JPH04201809A - Manufacture of taping electronic part - Google Patents
Manufacture of taping electronic partInfo
- Publication number
- JPH04201809A JPH04201809A JP33719690A JP33719690A JPH04201809A JP H04201809 A JPH04201809 A JP H04201809A JP 33719690 A JP33719690 A JP 33719690A JP 33719690 A JP33719690 A JP 33719690A JP H04201809 A JPH04201809 A JP H04201809A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- adhesive
- thickness
- lead terminal
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000000853 adhesive Substances 0.000 claims abstract description 33
- 230000001070 adhesive effect Effects 0.000 claims abstract description 33
- 239000002390 adhesive tape Substances 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 abstract description 6
- 239000003522 acrylic cement Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 abstract 1
- 238000003780 insertion Methods 0.000 description 10
- 230000037431 insertion Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Packages (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は自動挿入用電子部品であるテーピング電子部品
の製造方法、特に電子部品のリード端子をテープで保持
する方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a taped electronic component, which is an electronic component for automatic insertion, and particularly to a method of holding lead terminals of an electronic component with tape.
電子部品保持用テープは近年、材料コストを低減するた
めテープ幅か６．０ｍｍ程度と狭くなっている。そして
、リート端子を出来るだけ短くしてリード端子のプレス
加工時の材料無駄を少なくするため、リード端子のテー
プへの挿入長さも短くなっており、最短挿入長さか３．
０ｍｍ程度のものも出てきている。In recent years, tapes for holding electronic components have become narrower to about 6.0 mm in order to reduce material costs. In addition, in order to make the lead terminal as short as possible and reduce material waste during press processing of the lead terminal, the insertion length of the lead terminal into the tape is also shortened, and the shortest insertion length is 3.
Some of them are about 0mm in diameter.
ところか、リード端子のテープへの挿入長さが短くなる
と、リード端子の「横ずれ」と「抜け」の問題が発生す
る。保持用テープの接着剤の強度を大きくすれば、「横
ずれ」に対してはかなり効果的であるか、［抜けＪの問
題は充分に解消されていないのか現状である。However, if the insertion length of the lead terminal into the tape becomes shorter, problems of "lateral displacement" and "dropout" of the lead terminal occur. The current situation is whether increasing the strength of the adhesive in the holding tape would be quite effective against ``lateral slippage,'' or whether the problem of missing J has not been sufficiently resolved.
ここで、従来の保持用テープＢについて具体的に説明す
る。第４図において、ｌＯは基材テープ、１１は貼着テ
ープであり、貼着テープ１１には予めアクリル系接着剤
１２が５０μｍの厚みで塗布されている。そして、基材
テープＩＯ上にリード端子１３を載置した状態で、その
上から貼着テープ１１を圧着することにより、第５図の
ように両方のテープ１０゜１１の間でリード端子１３を
保持している。Here, the conventional holding tape B will be specifically explained. In FIG. 4, IO is a base tape, and 11 is an adhesive tape, and an acrylic adhesive 12 is applied to the adhesive tape 11 in advance to a thickness of 50 μm. Then, with the lead terminal 13 placed on the base tape IO, the adhesive tape 11 is crimped from above, so that the lead terminal 13 can be attached between both tapes 10° and 11 as shown in FIG. keeping.
上記保持用テープＢの保持強度を検査するため、ｌＥＢ
図のように保持用テープＢを垂直に支持し、電子部品１
４に対して２６０ｇの荷重を１０秒間掛けた。In order to test the holding strength of the above holding tape B,
Support the holding tape B vertically as shown in the figure, and hold the electronic component 1.
A load of 260 g was applied to No. 4 for 10 seconds.
なお、ここでリード端子の挿入長さ／＝３．０ｍｍ、リ
ード端子の幅寸法ｄ＝０．５ｍｍ、板厚ｔ ＝０．３ｍ
ｍ 。In addition, here, the insertion length of the lead terminal = 3.0 mm, the width dimension of the lead terminal d = 0.5 mm, and the plate thickness t = 0.3 m.
m.
リード端子１３のピッチｐ＝２．５＋ｎｍとした。この
検査によると、全体の９０％に「抜け」か発生した。The pitch p of the lead terminals 13 was set to 2.5+nm. According to this test, ``missing'' occurred in 90% of the cases.
その原因は、リード端子１３の側縁部への接着剤１２０
回り込みが悪く、隙間δが発生しているため、充分な接
着力が得られないからであると考えられる。The cause is the adhesive 120 on the side edge of the lead terminal 13.
This is thought to be because sufficient adhesion force cannot be obtained because the wraparound is poor and a gap δ is generated.
そこで、本発明の目的は、リード端子の側縁部への接着
剤の回り込みを良くし、リード端子の挿入長さが短くて
も横ずれや抜けを防止できるテーピング電子部品の製造
方法を提供することにある。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a method for manufacturing a taped electronic component that allows adhesive to spread around the side edges of lead terminals well and prevents lateral shifting or coming off even if the insertion length of the lead terminal is short. It is in.
上記目的を達成するために、本発明は、リード端子を基
材テープと貼着テープとの間で保持するようにしたテー
ピング電子部品の製造方法において、基材テープの上に
電子部品のリード端子を載置する工程と、予め接着剤が
リード端子の厚みの１１５以上の糊厚で塗布された貼着
テープを、上記接着剤の軟化温度以上に加熱した状態で
基材テープ上に圧着し、上記接着剤をリード端子の側縁
部に回り込ませる工程と、を含むものである。In order to achieve the above object, the present invention provides a method for manufacturing a taped electronic component in which a lead terminal is held between a base tape and an adhesive tape. and press-bonding an adhesive tape coated with adhesive in advance to a thickness of 115 or more than the thickness of the lead terminal onto the base tape in a state heated to a temperature equal to or higher than the softening temperature of the adhesive, The method includes the step of applying the adhesive to the side edges of the lead terminals.
テーピング電子部品の場合、リード端子の板厚は０．３
ｍｍ以上であるため、従来のように接着剤の糊厚が５０
μｍであるとリード端子の板厚の１７６以下となり、充
分な量の接着剤がリード端子の側縁部へ回り込むことが
できない。これに対し、本発明では貼着テープの接着剤
の糊厚をリード端子の板厚の１１５以上としているので
、リード端子の側縁部に回り込む接着剤の量を確保でき
る。しかも、貼着テープを接着剤の軟化温度以上に加熱
した状態で基材テープ上に圧着するため、接着剤の回り
込みか更に促進される。その結果、接着剤がり一ド端子
の上面だけでなく側縁にも隙間なく密着し、接着強度が
大幅に向上して、テープへのリード端子の挿入長さを３
．０ｍｍ程度にしても「横ずれ」や「抜け」を確実に防
止できる。In the case of taped electronic parts, the thickness of the lead terminal is 0.3
mm or more, the thickness of the adhesive is 50 mm or more, unlike conventional adhesives.
If the thickness is 176 μm or less, the thickness of the lead terminal is less than 176 μm, and a sufficient amount of adhesive cannot reach the side edges of the lead terminal. On the other hand, in the present invention, since the thickness of the adhesive of the adhesive tape is 115 times or more than the board thickness of the lead terminal, it is possible to ensure the amount of adhesive that wraps around the side edges of the lead terminal. Moreover, since the adhesive tape is pressed onto the base tape while being heated to a temperature higher than the softening temperature of the adhesive, the spread of the adhesive is further promoted. As a result, the adhesive adheres not only to the top surface of the lead terminal but also to the side edges without any gaps, greatly improving adhesive strength and reducing the insertion length of the lead terminal into the tape by 3.
．． Even if it is about 0 mm, it is possible to reliably prevent "lateral displacement" and "dropout".
なお、本発明における貼着テープの加熱と圧着は、貼着
テープを加熱した後で基材テープに圧着してもよく、あ
るいは貼着テープを基材テープに圧着しなから加熱して
もよい。In addition, in the heating and pressure bonding of the adhesive tape in the present invention, the adhesive tape may be heated and then pressure bonded to the base tape, or the adhesive tape may be heated before being pressure bonded to the base tape. .
第１図、第２図は本発明にかかるテーピング電子部品の
製造工程を示す。1 and 2 show the manufacturing process of the taped electronic component according to the present invention.
保持用テープＡは、幅広な基材テープｌと、テープ幅が
６− Ｏｍｍ程度の輻狭な貼着テープ２よりなり、いず
れも紙糸材料で構成されている。貼着テープ２の下面全
面には予めアクリル系接着剤３が６０μｍ以上の糊厚で
塗布されている。４はフープ材からプレス加工により形
成された電子部品のリード端子であり、これら３本のリ
ード端子４は基材テープｌ上にその側縁から一定の挿入
長さをもって載置される。The holding tape A consists of a wide base tape 1 and a narrow adhesive tape 2 with a tape width of about 6-0 mm, both of which are made of paper thread material. An acrylic adhesive 3 is applied in advance to the entire lower surface of the adhesive tape 2 to a thickness of 60 μm or more. Reference numeral 4 denotes lead terminals of an electronic component formed from a hoop material by press working, and these three lead terminals 4 are placed on the base tape l with a fixed insertion length from the side edge thereof.
上記のように基材テープｌ上にリード端子４を載置した
後、その上より貼着テープ２を基材テープｌの側縁と合
致させて圧着する。この時、貼着テープ２を含むテープ
全体を接着剤３の軟化温度である約６５℃に加熱し、か
つ約２０ｋｇの加圧力をかけて貼着テープ２を圧着する
。これにより、接着剤３は各リード端子４の上面だけで
なく側縁部にも回り込み、第２図のように接着剤３はリ
ード端子４および基材テープｌとほぼ隙間なく密着する
。After the lead terminal 4 is placed on the base tape 1 as described above, the adhesive tape 2 is pressed onto the base tape 2 so as to match the side edge of the base tape 1. At this time, the entire tape including the adhesive tape 2 is heated to about 65° C., which is the softening temperature of the adhesive 3, and the adhesive tape 2 is compressed by applying a pressure of about 20 kg. As a result, the adhesive 3 wraps around not only the upper surface of each lead terminal 4 but also the side edges thereof, and the adhesive 3 adheres to the lead terminal 4 and the base tape 1 with almost no gaps as shown in FIG.
上記保持用テープへの保持強度を検査するため、第３図
のように保持用テープＡを垂直に支持し、電子部品５に
対して２６０ｇの荷重を１０秒間掛けた。In order to test the holding strength of the holding tape, the holding tape A was supported vertically as shown in FIG. 3, and a load of 260 g was applied to the electronic component 5 for 10 seconds.
なお、リード端子４の挿入長さｌ、幅寸法ｄ、板厚ｔ、
ピッチｐ２テープおよび接着剤３の材料等の条件は従来
（第５図、第６図）と同様とした。In addition, the insertion length l, width dimension d, plate thickness t, of the lead terminal 4,
Conditions such as the materials for the pitch P2 tape and the adhesive 3 were the same as in the prior art (FIGS. 5 and 6).
この検査によると、リード端子４の「抜けＪの発生率は
０％、即ち「抜け」が全く発生しないという良好な結果
が得られた。According to this test, a good result was obtained in which the occurrence rate of "dropout J" of the lead terminal 4 was 0%, that is, "dropout" did not occur at all.
なお、本発明は板状リード端子を備えた電子部品に限ら
ず、丸棒状リード端子を備えた電子部品でもほぼ同様の
効果を奏することができた。It should be noted that the present invention is not limited to electronic components equipped with plate-shaped lead terminals, but can also produce substantially the same effects with electronic components equipped with round bar-shaped lead terminals.
以上の説明で明らかなように、本発明によれば貼着テー
プに予めリード端子の厚みの１１５以上の糊厚を有する
接着剤を塗布しておき、この貼着テープを接着剤の軟化
温度以上に加熱した状態て基材テープ上に圧着したので
、接着剤かリード端子の上面だけでなく側縁部にも回り
込み、接着力が格段に向上する。その結果、リード端子
の挿入長さが３．０ｍａ＋程度と短い場合であっても、
「横ずれ」や「抜け」を確実に防止できる。As is clear from the above explanation, according to the present invention, an adhesive having a thickness of 115 or more than the thickness of the lead terminal is applied to the adhesive tape in advance, and the adhesive tape is heated to a temperature higher than the softening temperature of the adhesive. Since the lead terminal was heated and pressed onto the base tape, the adhesive spreads not only to the top surface of the lead terminal but also to the side edges, significantly improving the adhesive strength. As a result, even when the insertion length of the lead terminal is as short as 3.0 ma+,
It is possible to reliably prevent ``side-slip'' and ``dropout.''
第１図は本発明にかかるテーピング電子部品のテープへ
の保持前の断面図、第２図は保持後の断面図、第３図は
その保持強度検査を示す図、第４図は従来のテーピング
電、子部品のテープへの保持前の断面図、第５図は保持
後の断面図、第６図はその保持強度検査を示す図である
。
ｌ・・・基材テープ、２・・・貼着テープ、３・・・接
着剤、４・・・リード端子、５・・・電子部品。
第１図 第４図
第２図 第５図Fig. 1 is a cross-sectional view of the taped electronic component according to the present invention before it is held on the tape, Fig. 2 is a cross-sectional view after it is held, Fig. 3 is a view showing the holding strength test, and Fig. 4 is the conventional taping. FIG. 5 is a cross-sectional view of the electronic component before it is held on the tape, FIG. 5 is a cross-sectional view of the electronic component after it is held, and FIG. 6 is a view showing the holding strength test. 1...Base tape, 2...Adhesive tape, 3...Adhesive, 4...Lead terminal, 5...Electronic component. Figure 1 Figure 4 Figure 2 Figure 5
Claims (1)
持するようにしたテーピング電子部品の製造方法におい
て、 基材テープの上に電子部品のリード端子を載置する工程
と、 予め接着剤がリード端子の厚みの１／５以上の糊厚で塗
布された貼着テープを、上記接着剤の軟化温度以上に加
熱した状態で基材テープ上に圧着し、上記接着剤をリー
ド端子の側縁部に回り込ませる工程と、 を含むテーピング電子部品の製造方法。(1) A method for manufacturing a taped electronic component in which a lead terminal is held between a base tape and an adhesive tape, which includes the steps of placing the lead terminal of the electronic component on the base tape, and adhering it in advance. An adhesive tape coated with an adhesive with a thickness of 1/5 or more of the thickness of the lead terminal is pressed onto the base tape while heated to a temperature higher than the softening temperature of the adhesive, and the adhesive is applied to the lead terminal. A method of manufacturing a taped electronic component, comprising: a step of wrapping the tape around the side edge;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2337196A JP2754283B2 (en) | 1990-11-30 | 1990-11-30 | Manufacturing method of taping electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2337196A JP2754283B2 (en) | 1990-11-30 | 1990-11-30 | Manufacturing method of taping electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04201809A true JPH04201809A (en) | 1992-07-22 |
| JP2754283B2 JP2754283B2 (en) | 1998-05-20 |
Family
ID=18306349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2337196A Expired - Fee Related JP2754283B2 (en) | 1990-11-30 | 1990-11-30 | Manufacturing method of taping electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2754283B2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55152100U (en) * | 1979-04-18 | 1980-11-01 | ||
| JPS63102601U (en) * | 1986-12-22 | 1988-07-04 |
-
1990
- 1990-11-30 JP JP2337196A patent/JP2754283B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55152100U (en) * | 1979-04-18 | 1980-11-01 | ||
| JPS63102601U (en) * | 1986-12-22 | 1988-07-04 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2754283B2 (en) | 1998-05-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |