JPS63178590A - Electronic component automatic mounting device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an automatic electronic component mounting apparatus for mounting electronic components such as chips onto a circuit board constituting a circuit of an electronic device.

Conventional technology Conventionally, various chip-type electronic components &, ~a4 as shown in Fig. 10, A9, No., No. 2, ~A4 have been continuously formed with a large number of storage recesses 2L5 as shown in Fig. 11 at equal intervals. Mounted paper 2L
6. When the electronic component is supplied to the user in a taped form wrapped using adhesive tape A7 and wound around a reel, and the electronic component packaged in this taped form is mounted on a printed circuit board,
An electronic component automatic mounting device of the type shown in FIG. 12 is commercially available and in use.

In the electronic component automatic mounting apparatus shown in FIG. 12, a component shelf 1 on which various electronic components are mounted is movable in two directions, and the component to be mounted is selected. After the mounting chuck 3 picks up the electronic component at the person's position, the turntable 4 rotates, and at the position B, the positioning claw 7 clamps the electronic component, and then the positioning claw 7 is mounted on the positioning tool. After the tool 6 rotates to determine the mounting direction and the positioning claw 7 is opened to complete positioning of the electronic component, at position C (4
, a mounting chuck 3 is lowered onto the printed circuit board 2 on the x-y table 5 to perform mounting.

Problems to be Solved by the Invention According to this configuration, the mounting chuck 3 attracts the electronic component and the positioning claws 7 rotate after gripping the electronic component, so the positioning speed does not increase, and the mounting chuck 3
As the electronic components are kneaded and rotated at the tip of the electronic component, the mounting chuck 3 is severely worn and there is only one mounting chuck 3. There was a drawback that a dedicated electronic component automatic mounting device was required.

The present invention aims to eliminate such conventional drawbacks, and provides an automatic electronic component mounting device that can mount electronic components of different shapes onto a printed circuit board with a single machine and can mount them at high speed. The purpose is to

Means for solving the melting point problem In order to solve this problem, the electronic component automatic mounting apparatus of the present invention includes an X-Y table for positioning the circuit board, and a horizontally A movable parts shelf, a rotating turntable arranged between the parts shelf and the X-Y table, and a freely rotatable rotary table attached to the outer circumference of the turntable at equally spaced positions; It consists of a plurality of mounting chucks of different shapes placed on the outer circumference of the rotary table, a plurality of drive systems installed around the turntable, and a positioning jig placed around the turntable. According to the data on the shape of the electronic component among the plurality of mounting chucks, the rotary table is rotated by the operating drive system, and one selected mounting chuck operates to pick up the electronic component from the component shelf. The mounting direction of the mounting chuck is selected by a drive system driven by data on the mounting direction of the electronic component, and the electronic component is positioned using a rotatable positioning jig to select the mounting direction of the electronic component.
Electronic components are mounted on the circuit board on the XY table.

Function: Since this configuration has multiple mounting chucks with different shapes, it is possible to mount electronic components with different shapes using only this device, and selection of the mounting direction is also performed at a separate station from positioning. Therefore, it is possible to increase the mounting speed, and since the mounting chuck is selected in the mounting direction and then positioned, there is no rubbing between the mounting chuck and the electronic component, and the life of the mounting chuck can be extended.

Embodiment First, the basic configuration of an electronic component automatic mounting apparatus according to the present invention is shown in FIG. This electronic component automatic mounting device includes an X-Y table 10 that moves and positions a mounted circuit board 18 in the directions of arrows X and Y, and an X-Y table 10 that is installed near the A parts shelf 8 movable in the same direction as the X direction) and an arrow ? A turntable 11 that performs rotation indexing in a direction, a rotatable rotary table 12 that is attached to a plurality of locations on the turntable 11, and a plurality of mounting chucks 131L that are movable up and down and arranged around the outer periphery of the rotary table 12. 136
It is composed of a mounting chuck selection drive system 14, a mounting direction selection drive system 16, and a rotatable positioning jig 18, 17, which are installed on the outer periphery of the turntable 11. As the turntable 11 moves, the rotary table 12 at station D is rotated by a drive system 14 driven based on data on the shape of the electronic component 19 to be mounted, and is rotated by one of the mounting chucks 133 to 13θ. Select. This selected one mounting chuck 13m operates to pick up the electronic component 19 on the component shelf 8 at the position E, and at the position F, the drive system 15 driven based on data on the mounting direction of the electronic component picks up the electronic component 19. Rotate the mounting chuck 131L that is sucking the component 19, select the mounting direction,
At positions F to G and FNH, the positioning jig 16 is rotated and selected in accordance with the above mounting direction selection while the turntable 11 is moving, and at positions G and H, the positioning claws 20 on the positioning jig 16 are used to select the positioning jig 16. The mounting chuck 13a is lowered at the position where the electronic component 19 is sandwiched and positioned, and the mounting of the electronic component 19 onto the circuit board 18 to which the adhesive has been adhered is completed.

Next, a specific embodiment of the electronic component automatic mounting apparatus according to the present invention will be described with reference to FIGS. 2 to 9, with the same numbers assigned to the same parts.

As shown in the side view of FIG. 2, the automatic electronic component mounting apparatus of the present invention is roughly composed of an X-Y table 1o, a mounting mechanism section 9, and a component shelf 8. Now, X-
The Y table 10 is moved by a servo motor or the like in the depth direction of the mounting device (in the direction of the arrow Y in FIG. 1).
An X-table 22 that moves in a direction perpendicular to the X-table (in the direction of arrow X in FIG. 1) is provided, and a rail 23 for holding a printed circuit board 18 is attached to the X-table 22. There is.

Next, the parts shelf 8 in Fig. 1 is shown in Fig. 1o, A1B, No.

2, various electronic components 19 are mounted in a taped form as shown in FIG.
It has a structure that allows movement and positioning in the direction (Fig. 1) using a servo motor or the like. Here, the electronic components 19 mounted on the component shelf 8 are sequentially sent out as they are taken out by suction.

As shown in the side view of FIG. 2, the mounting mechanism section 9 is composed of a mounting head section 26, a driving section 27, and positioning jigs 16 and 17. The structure of the mounting head section 26 is shown in an enlarged view in FIG.

The chuck shapes of the mounting chucks 131L to 1315 are respectively matched to the shapes of the mounted parts, and have different shapes. These different mounting chucks 13 & - 1361 are attached to the rotary table 12 so as to be movable up and down, and are always urged upward by a spring 28. Further, the rotary table 12 is structured to rotate around a support shaft 40, and is arranged at equally spaced positions on the turntable 11.

Next, a selection mechanism for the mounting chucks 13 & - 13θ is shown in FIGS. 1 and 3.

The rotary table 12 has been completely installed in Fig. 1.
At position D, as shown in FIG. 3, the swinging arm 31 is swung by a drive source 32 such as an air cylinder, and the gear 29 and the gear portion of the rotary table 12 are engaged with each other. The pulse motor 30 driven by the shape data of the electronic component rotates the gear 29 to rotate the rotary table 12 and select one of the mounting chucks 132L to 13el.

Next, a positioning mechanism for the mounting chuck 13 in the mounting direction is shown in FIGS. 1 and 4.

In FIG. 1, the selected mounting chuck 13 attracts the electronic component 19 at position E, and at position F, the swinging arm 35 is moved by a drive source 36 such as an air cylinder as shown in FIG.
is oscillated, the roller 33 contacts the upper part of the mounting chuck 13, and the roller 33 is rotated by a drive source 34 such as a pulse motor operated according to data on the mounting direction of the electronic component, thereby rotating the mounting chuck 13.

Next, the suction of the suction portion of the mounting chuck 13a to IC1 is performed.
As shown in FIG. 3, a hole 38a passes through the rotating shaft 38 of the index unit 37, and the hole 38a is connected to the rotary table 12 of each station via a vacuum switching valve 39. The rotary table 12 is configured such that the vacuum hole connected to the mounting chuck 13 selected when the mounting chuck 13 is selected matches the hole of the support shaft 40, and the vacuum switching valve 39 can be controlled by an air cylinder 41 or the like. Depending on the situation, the vacuum can be drawn in or the vacuum can be turned off.

Next, in the drive section 27 shown in FIG. 3, the turntable 11 is connected to a rotating shaft 38 of an index unit 37. The turntable 11 rotates as the index unit 37 performs indexing. Also, mounting chuck 1
3a to 136 are lowered at stations (E, G, H, I in FIG. 1) for sucking, positioning, and mounting electronic components 19, a pusher 4 is guided on a base 42 by a bearing 43.
4 is the placement. This button 444 is moved up and down by an air cylinder 47 via a cam follower 46 and a lever 46, and the button 44 hits the mounting chucks 13IL to 136 to lower them.

Next, the details of the positioning jigs 16 and 17 shown in FIG.
This is shown in FIG.

As shown in FIG. 5, the positioning jigs 18 and 17 have a lever 50 mounted on a base 49 that rotates the positioning pawl 20 so as to match the mounting direction using a pulse motor 48 that operates based on data on the mounting direction of the electronic component 19. .51 (illustrated in Figure 6) 7>-Installation.

In FIG. 6, the positioning pawl 2o is opened and closed by rotating the cam 63 by the rotation of the pulse motor 52, and by rotating the cam follower 5.
This is done by swinging the lever 50.61 via 4.65. Note that the levers 56 and 57 are swung through the gear portions at the tips of the levers 60 and 61 to open and close the symmetrical positioning claws 2C1.

Next, the operation will be explained step by step with reference to FIG. 1 and FIGS. 7 to 9. First, at station D in FIG.
Select the mounting chucks 131L to 13e as described in the mechanism description, and place the electronic component 1 selected from the component shelf 8 at position E.
As shown in FIG. 7, the mounting chuck 13& corresponding to the mounting chuck 9 is pushed down by the pusher 44, and then moved up after adsorption. Next, turntable 1 is placed on ENF in Figure 1.
1 is determined, and at position F, the mounting direction of the mounting chuck 13 is selected as described in the mechanism description above (see FIG. 4),
At positions G and H, attach the mounting chuck 132L as shown in Figure 8.
is lowered, positioning is performed by positioning jigs 16 and 17, and then raised again. Next, at the machining position, the mounting chuck 132L is lowered as shown in FIG.
Electronic components 16 are mounted on the upper circuit board 18. Thereafter, the electronic components 16 are sequentially taken out from the component shelf 8 and sequentially mounted on the circuit board 11 on the XY table 10 by the operations described above.

Effects of the Invention The electronic component automatic mounting device of the present invention configured as described above has the following effects, and is expected to be widely used in the industry in the future. be.

(1) It is possible to equip a mounting chuck that matches the shape of the electronic component, and the reliability of mounting is high.In addition, it is possible to increase the number of different types of electronic components that can be handled by one equipment, resulting in high efficiency.

(2) The mounting chuck performs only the vertical movement and the rotational movement in the mounting direction using a separate station, and the positioning method can be performed separately by simply pinching, which greatly increases the mounting speed and is highly productive. It becomes a device.

(3) Although it is equipped with multiple mounting chucks, the rotary table in the mounting head is rotated so that the mounting chucks can be adsorbed, positioned, and mounted at the same position, so it is compatible with positioning uni-nods. Expansion is easy to accommodate expansion of product types, and control of parts shelves and x-y tables is also easy.

(4) Since the mounting direction is selected and positioned before the mounting chuck performs positioning, there is no rubbing between the electronic components and the mounting chuck, which extends the life of the mounting chuck and improves work efficiency. The mounting stability is high.

[Brief explanation of the drawing]

FIG. 1 is a plan layout diagram for explaining the basic configuration of the automatic electronic component mounting device according to the present invention, FIG. 2 is a configuration diagram showing one embodiment of the automatic electronic component mounting device according to the present invention, and FIG. 3 is an enlarged view of the main parts of the placement machine, Figure 4 is a configuration diagram of the installation direction selection mechanism of the placement machine, Figures 5 and 6 are configuration diagrams of the positioning jig of the placement machine, and Figures 7 to 7 are 9 is a schematic perspective view for explaining the mounting operation of the mounting machine, FIG. 10 is a perspective view showing a chip-shaped electronic component, and FIG. FIG. 12 is a plan layout diagram showing a conventional electronic component automatic mounting device. 8...Parts shelf, 9...Mounting mechanism section, 1
o...X-Y table, 11...Turntable, 12...11.0-Tally table, 1
3... Mounting chuck, 14... Mounting chuck selection drive system, 16... Mounting direction selection drive system, 16... Positioning jig, 17...・・・・・・
Positioning jig, 18...Circuit board, 19...
...Electronic component, 2o...Positioning claw, 21.
...Y table, 22...X table,
23...Rail. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Figure 9 Figure 10 Figure 11 Figure 12

Claims (1)

[Claims] An X-Y table for positioning the circuit board and this
A parts shelf installed near the Y table and movable in the horizontal direction, a rotating turntable placed between the parts shelf and the X-Y table, and parts divided at equal intervals around the outer circumference of the turntable. A plurality of rotary tables attached to positions that can rotate freely, a plurality of mounting chucks of different shapes arranged on the outer periphery of the rotary tables,
It consists of a plurality of drive systems installed around the turntable and a positioning jig placed around the turntable, and is a rotary drive system that operates according to the shape data of the electronic components in the plurality of mounting chucks. By rotating the table, the selected mounting chuck operates to pick up the electronic component from the component shelf, and then, based on the data on the mounting direction of the electronic component, the operating drive system selects the mounting direction of the mounting chuck. and to select the mounting direction of electronic components.
An electronic component automatic mounting device configured to position an electronic component using a rotatable positioning jig and to mount the electronic component on a circuit board on the XY table.