JPH0419149B2 - - Google Patents
Info
- Publication number
- JPH0419149B2 JPH0419149B2 JP61212918A JP21291886A JPH0419149B2 JP H0419149 B2 JPH0419149 B2 JP H0419149B2 JP 61212918 A JP61212918 A JP 61212918A JP 21291886 A JP21291886 A JP 21291886A JP H0419149 B2 JPH0419149 B2 JP H0419149B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- flat belt
- speed
- board
- transmission member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Registering Or Overturning Sheets (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
本発明は、自動半田付け装置における基板の誘
導搬送装置に係り、特にデイツプ式半田付け装置
で一次半田付け及びリード線のカツト作業が完了
してキヤリアから分離された基板を、人手を介す
ことなく噴流式半田付け装置等に順調に乗り継が
せることができるようにした基板の誘導搬送装置
に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for guiding and transporting boards in an automatic soldering machine, and more particularly, the present invention relates to a device for guiding and transporting boards in an automatic soldering machine, and particularly for handling boards that have been separated from a carrier after primary soldering and cutting of lead wires have been completed in a dip-type soldering machine. The present invention relates to a guided conveyance device for a board, which allows a board to be smoothly transferred to a jet soldering device or the like without manual intervention.
従来技術
従来、長いリード線の電子部品の半田付けに好
適なデイツプ式半田付け装置の後工程にリード線
のカツタ装置を一体化して配置したものや、更に
これに加えて基板をキヤリヤに取り付けたままU
ターンさせた搬送経路に噴流式半田付け装置を一
体化して配置したもの、いわゆるラウンド型の自
動半田付け装置が実用に供されている。Conventional technology Conventionally, there have been dip-type soldering devices suitable for soldering electronic components with long lead wires, in which a lead wire cutting device is integrated into the back-end process, and in addition to this, the circuit board is attached to a carrier. Mama U
A so-called round type automatic soldering device, in which a jet-type soldering device is integrated and arranged on a turned conveyance path, is in practical use.
しかしこのラウンド型自動半田付け装置では、
全工程において基板がキヤリヤに取り付けられた
ままで搬送されるため、噴流式半田付け装置にお
いては基板が密着状態で搬送されてよいにもかか
わらず、キヤリヤによる余分な長さの分だけ基板
の間に無駄な間隔が生じる結果、単位時間当りの
基板の通過枚数が少なくなつてしまう欠点があつ
た。即ち、噴流式半田槽における基板の搬送速度
は、例えば1200mm/分が適当である等の如く定ま
つているので、キヤリヤの存否に拘らず、噴流式
半田付け装置におけるコンベアの速度は一定にし
ておかなければならない。従つて、例えば長さ
400mmの基板であれば、キヤリヤがある場合には
キヤリヤの縁の分を含めて長さが500mmとなり、
更にキヤリヤ間の距離を200mmとすると、2枚の
基板で1200mmの長さを占めることになり、毎分の
速度が1200mmの噴流式半田槽では、毎分2枚の基
板しか処理できない。従つて、たとえデイツプ式
半田付け装置が20秒タクトの装置であつて、毎分
3枚の処理能力があつても、噴流式半田付け装置
の能力に合わせて、毎分2枚の処理速度に落さな
ければならないことになり、生産能率は2/3に低
下してしまうわけである。 However, with this round type automatic soldering device,
During the entire process, the board is transported while attached to the carrier, so even though the board can be transported in close contact with jet soldering equipment, there is a gap between the boards due to the extra length provided by the carrier. As a result of unnecessary intervals, the number of substrates passed per unit time is reduced. In other words, since the conveyance speed of the board in a jet soldering tank is determined to be, for example, 1200 mm/min, the speed of the conveyor in the jet soldering device is kept constant regardless of the presence or absence of a carrier. I have to keep it. Therefore, e.g. length
For a 400mm board, if there is a carrier, the length will be 500mm including the edge of the carrier.
Furthermore, if the distance between the carriers is 200 mm, the two boards will occupy a length of 1200 mm, and a jet soldering bath with a speed of 1200 mm per minute can only process two boards per minute. Therefore, even if dip type soldering equipment has a tact time of 20 seconds and has a processing capacity of 3 pieces per minute, it will be possible to process 2 pieces per minute to match the capacity of jet type soldering equipment. As a result, production efficiency drops to two-thirds.
そこでラウンド型自動半田付け装置を用いない
場合には、リード線のカツトが終了した20秒タク
トの基板を手作業によりキヤリヤから外して基板
を単体で噴流式半田付け装置のコンベアに密着状
態で乗り継がせ、同じく20秒タクトで処理できる
ようにしていた。 Therefore, if a round type automatic soldering machine is not used, the board with a 20 second takt time after cutting the lead wires is manually removed from the carrier, and the board is placed on the conveyor of the jet soldering machine in close contact. I inherited it and made it possible to process it in the same 20 second tact time.
しかし、この方法によると、デイツプ式半田付
け装置及びカツタ装置に1名、基板の分離搬送作
業に1名、更に噴流式半田付け装置に1名の合計
3名の作業者が必ず必要となり、ラウンド型自動
半田付け装置に比べて生産能率は高いが3倍の作
業者が必要となる欠点があつた。 However, this method requires a total of three workers: one person for the dip-type soldering device and the cutter device, one person to separate and transport the boards, and one person for the jet-type soldering device. Although it has higher production efficiency than automatic mold soldering equipment, it has the disadvantage of requiring three times as many workers.
また従来技術においては、いずれにしてキヤリ
ヤから基板を自動的に分離してキヤリヤのリター
ン機構の外部にタイミングよく搬送し得る装置は
得られていないのが現状である。またキヤリヤか
ら分離された基板はそのままでは進行方向左右の
広い範囲に散らばり、また勝手な方向を向いてい
るので、これを一定の狭い範囲に誘導しつつその
向きを整列させなければ、例えば二次半田付けを
行う噴流式半田付け装置内に自動的に搬入するこ
とはできないが、従来技術ではこのような基板の
誘導搬送装置を得ることはできなかつたので、デ
イツプ式半田付け装置の基板から分離された基板
を自動的に噴流式半田付け装置に搬入することは
不可能であつた。 Furthermore, in the prior art, there is currently no device that can automatically separate the substrate from the carrier and transport it to the outside of the carrier's return mechanism in a timely manner. In addition, the substrates separated from the carrier will be scattered over a wide range to the left and right in the direction of travel, and will also be oriented in arbitrary directions. Although it is not possible to automatically transport the board into the jet soldering machine that performs soldering, it has not been possible to obtain such a guided conveyance system for the board with conventional technology, so it is necessary to separate it from the board in the dip type soldering machine. It has been impossible to automatically transfer the soldered board to a jet soldering device.
また特公昭51−43668には、板状物の斜行修正
装置が開示されているが、該従来例は、板状物を
搬送する搬送ベルトと、この搬送ベルトの入口側
を広く出口側を狭く規制するように設けられたタ
テベルトを備えてはいるが、この発明の特徴は、
エアで板状物を浮かせることと、タテベルトの速
度が搬送ベルトの速度よりも大きく、またタテベ
ルトが搬送ベルトの幅方向及び進行方向に移動自
在としたことにあり、本願発明におけるような、
一対の巻掛伝動部材の速度を異ならせるという着
眼は、一切開示していない。従つて該従来例の発
明は、本願発明とはその構成が全く異なる別異の
発明である。 Furthermore, Japanese Patent Publication No. 51-43668 discloses a device for correcting the skew of a plate-like object, but the conventional example has a conveyor belt for conveying the plate-like object, and a wide entrance side of the conveyor belt and an outlet side. Although it is equipped with a vertical belt that is provided to narrowly regulate, the characteristics of this invention are that
As in the present invention, the plate-shaped object is floated by air, the speed of the vertical belt is higher than the speed of the conveyor belt, and the vertical belt is movable in the width direction and the traveling direction of the conveyor belt.
There is no disclosure of the idea of making the speeds of the pair of wrapped transmission members different. Therefore, the invention of the prior art example is a different invention whose structure is completely different from the invention of the present application.
また実公昭56−10730には、プリント配線基板
の移送装置が開示されているが、該従来例は、プ
リント配線基板の両側の供給ローラで該基板を強
制搬送するようにしたものではあるが、本願発明
ではこのようなローラは、発明の必須の構成要件
としては用いていないので、該従来例は、本願発
明とはその構成が全く異なるものである。 Furthermore, Japanese Utility Model Publication No. 56-10730 discloses a device for transporting printed wiring boards, but in this conventional example, the printed wiring board is forcibly transported by supply rollers on both sides of the board. In the present invention, such a roller is not used as an essential component of the invention, so the configuration of the conventional example is completely different from that of the present invention.
また実開昭60−76099には、プリント板搬送位
置決め装置が開示されているが、該従来例は、単
にプリント基板をコンベアで搬送することを開示
しているのみであり、また基板に位置決め孔を設
けてこれに位置決めピンを嵌入させて各種の制御
を行おうとするものであるから、本願発明とはそ
の目的、構成及び作用効果が全く異なるものであ
る。 Furthermore, Japanese Utility Model Application No. 60-76099 discloses a printed board conveyance and positioning device, but this conventional example merely discloses that the printed circuit board is conveyed by a conveyor, and also has positioning holes in the board. Since it is intended to perform various controls by providing a positioning pin and inserting a positioning pin into it, the purpose, structure, and operation and effect thereof are completely different from the present invention.
目 的
本発明は、上記した従来技術の欠点を除くため
になされたものであつて、その目的とするところ
は、基板を載置して一方向に走行する広幅の平ベ
ルトと、該平ベルトの入口側を広く、出口側を狭
く規制して基板を所定位置の出口に誘導する一対
の基板誘導部材と、平ベルトの速度よりも大きな
速度で基板の側面に作用してその向きを整列させ
る一対の巻掛伝動部材とを備え、該一対の巻掛伝
動部材のうち平ベルトに対して傾斜して走行する
巻掛伝動部材の速度よりも該平ベルトに対して平
行に走行する巻掛伝動部材の速度を大きく設定す
ることによつて平ベルトに対して平行に走行する
巻掛伝動部材の大きな速度によつて平ベルトに対
して傾斜して搬送されつつある基板の傾きを修正
できるようにすることである。また上記構成によ
つてキヤリヤから分離された基板を人手を介すこ
となく、次工程、例えば二次半田付け装置に極め
て順調に搬入できるようにすることであり、また
これによつてデイツプ式半田付け装置と、噴流式
半田付け装置とを直線的に、かつ自動化ラインと
して接続できるようにし、作業者1名分の省力化
を図ると共に、生産能率を向上させることであ
る。Purpose The present invention was made in order to eliminate the drawbacks of the prior art described above, and its purpose is to provide a wide flat belt that carries a substrate and runs in one direction, and a wide flat belt that carries a substrate and runs in one direction. A pair of substrate guiding members that guide the substrates to a predetermined exit position by restricting the inlet side to be wide and the outlet side to be narrow, and act on the sides of the substrates at a speed higher than the speed of the flat belt to align the directions. a pair of wrapped transmission members, the wrapped transmission member runs parallel to the flat belt at a faster speed than the wrapped transmission member that runs at an angle with respect to the flat belt among the pair of wrapped transmission members. By setting the speed of the member high, it is possible to correct the inclination of the board that is being conveyed at an angle to the flat belt due to the high speed of the winding transmission member running parallel to the flat belt. It is to be. Furthermore, with the above configuration, the board separated from the carrier can be transported to the next process, for example, a secondary soldering device, without any manual intervention. The object of the present invention is to enable a soldering device and a jet soldering device to be connected linearly as an automated line, thereby saving the labor of one worker and improving production efficiency.
構 成
要するに本発明は、基板を載置して一方向に走
行する広幅の平ベルトと、該平ベルトの入口側を
広く出口側を狭く規制して前記基板を所定位置の
出口に誘導する一対の基板誘導部材と、該基板誘
導部材内に設けられ前記平ベルトの速度よりも大
きな速度で該基板の側面に作用してその向きを整
列させる一対の巻掛伝動部材とを備え、該一対の
巻掛伝動部材のうち前記平ベルトに対して傾斜し
て走行する巻掛伝動部材の速度よりも前記平ベル
トに対して平行に走行する巻掛伝動部材の速度を
大きく設定したことを特徴とするものである。Configuration In short, the present invention comprises: a wide flat belt on which a substrate is placed and runs in one direction; and a pair of flat belts that have an inlet side wide and an outlet side narrowly to guide the substrate to an exit at a predetermined position. a pair of winding transmission members provided in the substrate guiding member and acting on the side surfaces of the substrate at a speed greater than the speed of the flat belt to align the directions thereof; Among the wrapped transmission members, the speed of the wrapped transmission member that runs parallel to the flat belt is set higher than the speed of the wrapped transmission member that runs at an angle with respect to the flat belt. It is something.
以下本発明を図面に示す実施例に基いて説明す
る。本発明に係る基板の誘導搬送装置1は、広幅
の平ベルト2と、一対の基板誘導部材3,4と、
一対の巻掛伝動部材5,6とを備えている。 The present invention will be explained below based on embodiments shown in the drawings. A substrate guiding conveyance device 1 according to the present invention includes a wide flat belt 2, a pair of substrate guiding members 3 and 4,
A pair of winding transmission members 5 and 6 are provided.
広幅の平ベルト2は、基板9を載置して一方向
に矢印Aの如く走行するようにしたものであつ
て、布状の軟質ベルトで構成され、該軟質ベルト
は基板9に対する静電気の悪影響を及ぼさないよ
うな材質で構成されている。そして入口10に心
間距離調節機構11によつてその回転軸12が支
持された被動プーリ13と、出口14側において
同様に基台15に回動自在に支持され、適宜な駆
動源によつて駆動される駆動プーリ15とに巻き
掛けられている。そしてその幅は例えばデイツプ
式半田付け装置16の後部に設けられた基板分離
搬送装置18の出口19の幅と略等しく形成さ
れ、基板9がどのような位置からでも平ベルト2
の上に載置されるように広幅に形成されている。 The wide flat belt 2 is configured to run in one direction as shown by the arrow A on which the substrate 9 is placed, and is composed of a cloth-like soft belt, and the soft belt prevents the adverse effects of static electricity on the substrate 9. It is constructed of a material that does not cause A driven pulley 13 whose rotary shaft 12 is supported by a center-to-center distance adjustment mechanism 11 at the inlet 10, and a driven pulley 13 rotatably supported by a base 15 at the outlet 14 side and driven by an appropriate drive source. It is wound around the drive pulley 15 that is driven. The width thereof is, for example, approximately equal to the width of the outlet 19 of the substrate separating and conveying device 18 provided at the rear of the dip type soldering device 16, so that the substrate 9 can be attached to the flat belt 2 from any position.
It is formed wide so that it can be placed on top of it.
一対の基板誘導部材3,4は、平ベルト2の入
口10側を広く、出口14側を狭く規制して基板
9を所定位置の出口14に誘導するようにしたも
のであつて、基板誘導部材3は平ベルト2の走行
方向と平行に配設され、基板誘導部材4は第3図
に示すように入口10側が広く、出口14側が狭
くなるように傾斜して配設されている。 The pair of substrate guiding members 3 and 4 are configured to guide the substrate 9 to the outlet 14 at a predetermined position by restricting the flat belt 2 to be wide on the inlet 10 side and narrow on the outlet 14 side. 3 is disposed parallel to the traveling direction of the flat belt 2, and the substrate guiding member 4 is disposed in an inclined manner so that the inlet 10 side is wide and the outlet 14 side is narrow as shown in FIG.
一対の巻掛伝動部材5,6は、基板誘導部材
3,4内に夫々設けられており、平ベルト2の速
度よりも大きな速度で基板9の側面9aに作用し
てその向きを整列させるようにしたものであつ
て、巻掛伝動部材5は、例えば歯付ベルトで構成
され、平ベルト2の走行方向に平行に配設された
駆動プーリ20と被動プーリ21とに巻き掛けら
れており、平ベルト2の全長の約半分の長さの部
分にだけ配設されている。 The pair of winding transmission members 5 and 6 are provided in the board guide members 3 and 4, respectively, and act on the side surface 9a of the board 9 at a speed higher than the speed of the flat belt 2 to align the direction thereof. The wrapped transmission member 5 is made of, for example, a toothed belt, and is wrapped around a driving pulley 20 and a driven pulley 21 that are arranged parallel to the running direction of the flat belt 2. It is arranged only in a portion that is about half of the total length of the flat belt 2.
巻掛伝動部材6は、巻掛伝動部材5と同様に、
例えば歯付ベルトで構成され、駆動プーリ20と
同一の進行方向位置に配設された駆動プーリ22
と、該駆動プーリと平ベルト2の進行方向と平行
な位置に配設された中間プーリ23と、平ベルト
2の入口10付近に配設された被動プーリ24と
に巻き掛けられ、基板誘導部材4よりもその表面
が若干内側に突出して基板9の側面9aに対して
作用し得るように構成されている。そして駆動プ
ーリ20と22とはフレキシブルカツプリング2
6によつて連結されており、駆動プーリ20の矢
印B方向の回転に対して駆動プーリ22が矢印C
方向に逆回転し、結果として巻掛伝動部材6が巻
掛伝動部材5と同方向に矢印Dの如く走行するよ
うに構成され、又両駆動プーリ20,22の動力
伝達機構を非常に簡略なものとしている。また駆
動プーリ20の直径は駆動プーリ22の直径より
も若干大きく形成されているため、これらが同一
の回転速度で回転するので、平ベルト2に対して
平行して走行する巻掛伝動部材5の方が平ベルト
2に対して傾斜して走行する巻掛伝動部材6より
も若干速い速度で走行し、また巻掛伝動部材6の
速度も平ベルト2の速度よりも大きく設定されて
いる。 The wrapping power transmission member 6, like the wrapping power transmission member 5,
For example, a drive pulley 22 made of a toothed belt and disposed at the same position in the traveling direction as the drive pulley 20
The substrate guiding member is wound around an intermediate pulley 23 disposed parallel to the drive pulley and the direction of movement of the flat belt 2, and a driven pulley 24 disposed near the entrance 10 of the flat belt 2. 4, its surface is configured to protrude slightly inward so as to be able to act on the side surface 9a of the substrate 9. The driving pulleys 20 and 22 are flexible couplings 2
6, and when the drive pulley 20 rotates in the direction of arrow B, the drive pulley 22 rotates in the direction of arrow C.
As a result, the winding transmission member 6 is configured to travel in the same direction as the winding transmission member 5 as shown by arrow D, and the power transmission mechanism of both drive pulleys 20 and 22 is very simple. I take it as a thing. Further, since the diameter of the drive pulley 20 is formed to be slightly larger than the diameter of the drive pulley 22, they rotate at the same rotational speed, so that the wrapped transmission member 5 running parallel to the flat belt 2 can be rotated at the same rotation speed. The winding transmission member 6 runs at a slightly higher speed than the winding transmission member 6 which runs at an angle with respect to the flat belt 2, and the speed of the winding transmission member 6 is also set higher than the speed of the flat belt 2.
次に基板強制搬入装置8について説明する。こ
の基板強制搬入装置8は、巻掛伝動部材5,6及
び平ベルト2の出口14と自動半田付け装置、例
えば噴流式自動半田付け装置28の入口29との
間に配設されており、基板9の進行方向両側面9
aを強制搬送する複数のローラ31,32からな
るものである。このローラ31及び32は基板9
の進行方向両側に、例えば5乃至6個ずつ一列状
に配列され、適宜な駆動源によつてローラ31は
矢印B方向に、ローラ32は矢印C方向に同一の
回転速度で回転するように構成され、その周速度
は巻掛伝動部材5の周速度と同一に設定されてい
る。ローラ31,32の形状は第3図に示すよう
に、上下にフランジ部31a,32aが夫々形成
され、円筒部31bが凹陥して基板9の両側面9
aが該円筒部31b,32bに夫々当接して強制
的に一方向に搬送されるようにしたものである。
そして噴流式自動半田付け装置28の送り爪34
の溝34aに対して精度よく基板9を誘導して受
け渡すことができるように構成されている。 Next, the board forced loading device 8 will be explained. This board forced loading device 8 is disposed between the winding transmission members 5, 6 and the outlet 14 of the flat belt 2 and the inlet 29 of an automatic soldering device, for example, a jet type automatic soldering device 28, and Both sides in the direction of movement 9
It is made up of a plurality of rollers 31 and 32 that forcibly convey a. These rollers 31 and 32 are connected to the substrate 9
For example, five to six rollers are arranged in a line on both sides of the traveling direction, and the rollers 31 are rotated in the direction of arrow B and the rollers 32 are rotated in the direction of arrow C at the same rotational speed by an appropriate drive source. The circumferential speed thereof is set to be the same as the circumferential speed of the wrapped transmission member 5. As shown in FIG. 3, the shapes of the rollers 31 and 32 include upper and lower flange portions 31a and 32a, respectively, and a cylindrical portion 31b that is recessed so that both side surfaces 9 of the substrate 9 are formed.
a is forcibly conveyed in one direction by contacting the cylindrical portions 31b and 32b, respectively.
And the feed claw 34 of the jet type automatic soldering device 28
The structure is such that the substrate 9 can be accurately guided and delivered to the groove 34a.
また基板の誘導搬送装置1においては、平ベル
ト2が配設された基台15の水平面に対する傾斜
角度が自由に設定できるようにした平ベルト上下
機構35が設けられ、また基台15にはリンク3
6が枢軸38によつて枢着され、該リンク36の
一端には枢軸39を介して基板誘導部材4の一端
が回動自在に連結されている。そして該リンク3
6の回動操作によつて基板誘導部材4の水平方向
の傾斜角度を変化させることができるようになつ
ている。 Further, in the substrate guiding conveyance device 1, a flat belt up-and-down mechanism 35 is provided that allows the inclination angle of the base 15 on which the flat belt 2 is disposed relative to the horizontal plane to be freely set, and the base 15 is provided with a link. 3
6 is pivotally connected by a pivot 38, and one end of the substrate guiding member 4 is rotatably connected to one end of the link 36 via a pivot 39. And the link 3
The horizontal inclination angle of the substrate guiding member 4 can be changed by rotating the substrate guiding member 6 .
作 用
本発明は、上記のように構成されており、以下
その作用について説明する。例えばデイツプ式自
動半田付け装置16の基板分離搬送装置18の出
口19から第1図に示すように搬出されて来た基
板9は矢印Aの如く走行している平ベルト2上に
載置され、この場合には基板9は勝手な方向を向
いている。そしてもし基板9の前端面9bの角部
9dが基板誘導部材4の巻掛伝動部材6に当接す
ると、該巻掛伝動部材6の走行速度は平ベルト2
の走行速度よりも速いため、基板9は矢印A2の
如く反時計方向に若干回動し、側面9aが巻掛伝
動部材6と平行な向きに整列させられ、平ベルト
2及び巻掛伝動部材6によつて矢印A3の如く搬
送され、その後基板9の前端面9bの他の角部9
eが基板誘導部材3の巻掛伝動部材5に当接する
と、この巻掛伝動部材5の走行速度は巻掛伝動部
材6の走行速度よりも更に速いので、基板9は矢
印A4の如く時計方向に若干回動し、平ベルト2
の走行方向と平行に整列させられて矢印A5の如
く出口14に到達する。また基板9のどの部分が
基板誘導部材3又は巻掛伝動部材6に最初に到達
したとしても該基板9は必ず第5図に示すような
状態で整列させられながら搬送され、出口14に
到達するものである。Effects The present invention is configured as described above, and its effects will be explained below. For example, as shown in FIG. 1, the board 9 that has been carried out from the outlet 19 of the board separation and conveyance device 18 of the dip-type automatic soldering device 16 is placed on the flat belt 2 running as shown by arrow A. In this case, the substrate 9 is oriented in an arbitrary direction. If the corner 9d of the front end surface 9b of the board 9 comes into contact with the winding transmission member 6 of the board guiding member 4, the running speed of the winding transmission member 6 will be reduced by the flat belt 2.
, the base plate 9 rotates slightly counterclockwise as shown by arrow A2, and the side surface 9a is aligned parallel to the winding transmission member 6, and the flat belt 2 and the winding transmission member 6 are aligned. The substrate 9 is then transported in the direction of arrow A3 by the other corner portion 9 of the front end surface 9b of the substrate 9.
When e contacts the winding transmission member 5 of the board guide member 3, the running speed of the winding transmission member 5 is faster than the running speed of the winding transmission member 6, so the board 9 moves clockwise as indicated by arrow A4. flat belt 2.
are aligned parallel to the traveling direction of the vehicle and reach the exit 14 as indicated by arrow A5. Furthermore, no matter which part of the substrate 9 reaches the substrate guiding member 3 or the winding transmission member 6 first, the substrate 9 is always conveyed while being aligned in the state shown in FIG. 5, and reaches the outlet 14. It is something.
次にこのように整列させられた基板9を、例え
ば噴流式自動半田付け装置28の送り爪34の溝
34aに正確に受け渡す作用について説明する
と、基板9が矢印A5の如く進行すると、その側
面9aは一対のローラ31,32の円筒部31
b,32bに誘導されて、該円筒部によつて強制
的に搬送され、第4図に示すように送り爪34の
溝34a内に正確に受け渡され、その後は従来と
同様噴流式自動半田付け装置28において自動半
田付けが行われる。 Next, the function of accurately delivering the substrates 9 aligned in this way to the grooves 34a of the feeding claws 34 of the jet-type automatic soldering device 28, for example, will be explained. 9a is a cylindrical portion 31 of a pair of rollers 31, 32;
b, 32b, is forcibly conveyed by the cylindrical portion, and is accurately delivered into the groove 34a of the feed pawl 34 as shown in FIG. Automatic soldering is performed in the soldering device 28.
効 果
本発明は、上記のように基板を載置して一方向
に走行する広幅の平ベルトと、該平ベルトの入口
側を広く、出口側を狭く規制して基板を所定位置
の出口に誘導する一対の基板誘導部材と、平ベル
トの速度よりも大きな速度で該基板の側面に作用
してその向きを整列させる一対の巻掛伝動部材と
を備え、該一対の巻掛伝動部材のうち平ベルトに
対して傾斜して走行する巻掛伝動部材の速度より
も該平ベルトに対して平行に走行する巻掛伝動部
材の速度を大きく設定したので、平ベルトに対し
て平行に走行する巻掛伝動部材の大きな速度によ
つて平ベルトに対して傾斜して搬送されつつある
基板の傾きを修正できるという効果がある。また
上記構成によつてキヤリヤから分離された基板を
人手を介すことなく次工程、例えば二次半田付け
装置に極めて順調に搬入できるという効果があ
り、またこの結果デイツプ式半田付け装置と、噴
流式半田付け装置とを直線的に、かつ自動化ライ
ンとして接続できるようになり、作業者1名分の
省力化を図ることができると共に、生産能率を向
上させることができる効果がある。Effects The present invention has a wide flat belt that runs in one direction with a substrate placed thereon as described above, and the flat belt has a wide inlet side and a narrow outlet side so that the substrate can be placed at the exit at a predetermined position. A pair of board guiding members that guide the board, and a pair of winding transmission members that act on the side surfaces of the board at a speed higher than the speed of the flat belt to align the direction thereof, and of the pair of winding transmission members. Since the speed of the winding transmission member running parallel to the flat belt is set higher than the speed of the winding transmission member running at an angle to the flat belt, the winding transmission member running parallel to the flat belt The high speed of the hanging transmission member has the effect of correcting the inclination of the substrate that is being conveyed at an angle with respect to the flat belt. In addition, the above configuration has the effect that the board separated from the carrier can be transported to the next process, for example, a secondary soldering device, without any manual intervention. It becomes possible to connect the type soldering device linearly and as an automated line, which has the effect of saving the labor of one worker and improving production efficiency.
図面は本発明の実施例に係り、第1図は作業者
の立つ側から見た基板の誘導搬送装置の斜視図、
第2図は第1図と反対方向から見た基板の誘導搬
送装置の斜視図、第3図は第2図の−矢視概
略縦断面図、第4図は第2図の−矢視概略縦
断面図、第5図は基板の誘導搬送装置の平面図で
ある。
1は基板の誘導搬送装置、2は広幅の平ベル
ト、3,4は基板誘導部材、5,6は巻掛伝動部
材、8は基板強制搬入機構、9は基板、9aは側
面、10は入口、14は出口、29は自動半田付
け装置の入口、31,32はローラである。
The drawings relate to an embodiment of the present invention, and FIG. 1 is a perspective view of the substrate guiding conveyance device as seen from the side where an operator stands;
Fig. 2 is a perspective view of the substrate guiding conveyance device seen from the opposite direction to Fig. 1, Fig. 3 is a schematic longitudinal cross-sectional view taken in the direction indicated by the - arrow in Fig. 2, and Fig. 4 is a schematic longitudinal sectional view taken in the direction indicated by the - arrow in Fig. 2. The longitudinal sectional view and FIG. 5 are plan views of the substrate guiding conveyance device. 1 is a substrate guiding conveyance device, 2 is a wide flat belt, 3 and 4 are substrate guiding members, 5 and 6 are winding transmission members, 8 is a forced substrate loading mechanism, 9 is a substrate, 9a is a side surface, and 10 is an entrance , 14 is an outlet, 29 is an inlet of the automatic soldering device, and 31 and 32 are rollers.
Claims (1)
ルトと、該平ベルトの入口側を広く出口側を狭く
規制して前記基板を所定位置の出口に誘導する一
対の基板誘導部材と、該基板誘導部材内に設けら
れ前記平ベルトの速度よりも大きな速度で該基板
の側面に作用してその向きを整列させる一対の巻
掛伝動部材とを備え、該一対の巻掛伝動部材のう
ち前記平ベルトに対して傾斜して走行する巻掛伝
動部材の速度よりも前記平ベルトに対して平行に
走行する巻掛伝動部材の速度を大きく設定したこ
とを特徴とする基板の誘導搬送装置。1. A wide flat belt on which a substrate is placed and runs in one direction, and a pair of substrate guiding members that guide the substrate to an exit at a predetermined position by restricting the entrance side of the flat belt to be wide and the exit side to be narrow. a pair of winding transmission members provided in the substrate guiding member and acting on the side surface of the substrate at a speed higher than the speed of the flat belt to align the direction thereof; A guided conveyance device for substrates, characterized in that the speed of a winding power transmission member running parallel to the flat belt is set higher than the speed of the winding power transmission member running at an angle with respect to the flat belt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21291886A JPS6371052A (en) | 1986-09-10 | 1986-09-10 | Guide and conveying device for substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21291886A JPS6371052A (en) | 1986-09-10 | 1986-09-10 | Guide and conveying device for substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6371052A JPS6371052A (en) | 1988-03-31 |
| JPH0419149B2 true JPH0419149B2 (en) | 1992-03-30 |
Family
ID=16630437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21291886A Granted JPS6371052A (en) | 1986-09-10 | 1986-09-10 | Guide and conveying device for substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6371052A (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5143668A (en) * | 1974-10-14 | 1976-04-14 | Hitachi Ltd | |
| JPS5610730U (en) * | 1979-07-03 | 1981-01-29 | ||
| JPS6076099U (en) * | 1983-10-31 | 1985-05-28 | 富士通株式会社 | Printed board transport and positioning device |
-
1986
- 1986-09-10 JP JP21291886A patent/JPS6371052A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6371052A (en) | 1988-03-31 |
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