JPH0418439U - - Google Patents

Info

Publication number
JPH0418439U
JPH0418439U JP1990059922U JP5992290U JPH0418439U JP H0418439 U JPH0418439 U JP H0418439U JP 1990059922 U JP1990059922 U JP 1990059922U JP 5992290 U JP5992290 U JP 5992290U JP H0418439 U JPH0418439 U JP H0418439U
Authority
JP
Japan
Prior art keywords
lead electrodes
package
chip
semiconductor package
simplified
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990059922U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990059922U priority Critical patent/JPH0418439U/ja
Publication of JPH0418439U publication Critical patent/JPH0418439U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第1図は本考案の一実施例による半導体パツケ
ージの断面図、第2図は従来の半導体パツケージ
の断面図である。 図において、1は半導体チツプ、2はパツケー
ジ下部、4は金ワイヤ、5はリード電極、6はキ
ヤツプを示す。なお、図中、同一符号は同一、ま
たは相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. パツケージ内部でのリード電極を平板状に簡略
    化し、かつ、チツプから直接リード電極にワイヤ
    リングしたことを特徴とする半導体パツケージ。
JP1990059922U 1990-06-05 1990-06-05 Pending JPH0418439U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990059922U JPH0418439U (ja) 1990-06-05 1990-06-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990059922U JPH0418439U (ja) 1990-06-05 1990-06-05

Publications (1)

Publication Number Publication Date
JPH0418439U true JPH0418439U (ja) 1992-02-17

Family

ID=31586850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990059922U Pending JPH0418439U (ja) 1990-06-05 1990-06-05

Country Status (1)

Country Link
JP (1) JPH0418439U (ja)

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