JPH04199900A - Method of positioning surface mounting device - Google Patents

Method of positioning surface mounting device

Info

Publication number
JPH04199900A
JPH04199900A JP2336170A JP33617090A JPH04199900A JP H04199900 A JPH04199900 A JP H04199900A JP 2336170 A JP2336170 A JP 2336170A JP 33617090 A JP33617090 A JP 33617090A JP H04199900 A JPH04199900 A JP H04199900A
Authority
JP
Japan
Prior art keywords
tray
smd
positioning
pocket
mounting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2336170A
Other languages
Japanese (ja)
Inventor
Tsunenori Umetsu
梅津 恒徳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2336170A priority Critical patent/JPH04199900A/en
Publication of JPH04199900A publication Critical patent/JPH04199900A/en
Pending legal-status Critical Current

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  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、面実装形素子(以下、SMDという)をハ
ンドリングして正確に、ソケットへ置く時の方法に関す
るものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for handling and accurately placing a surface mount device (hereinafter referred to as SMD) in a socket.

〔従来の技術〕[Conventional technology]

第3図(al 、 (blはSMDがトレイに収納され
た時の様子を示めす平面図及び断面図であり、図におい
て、(1)はトレイ、(2)は8 M D、 t8)t
i )レイ内のポケット、(4)はポケットの壁、(6
)はSMDのリード、+61 、 fγ)はポケット壁
(4)との隙間である。
FIG. 3 (al, (bl) is a plan view and a cross-sectional view showing the state when the SMD is stored in the tray. In the figure, (1) is the tray, (2) is the 8MD, t8)t
i) Pocket inside the lei, (4) is the wall of the pocket, (6
) is the SMD lead, +61, fγ) is the gap with the pocket wall (4).

第4図はj9 M Dの位置決め方法を示す図であり、
図において、(8)はSMD吸着ヘッド、(9)は位置
決め台、CO)はソケットである。
FIG. 4 is a diagram showing the positioning method of j9 MD,
In the figure, (8) is an SMD suction head, (9) is a positioning table, and (CO) is a socket.

次に動作について説明する。トレイ(1)に収納でれた
S M D (2)は、ポケット壁(4)との間に隙間
(6)7Cγ)があり、そのまま吸着ヘッド(8)によ
り吸着し、ソケット等の決められた場所へ移動していて
も吸着時に位置がずれており、正確に置くことができな
かった。
Next, the operation will be explained. There is a gap (6) 7Cγ) between the SMD (2) stored in the tray (1) and the pocket wall (4), and the SMD (2) is adsorbed by the suction head (8) as it is, and is inserted into the socket etc. Even when I moved it to a new location, the position shifted when it was picked up, so I couldn't place it accurately.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来のトレイ(1)に入ったS M D (2)の位置
決めは第4図のごとく吸着後、−度位置決め台(9)に
落下させテーパーを利用して!E M D (2)のセ
ンターリングを行ない位置決めし、再度吸着してソケッ
ト10)へ移動、挿入を行なう必要があり、そのために
操作の回数が増えたり、回数増によるリード曲りが発生
する等の問題点があった。
To position the SMD (2) in the conventional tray (1), as shown in Figure 4, after suctioning it, drop it onto the -degree positioning table (9) and use the taper! E M D It is necessary to perform centering (2), position it, adsorb it again, move it to the socket 10), and insert it, which may increase the number of operations and lead bending due to the increased number of operations. There was a problem.

この発明は、上記の問題点を解消するためになされたも
ので、簡単な1度の操作でトレイ(1)上のS M D
 (2)を全数同時に位置決めすることができる面実装
形素子の位置決め方法を得ることを目的とする。
This invention was made in order to solve the above problems, and the SMD on the tray (1) can be stored in one simple operation.
(2) It is an object of the present invention to obtain a method for positioning surface-mounted devices that can position all devices simultaneously.

〔課題を解決するための手段〕[Means to solve the problem]

この発明に係る、SMDの位置決め方法は、トレイに収
納された面実装形素子を、上記トレイから取り出してソ
ケット等に納める時、遠心力、慣性により上記トレイ内
のポケットの壁にリードを当て整列1位置決めするもの
である。
In the SMD positioning method according to the present invention, when a surface mount device housed in a tray is taken out from the tray and placed in a socket etc., the leads are aligned against the wall of the pocket in the tray by centrifugal force and inertia. 1 positioning.

〔作用〕[Effect]

この発明における位置決め方法は、ロータl)−アクチ
ュエータの回転力でトレイを振り遠心力を発生させポケ
ット中のSMDを外側へ移動させる。
In the positioning method of the present invention, the tray is shaken by the rotational force of the rotor l)-actuator to generate centrifugal force and move the SMD in the pocket to the outside.

〔実施例〕〔Example〕

以下、この発明を図に基づいて説明する。第1図はこの
発明の一実施例によるSMDの位置決め装置を示す構成
図であり、図において、(1)はトレイ、(2)はSM
D、σDはロータリーアクチュエータ、αzはカム、C
131Hロツカーアーム、1141idロツカーアーム
の支点、σ51はトレイ受けである。
Hereinafter, this invention will be explained based on the drawings. FIG. 1 is a block diagram showing an SMD positioning device according to an embodiment of the present invention. In the figure, (1) is a tray, and (2) is an SM
D, σD are rotary actuators, αz is cam, C
The fulcrum of the 131H rocker arm and 1141id rocker arm, σ51 is the tray holder.

第2図(aj 、 (blは第1図の装置で位置決め操
作を実施した後の状態を示す平面図及び断面図であり、
図において、(8)はポケット、C4)はポケット壁、
(5)はSMI)リード、(61) 、 (71)は位
置決め操作後の隙間である。
FIG. 2 (aj, (bl) is a plan view and a cross-sectional view showing the state after the positioning operation is performed with the device in FIG. 1,
In the figure, (8) is a pocket, C4) is a pocket wall,
(5) is the SMI lead, and (61) and (71) are the gaps after the positioning operation.

ロータリーアクチュエータ[111の起動でその軸に取
り付けられたカムσ2が回転してロッカーアーム(13
1を駆動きせる。ロッカーアーム(131は支店[14
1を中心にトレイ受け[151を大きく回転舌せ、トレ
イ(1)上のポケットの中に納まっているS M D 
(2)も−緒に回転させ遠心力を発生させる。そこで、
ロータリーアクチュエータσDの回転が止まるとS M
 D C2)は慣性によりポケット(8)内のポケット
壁(4)に打ち当り、全てのポケット(8)に入ったS
 M D (2)はポケット壁(4)基準で隙間(61
)は0になり整列、位置決めされる。
When the rotary actuator [111 is activated, the cam σ2 attached to its shaft rotates, causing the rocker arm (13
Drive 1. Rocker arm (131 is the branch [14
Rotate the tray holder [151] around 1, and the S M D
(2) Rotate together to generate centrifugal force. Therefore,
When rotary actuator σD stops rotating, S M
D C2) hits the pocket wall (4) in pocket (8) due to inertia, and S enters all pockets (8).
M D (2) is the gap (61
) becomes 0 and is aligned and positioned.

また、上記実施例では、ロータリーアクチュエータとロ
ッカーアームについて説明したが、駆動はエアシリンダ
ーでもよく、剛力の伝達は支点を使わず作用点で板カム
を使用して、そのガイドにより遠心力を発生する場合で
もよく、上記実施例と同様の効果を奏するっ 〔発明の効果〕 以上のように、この発明によれば、トレイがらSMDを
外へ取り出すことなく位置決めができる様にしたので、
トレイに入ったSMDであれば、位置決め台等の交換部
品を使用することなく、精度の高い位置決めをすること
ができ、ハンドリンク回数酸によるリード曲りの発生も
なくなる効果がある。
Furthermore, in the above embodiment, a rotary actuator and a rocker arm were explained, but an air cylinder may be used for driving, and a plate cam is used at the point of action without using a fulcrum to transmit rigid force, and centrifugal force is generated by the guide of the plate cam. [Effects of the Invention] As described above, according to the present invention, positioning can be performed without taking out the SMD from the tray.
If the SMD is placed in a tray, it is possible to perform highly accurate positioning without using replacement parts such as a positioning stand, and there is an effect that bending of the lead due to the number of hand links is eliminated.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の一実施例によるSMDの位置決め装
置を示す構成図、第2図tal 、 (blは第1図の
装置で位置決め操作を実施した後の状態を示す平面図及
び断面図、第3図ial 、 (blはSMDがトレイ
に収納された時の様子を示めす平面図及び断面図、第4
図はSMDの位置決め方法を示す図である。 図において、(1)はトレイ、(2)はSMD、(81
f’i、)ポケット、C4)はポケットの壁、σBはロ
ータリーアクチュエータ、(1′2ハカム、Uはロッカ
ーアーム、Iはロッカーアーム支点、G51はトレイ受
けである。 なお、各図中、同一符号は同一または相当部分を示す。
FIG. 1 is a configuration diagram showing an SMD positioning device according to an embodiment of the present invention, FIG. Figure 3 ial, (bl is a plan view and cross-sectional view showing how the SMD is stored in the tray,
The figure is a diagram showing a method for positioning an SMD. In the figure, (1) is a tray, (2) is an SMD, (81
f'i, ) pocket, C4) is the wall of the pocket, σB is the rotary actuator, (1'2 hakam, U is the rocker arm, I is the rocker arm fulcrum, and G51 is the tray holder. Note that the same parts are shown in each figure. Codes indicate the same or equivalent parts.

Claims (1)

【特許請求の範囲】[Claims] トレイに収納された面実装形素子を、上記トレイから取
り出してソケット等に納める時、遠心力,慣性により上
記トレイ内のポケットの壁にリードを当て整列,位置決
めすることを特徴とする面実装形素子の位置決め方法。
A surface mount type device that is characterized in that when a surface mount type element stored in a tray is taken out from the tray and placed in a socket or the like, the leads are aligned and positioned by applying centrifugal force and inertia to the walls of the pockets in the tray. How to position the element.
JP2336170A 1990-11-29 1990-11-29 Method of positioning surface mounting device Pending JPH04199900A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2336170A JPH04199900A (en) 1990-11-29 1990-11-29 Method of positioning surface mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2336170A JPH04199900A (en) 1990-11-29 1990-11-29 Method of positioning surface mounting device

Publications (1)

Publication Number Publication Date
JPH04199900A true JPH04199900A (en) 1992-07-21

Family

ID=18296393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2336170A Pending JPH04199900A (en) 1990-11-29 1990-11-29 Method of positioning surface mounting device

Country Status (1)

Country Link
JP (1) JPH04199900A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018179316A1 (en) * 2017-03-31 2018-10-04 株式会社Fuji Component supply device
WO2022249431A1 (en) * 2021-05-28 2022-12-01 東北マイクロテック株式会社 Alignment tray, alignment device, and alignment method

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018179316A1 (en) * 2017-03-31 2018-10-04 株式会社Fuji Component supply device
JPWO2018179316A1 (en) * 2017-03-31 2019-11-14 株式会社Fuji Parts supply device
WO2022249431A1 (en) * 2021-05-28 2022-12-01 東北マイクロテック株式会社 Alignment tray, alignment device, and alignment method
US20220384225A1 (en) * 2021-05-28 2022-12-01 Tohoku-Microtec Co., Ltd. Alignment-assisting tray, alignment-control apparatus and alignment method
JPWO2022249431A1 (en) * 2021-05-28 2022-12-01
CN115699276A (en) * 2021-05-28 2023-02-03 东北微科技株式会社 Alignment bracket, alignment device and alignment method
EP4120327A4 (en) * 2021-05-28 2024-03-06 Tohoku-Microtec Co., Ltd ALIGNMENT PLATE, ALIGNMENT DEVICE AND ALIGNMENT METHOD
US12327742B2 (en) 2021-05-28 2025-06-10 Tohoku-Microtec Co., Ltd. Alignment-assisting tray, alignment-control apparatus and alignment method

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