, exposed to light, and developed to form a plating resist 6 shown in FIG. Thereafter, it is immersed in the following electroless steel plating solution to form plated copper 7 shown in FIG.
ＣｕＳＯ４・５Ｈ２０： １０ｇ／Ｉ
ＥＤＴＡ４Ｎａ ：４０ｇ／ｆｆ１３７％Ｃ
Ｈ２Ｏ：３．ｒｒ＋ｊ２／ｊ２〔条件〕
ｐＨ：１２．３
めっき液温度 ＝７０°Ｃ無電解銅めっき
後、塩化メチレン溶液に浸漬して、めっきレジスト６を
剥離する。その後、過マンガン酸カリウムが含まれてい
る薬品であるターフ４３３８−Ｃ（化工機商事、商品名
）を濃度５０ｇ／β、液温８０°Ｃの水溶液にして、め
っきレジストを剥離した配線基板を１０分間浸漬し、引
き続き超音波水洗（水温Ｏ〜１００°Ｃ）を行う。CuSO4・5H20: 10g/I EDTA4Na: 40g/ff137%C
H2O: 3. rr+j2/j2 [Conditions] pH: 12.3 Plating solution temperature = 70°C After electroless copper plating, the plating resist 6 is peeled off by immersion in a methylene chloride solution. After that, the wiring board with the plating resist removed was made into an aqueous solution of Turf 4338-C (Kakoki Shoji, trade name), a chemical containing potassium permanganate, at a concentration of 50 g/β and a liquid temperature of 80°C. It is immersed for 10 minutes, and then subjected to ultrasonic water washing (water temperature 0 to 100°C).
更に、硫酸ヒドロキシアンモニウムが含まれている薬品
であるエンプレー１−ＭＬＢ４９８（メルテソクス社、
商品名）を６０ｍ！／！、それにａ硫酸を５ ｍ？ ／
Ｒ配合した液温６０°Ｃの水溶液に５分間浸漬するこ
とにより、不要部分のパラジウムを除去し、第８図に示
すような配線板とした。Furthermore, Enprey 1-MLB498 (Meltesox, Inc., a drug containing hydroxyammonium sulfate)
Product name) 60m! /! , and 5 m of a sulfuric acid? /
By immersing it in an aqueous solution containing R at a temperature of 60° C. for 5 minutes, unnecessary portions of palladium were removed, and a wiring board as shown in FIG. 8 was obtained.
得られた配線基板からはパラジウムが完全に除去されて
いた。Palladium was completely removed from the resulting wiring board.
［発明の効果］
本発明によれば、量産性に優れたウェット処理により、
銅配線の細りゃ断線なしに、不要なパラジウムをほぼ完
全に除去することができるため、高密度配線化に通した
アディティブ法による配線板を高歩留で安価に製造する
ことができる。[Effects of the Invention] According to the present invention, wet processing with excellent mass productivity enables
Since unnecessary palladium can be almost completely removed without thinning or breaking the copper wiring, it is possible to manufacture wiring boards with high yield and at low cost using an additive method that allows for high-density wiring.
第１図〜第８図は本発明の一実施例の工程を説明するた
めの断面図である。
符号の説明
１ 銅箔 ２ 酸化銅
３ 樹脂基板 ４ 貫通孔
５ パラジウム ６ めっきレジスト７ めっ
き銅1 to 8 are cross-sectional views for explaining the steps of an embodiment of the present invention. Explanation of symbols 1 Copper foil 2 Copper oxide 3 Resin substrate 4 Through hole 5 Palladium 6 Plating resist 7 Plated copper
Claims (1)
させた後、回路とならない部分にめっきレジストを形成
し、回路となる部分に化学めっきによりめっき銅を形成
し、次いでめっきレジストを剥離した後、基板表面に残
存する不要なパラジウムを除去するアディティブ法によ
る配線板の製造法において、めっきレジストを剥離した
後の基板表面に残存するパラジウムの除去を、基板の過
マンガン酸カリウムを含む溶液への浸漬と、これに続く
超音波水洗と硫酸ヒドロキシアンモニウムを含む溶液へ
の浸漬とにより行うこと特徴とする配線板の製造法。1. After attaching palladium, which is a plating catalyst, to the surface of the resin substrate, a plating resist is formed on the parts that will not form a circuit, and plated copper is formed by chemical plating on the parts that will form a circuit.Then, after peeling off the plating resist, the surface of the board is In a wiring board manufacturing method using an additive method that removes unnecessary palladium remaining on the substrate, the palladium remaining on the substrate surface after peeling off the plating resist is removed by immersing the substrate in a solution containing potassium permanganate. A method for producing a wiring board, characterized in that this is followed by ultrasonic water washing and immersion in a solution containing hydroxyammonium sulfate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30260290A JPH04179191A (en) | 1990-11-09 | 1990-11-09 | Manufacture of wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30260290A JPH04179191A (en) | 1990-11-09 | 1990-11-09 | Manufacture of wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04179191A true JPH04179191A (en) | 1992-06-25 |
Family
ID=17910958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30260290A Pending JPH04179191A (en) | 1990-11-09 | 1990-11-09 | Manufacture of wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04179191A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994008443A1 (en) * | 1992-09-29 | 1994-04-14 | Berg N Edward | Method and apparatus for fabricating printed circuit boards |
| JPH07297520A (en) * | 1994-04-20 | 1995-11-10 | Nec Corp | Manufacture of printed wiring board |
| JP2014158010A (en) * | 2013-01-15 | 2014-08-28 | Ngk Spark Plug Co Ltd | Method for manufacturing wiring board |
-
1990
- 1990-11-09 JP JP30260290A patent/JPH04179191A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994008443A1 (en) * | 1992-09-29 | 1994-04-14 | Berg N Edward | Method and apparatus for fabricating printed circuit boards |
| JPH07297520A (en) * | 1994-04-20 | 1995-11-10 | Nec Corp | Manufacture of printed wiring board |
| JP2014158010A (en) * | 2013-01-15 | 2014-08-28 | Ngk Spark Plug Co Ltd | Method for manufacturing wiring board |
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