JPH0418442U - - Google Patents

Info

Publication number
JPH0418442U
JPH0418442U JP1990059488U JP5948890U JPH0418442U JP H0418442 U JPH0418442 U JP H0418442U JP 1990059488 U JP1990059488 U JP 1990059488U JP 5948890 U JP5948890 U JP 5948890U JP H0418442 U JPH0418442 U JP H0418442U
Authority
JP
Japan
Prior art keywords
chip
memory alloy
mounting structure
shape memory
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990059488U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990059488U priority Critical patent/JPH0418442U/ja
Publication of JPH0418442U publication Critical patent/JPH0418442U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例によるチツプの実装
構造、第２図は本考案を適用した液晶表示パネル
、第３図は第１図に示すチツプ実装構造の工程説
明図、第４図は第１図に示すクリツプの挟持力特
性図、第５図は本考案によるチツプ実装構造の接
続不良発生率と温度との関係、第６図は従来のチ
ツプ実装構造の模式側面図、第７図は第６図に示
すパツド接続部の拡大図、第８図は紫外線硬化形
樹脂の接着力特性、第９図は従来のチツプ実装構
造の接続不良発生率と温度との関係、である。 図中において、１は回路基板、３はチツプ、５
は紫外線硬化形樹脂、１０は形状記憶合金のクリ
ツプ、を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 紫外線硬化形樹脂５を挟んで接合せしめた回路
    基板１とチツプ３とを、ほぼ室温で形状復帰する
    形状記憶合金の断面ほぼＵ字形クリツプ１０にて
    、該接合方向に挟持せしめたことを特徴とするチ
    ツプの実装構造。
JP1990059488U 1990-06-05 1990-06-05 Pending JPH0418442U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990059488U JPH0418442U (ja) 1990-06-05 1990-06-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990059488U JPH0418442U (ja) 1990-06-05 1990-06-05

Publications (1)

Publication Number Publication Date
JPH0418442U true JPH0418442U (ja) 1992-02-17

Family

ID=31586027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990059488U Pending JPH0418442U (ja) 1990-06-05 1990-06-05

Country Status (1)

Country Link
JP (1) JPH0418442U (ja)

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