JPH041969B2 - - Google Patents
Info
- Publication number
- JPH041969B2 JPH041969B2 JP18622484A JP18622484A JPH041969B2 JP H041969 B2 JPH041969 B2 JP H041969B2 JP 18622484 A JP18622484 A JP 18622484A JP 18622484 A JP18622484 A JP 18622484A JP H041969 B2 JPH041969 B2 JP H041969B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- conductor
- photosensitive polymer
- sheet
- skeletal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 22
- 229920000642 polymer Polymers 0.000 claims description 22
- 239000002131 composite material Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 239000011888 foil Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 230000000873 masking effect Effects 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 239000002861 polymer material Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004944 Liquid Silicone Rubber Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010828 elution Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920003225 polyurethane elastomer Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Manufacture Of Switches (AREA)
- Manufacturing Of Electric Cables (AREA)
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は透明導電シートに関するものである。
更に、詳しく述べれば本発明はテジタル接点入力
タブレツト等の精密電気機器用構成材料としても
ちいられる透明導電シートの製造方法に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a transparent conductive sheet.
More specifically, the present invention relates to a method for producing a transparent conductive sheet that can be used as a constituent material for precision electrical equipment such as digital contact input tablets.
[従来の技術]
デジタル接点型入力タブレツト用透明感圧導電
シートでは、埋め込まれる導電体は出来るだけ細
く、そして出来るだけ薄い事が望ましい。しかし
従来の製造方法では埋め込まれる導電体は直径が
0.3mm以上であつた。即ち、従来の製造方法では、
透明シート上に多数の凹みラインを設け、その凹
みライン上に極めて細い導電体を埋め込んでゆく
ことが困難である。なお、この凹み部は電気接点
として利用する場合に接点間の隙間を構成するも
のである。[Prior Art] In a transparent pressure-sensitive conductive sheet for a digital contact type input tablet, it is desirable that the embedded conductor be as thin and as thin as possible. However, with conventional manufacturing methods, the diameter of the embedded conductor is
It was 0.3mm or more. That is, in the conventional manufacturing method,
It is difficult to provide a large number of recessed lines on a transparent sheet and embed extremely thin conductors onto the recessed lines. Note that this recessed portion constitutes a gap between the contacts when used as an electrical contact.
[発明が解決しようとする問題点]
本発明はかかる点に立つて為されたものであつ
て、その目的とするところは極めて薄く、しかも
極めて細い導電体を埋め込んで成る透明導電シー
トの製造方法を提供する事にある。[Problems to be Solved by the Invention] The present invention has been made based on this point, and its purpose is to provide a method for manufacturing a transparent conductive sheet that is extremely thin and has extremely thin conductors embedded therein. The goal is to provide the following.
[問題点を解決するための手段]
本発明の要旨とするところは、
(a) 基材シート上に感光性ポリマー層が設けられ
ており、該感光性ポリマー層の上層に金属箔層
が設置けられて成る複合シートがあり、該複合
シートの前記金属箔層の導電部となる部分にマ
スキング層を張り付けた後、被マスキング部分
をエツチング処理する工程と、
(b) 前記複合シートの感光性ポリマー層の上にエ
ツチングにより残された導電部の周辺にマスキ
ング層を張り付けた後、被マスキング部分を照
射、溶出させることにより骨格導電体とする工
程と、
(c) 前記骨格導電体を透明液状高分子材料で埋め
込み成形させることにより埋め込み骨格導電体
とする工程と、
(d) 前記埋め込み骨格導電体の感光性ポリマー層
を照射した後、前記感光性ポリマー層と前記基
材シート層とを溶出、除去する工程、
とから製造することを特徴とする電気接点用透明
導電シートの製造方法にある。[Means for Solving the Problems] The gist of the present invention is as follows: (a) A photosensitive polymer layer is provided on a base sheet, and a metal foil layer is provided on the photosensitive polymer layer. There is a composite sheet consisting of a composite sheet, and a step of applying a masking layer to a portion of the composite sheet that will become a conductive portion of the metal foil layer, and then etching the masked portion; (c) forming a skeletal conductor by pasting a masking layer around the conductive part left on the polymer layer by etching, and then irradiating and eluting the masked part; (c) converting the skeletal conductor into a transparent liquid; (d) After irradiating the photosensitive polymer layer of the embedded skeletal conductor, the photosensitive polymer layer and the base sheet layer are eluted; A method of manufacturing a transparent conductive sheet for electrical contacts, comprising the steps of: , removing the sheet.
本発明において、基材シートとしては金属シー
ト、プラスチツクシート、ガラス板等が用いられ
る。感光性ポリマー層としてはポジ型レジストが
適切である。 In the present invention, a metal sheet, a plastic sheet, a glass plate, etc. are used as the base sheet. A positive resist is suitable as the photosensitive polymer layer.
本発明において、金属箔としては、アルミ箔、
銅箔、銀箔、金箔あるいは金属蒸着膜等を用いる
事ができる。本発明において、液状高分子材料と
しては室温において液状であつて触媒添加あるい
は加熱によつて硬化し、透明シートとなるものな
らどのようなものでもよく、例えば、透明液状シ
リコンゴム、透明ポリウレタンゴム、液状ボリブ
ダジエン、液状エポキシ樹脂、不飽和ポリエステ
ル樹脂等がある。 In the present invention, the metal foil includes aluminum foil,
Copper foil, silver foil, gold foil, metal vapor deposition film, etc. can be used. In the present invention, the liquid polymer material may be any material that is liquid at room temperature and cures by adding a catalyst or heating to form a transparent sheet, such as transparent liquid silicone rubber, transparent polyurethane rubber, Examples include liquid bolybdadiene, liquid epoxy resin, and unsaturated polyester resin.
[作用]
本発明の作用効果は、特殊な複合シートを用い
てエツチング処理して得た極めて薄くしかも極め
て細い導電体を透明液状高分子材料にスムーズに
しかも整然と埋め込むことにある。更に電気接点
として必要な導電体間の隙間を構成するための凹
部を任意の形状で作ることができる。この為得ら
れた透明導電シートを2枚組合せて入力ダブレツ
ト等に用いたときは、見易くしかも精度の高い入
力作業が出来るのである。[Function] The effect of the present invention is to smoothly and orderly embed an extremely thin and extremely fine conductor obtained by etching a special composite sheet into a transparent liquid polymer material. Furthermore, the recessed portions for configuring the gaps between the conductors necessary as electrical contacts can be formed in any shape. Therefore, when two of the obtained transparent conductive sheets are combined and used for an input doublet, etc., it is possible to perform input operations that are easy to see and highly accurate.
[実施例]
次に本発明の透明導電シートの製造方法の一実
施例について、図面により説明する。[Example] Next, an example of the method for manufacturing a transparent conductive sheet of the present invention will be described with reference to the drawings.
第1図〜第5図は、本発明の透明導電シートの
製造方法の一実施例を示した説明図であり、第6
図はその平面図である。 1 to 5 are explanatory diagrams showing one embodiment of the method for manufacturing a transparent conductive sheet of the present invention, and FIG.
The figure is a plan view thereof.
第1図〜第6図において、1は基材、2は感光
性ポリマー、2′は照射、溶出処理し得た感光性
ポリマー層の残存部、3は金属箔、3′は金属箔
をエツチング処理して得た導電体、4は透明高分
子シートである。 In Figures 1 to 6, 1 is the base material, 2 is the photosensitive polymer, 2' is the remaining part of the photosensitive polymer layer that has been irradiated and eluted, 3 is the metal foil, and 3' is the etched metal foil. The conductor 4 obtained by the treatment is a transparent polymer sheet.
第1図は基材の透明ガラス板1の上に感光性ポ
リマーのポジ型レジストを厚さ0.3mmとなるよう
に塗布し、その上層に透明接着材を介して厚さ
0.05mmの銅箔を接着して成る複合シートを示した
ものである。第2図は第1図の複合シートの金属
箔層をマスキング及びエツチング処理して、幅
0.1mmの導電体3′としたものである。第3図は第
2図の導電体付き複合シートの感光性ポリマー層
をマスキング、照射、溶出処理して骨格導電体と
したものである。 In Figure 1, a photosensitive polymer positive resist is applied to a thickness of 0.3 mm on a transparent glass plate 1 as a base material, and the upper layer is coated with a transparent adhesive material to a thickness of 0.3 mm.
This shows a composite sheet made by bonding 0.05mm copper foil. Figure 2 shows the width of the composite sheet shown in Figure 1 after masking and etching the metal foil layer.
The conductor 3' is 0.1 mm thick. FIG. 3 shows the photosensitive polymer layer of the conductor-attached composite sheet of FIG. 2 subjected to masking, irradiation, and elution treatments to form a skeletal conductor.
第4図は第3図の骨格導電体に上部より透明液
状シリコンゴムを流し込み、120℃60分加熱成型
したものである。 Figure 4 shows a transparent liquid silicone rubber poured into the skeletal conductor shown in Figure 3 from above and heated and molded at 120°C for 60 minutes.
第5図は第4図の成形物のうち基材1及び感光
性ポリマ層残存部2′を照射、溶出、除去するこ
とにより、透明導電シートを得たものである。な
お、導電体の表面は必要に応じて貴金属のメツキ
をすることが望ましい。第5図において、透明シ
ートの厚さは0.7mm、凹みは幅3mm、深さ0.3mmで
ある。また、導電体は幅0.1mm、厚さ0.05mmであ
る。 FIG. 5 shows a transparent conductive sheet obtained by irradiating, eluting and removing the base material 1 and the remaining portion 2' of the photosensitive polymer layer of the molded product shown in FIG. Note that it is desirable that the surface of the conductor be plated with a noble metal if necessary. In FIG. 5, the thickness of the transparent sheet is 0.7 mm, and the recess is 3 mm wide and 0.3 mm deep. Further, the conductor has a width of 0.1 mm and a thickness of 0.05 mm.
[発明の効果]
本発明の透明導電シートの製造方法によれば、
極めて薄くしかも極めて細い導電体を埋め込んだ
透明導電シートが容易に製造することが出来るも
のであり、工業上有用なものである。[Effect of the invention] According to the method for manufacturing a transparent conductive sheet of the present invention,
A transparent conductive sheet embedded with extremely thin and extremely thin conductors can be easily produced and is industrially useful.
第1図は基材の透明ガラス板1の上に感光性ポ
リマーのポジ型レジストを厚さ0.3mmとなるよう
に塗布し、その上層に透明接着材を介して厚さ
0.05mmの銅箔を接着して成る複合シートを示した
断面図、第2図は第1図の複合シートの金属箔層
をマスキング及びエツチング処理して、幅0.1mm
の導電体3′とした導電体付き複合シートの断面
図、第3図は第2図の導電体付き複合シートの感
光性ポリマー層をマスキング、照射、溶出処理し
て得た骨格導電体の断面図、第4図は第3図の骨
格導電体の上部より透明液状シリコンゴムを流し
込み、120℃60分加熱成形して得た成形物の断面
図、第5図は第4図の成形物のうち基材1及び感
光性ポリマ残存部2′を照射、溶出、除去して得
た透明導電シートの断面図、第6図はその平面図
である。
1:基材、2:感光性ポリマ、3:金属箔、
4:透明高分子。
In Figure 1, a photosensitive polymer positive resist is applied to a thickness of 0.3 mm on a transparent glass plate 1 as a base material, and the upper layer is coated with a transparent adhesive material to a thickness of 0.3 mm.
A cross-sectional view showing a composite sheet made by adhering 0.05 mm copper foil. Figure 2 shows the metal foil layer of the composite sheet in Figure 1 which has been masked and etched to a width of 0.1 mm.
Figure 3 is a cross-sectional view of a skeletal conductor obtained by masking, irradiation, and elution treatment of the photosensitive polymer layer of the conductor-attached composite sheet of Figure 2. Figure 4 is a cross-sectional view of the molded product obtained by pouring transparent liquid silicone rubber from the top of the skeletal conductor shown in Figure 3 and heating and molding it at 120°C for 60 minutes, and Figure 5 is a cross-sectional view of the molded product shown in Figure 4. FIG. 6 is a cross-sectional view of a transparent conductive sheet obtained by irradiating, eluting, and removing the base material 1 and the photosensitive polymer remaining portion 2', and FIG. 6 is a plan view thereof. 1: Base material, 2: Photosensitive polymer, 3: Metal foil,
4: Transparent polymer.
Claims (1)
られており、該感光性ポリマー層の上層に金属
箔層が設けられて成る複合シートがあり、外複
合シートの前記金属箔層の導電部となる部分に
マスキング層を張り付けた後、被マスキング部
分をエツチング処理する工程と、 (b) 前記複合シートの感光性ポリマー層の上にエ
ツチングにより残された導電部の周辺にマスキ
ング層を張り付けた後、非マスキング部分を照
射、溶出させることにより骨格導電体とする工
程と、 (c) 前記骨格導電体を透明液状高分子材料で埋め
込み成形させることにより埋め込み骨格導電体
とする工程と、 (d) 前記埋め込み骨格導電体の感光性ポリマー層
を照射した後、前記感光性ポリマー層と前記基
材シート層とを溶出除去する工程、 とから製造することを特徴とする電気接点用透明
導電シートの製造方法。[Scope of Claims] 1 (a) There is a composite sheet in which a photosensitive polymer layer is provided on a base sheet, a metal foil layer is provided on the upper layer of the photosensitive polymer layer, and the outer composite sheet is After applying a masking layer to the part of the metal foil layer that will become the conductive part, etching the part to be masked; (b) removing the conductive part left on the photosensitive polymer layer of the composite sheet by etching; After pasting a masking layer around the periphery, the non-masking portion is irradiated and eluted to form a skeletal conductor; (c) The skeletal conductor is embedded and molded with a transparent liquid polymer material to form an embedded skeletal conductor. (d) After irradiating the photosensitive polymer layer of the embedded skeletal conductor, the photosensitive polymer layer and the base sheet layer are eluted and removed. A method for producing a transparent conductive sheet for electrical contacts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18622484A JPS6164020A (en) | 1984-09-05 | 1984-09-05 | Method for manufacturing transparent conductive sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18622484A JPS6164020A (en) | 1984-09-05 | 1984-09-05 | Method for manufacturing transparent conductive sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6164020A JPS6164020A (en) | 1986-04-02 |
| JPH041969B2 true JPH041969B2 (en) | 1992-01-16 |
Family
ID=16184530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18622484A Granted JPS6164020A (en) | 1984-09-05 | 1984-09-05 | Method for manufacturing transparent conductive sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6164020A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2556711B2 (en) * | 1987-09-16 | 1996-11-20 | 日本写真印刷株式会社 | Membrane switch manufacturing method |
| JP5179244B2 (en) * | 2008-04-30 | 2013-04-10 | 三菱アルミニウム株式会社 | Aluminum foil for circuit and method for manufacturing circuit material |
-
1984
- 1984-09-05 JP JP18622484A patent/JPS6164020A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6164020A (en) | 1986-04-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH041969B2 (en) | ||
| JP7465893B2 (en) | Manufacturing method of wiring board, wiring board, manufacturing method of molded product, and molded product | |
| JPS61188957A (en) | Manufacture of circuit module | |
| US3669773A (en) | Method of producing semiconductor devices | |
| JPH02139216A (en) | Molding method of three-dimensional molding circuit | |
| JP2959874B2 (en) | Lead frame manufacturing method | |
| JPS6164021A (en) | Manufacturing method of contact component material | |
| US2823286A (en) | Contacts for electrical circuits and methods for making same | |
| JPS61156792A (en) | Manufacture of circuit module | |
| JPH0563096B2 (en) | ||
| JPH0917691A (en) | Flexible film capacitor | |
| JPH01266789A (en) | Manufacture of molded circuit board | |
| JPS61194795A (en) | Manufacture of printed wiring board | |
| JPH0387089A (en) | Film for forming circuit pattern and manufacture of circuit board | |
| JPS61170091A (en) | Printed wiring board manufacturing method | |
| JPS5818238A (en) | Manufacture of anisotropically conductive elastomer sheet | |
| JPS60162783A (en) | Manufacture of die | |
| JPH1097054A (en) | Production of three-dimensional photomask | |
| JPS6313400A (en) | Injection-molded unit with transcripted circuit | |
| JPH0260006A (en) | Manufacturing method of conductive sheet | |
| JPH0325886B2 (en) | ||
| JPS60211715A (en) | Tact key switch and method of producing same | |
| JPH0137877B2 (en) | ||
| KR20210121482A (en) | Metal Patterned Flexible Material and Metal Patterning Method of the Same | |
| JPH0425143A (en) | Circuit board and semiconductor device |