JPH04201869A - Emboss tape - Google Patents

Emboss tape

Info

Publication number
JPH04201869A
JPH04201869A JP33746990A JP33746990A JPH04201869A JP H04201869 A JPH04201869 A JP H04201869A JP 33746990 A JP33746990 A JP 33746990A JP 33746990 A JP33746990 A JP 33746990A JP H04201869 A JPH04201869 A JP H04201869A
Authority
JP
Japan
Prior art keywords
tape
embossed
embossed tape
view
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP33746990A
Other languages
Japanese (ja)
Inventor
Toru Ichimura
徹 市村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP33746990A priority Critical patent/JPH04201869A/en
Publication of JPH04201869A publication Critical patent/JPH04201869A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To obtain an emboss tape which prevents the lead of a device from bending by providing the tape having an adhesive strength. CONSTITUTION:When a device 4 is inserted into emboss tape, it is fixedly attached to the side of cover tape 2 by the adhesive strength of an adhesive tape 3. As a result, this method prevents the lead of the device 4 from colliding with the side face of carrier tape 1 and there is no occurrence of the lead bending.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、スモールアウトラインパッケージのデバイ
スをテーピングする際に使用するエンボステープに関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an embossed tape used for taping devices in small outline packages.

〔従来の技術〕[Conventional technology]

第６図は従来のエンボステープの構成を示す上面図、第
７図は第６図のエンボステープの右側面図、第８図は第
６図のエンボステープの正面図、第９図は、第６図のエ
ンボステープにデバイスを入れた状態の上面図、第１Ｏ
図は１９図に示すＢ・Ｂにおける断面図である。Fig. 6 is a top view showing the structure of a conventional embossed tape, Fig. 7 is a right side view of the embossed tape shown in Fig. 6, Fig. 8 is a front view of the embossed tape shown in Fig. 6, and Fig. 9 is a Top view of the device placed in the embossed tape in Figure 6, No. 1 O
The figure is a sectional view taken along line B-B shown in Figure 19.

図において（４）はスモールアウトラインパッケージの
デバイス、ａυはキャリアテープ、αのはカバーテープ
である。In the figure, (4) is a small outline package device, aυ is a carrier tape, and α is a cover tape.

次に動作について説明する。Next, the operation will be explained.

エンボステープにデバイス（４）を入れると、デバイス
（４）とキャリアテープαυとの間にすきまか生じる。When the device (4) is placed in the embossed tape, a gap is created between the device (4) and the carrier tape αυ.

デバイス（４）はこのすきまの中を自由に動きまわるた
め、デバイス（４）のリードがキャリアテープαυの側
面にあたり、リードが曲がることがある。Since the device (4) moves freely within this gap, the leads of the device (4) may hit the sides of the carrier tape αυ, causing the leads to bend.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来のエンボステープは以上のように構成されているの
で、デバイスのリードか曲がるという問題点があった。Since the conventional embossed tape was constructed as described above, there was a problem in that the leads of the device were bent.

この発明は上記のような問題点を解消するためになされ
たもので、デバイスのリードが曲からないエンボステー
プを得ることを目的とする。This invention was made to solve the above-mentioned problems, and aims to provide an embossed tape in which device leads do not bend.

〔課題を解決するための手段〕[Means to solve the problem]

この発明に係るエンボステープは、デバイスのリードが
曲からないようにする手段として、キャリアテープ内で
デバイスが動かないようにしたものである。The embossed tape according to the present invention serves as a means to prevent device leads from bending, and prevents devices from moving within a carrier tape.

〔作用〕[Effect]

この発明におけるエンボステープは、キャリアテープ内
でデバイスを動かないようにし、デバイスのリードかキ
ャリアテープの側面に当たらないようにする。The embossed tape in this invention immobilizes the device within the carrier tape and prevents the device leads from hitting the sides of the carrier tape.

〔実施例〕〔Example〕

以下、この発明の一実施例を図について説明する。 An embodiment of the present invention will be described below with reference to the drawings.

第１図はエンボステープの上面図、第２図は第１図のエ
ンボステープの右側面図、第３図は第１図のエンボステ
ープの正面図、第４図は第１図のエンボステープにデバ
イスを入れた状態を示す上面図、第５図は第４図に示す
Ａ−Ａにおける断面図である。図において、（１）はキ
ャリアテープ、（２）はカバーテープ、（３）は粘着性
を有したテープ、（４）はスモールアウトラインパーケ
ッジのデバイスである。Figure 1 is a top view of the embossed tape, Figure 2 is a right side view of the embossed tape in Figure 1, Figure 3 is a front view of the embossed tape in Figure 1, and Figure 4 is the embossed tape in Figure 1. FIG. 5 is a top view showing a state in which the device is inserted, and FIG. 5 is a cross-sectional view taken along line A-A shown in FIG. In the figure, (1) is a carrier tape, (2) is a cover tape, (3) is an adhesive tape, and (4) is a small outline package device.

次に動作について説明する。Next, the operation will be explained.

エンボステープにデバイス（４）を入れると、デバイス
（４）は粘着性を有したテープ（３）の粘着力によりカ
バーテープ（２）側に固定される。その結果、デバイス
（４）のリードかキャリアテープ（１）の側面に当るこ
とがなくなり、リードの曲かりは発生しない。When the device (4) is placed in the embossed tape, the device (4) is fixed to the cover tape (2) by the adhesive force of the adhesive tape (3). As a result, the leads of the device (4) do not hit the sides of the carrier tape (1), and the leads do not bend.

〔発明の効果〕〔Effect of the invention〕

以上のように、この説明によればエンボステープに粘着
性を有したテープを用いたので、デバイスかキャリアテ
ープの中で動くことか無くなり、デバイスのリードが曲
がらないという効果かある。As described above, since an adhesive tape is used as the embossed tape, there is no possibility that the device will move within the carrier tape, and the device leads will not be bent.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの発明の一実施例によるエンボステープを示
す上面図、第２＠は第１図のエンボステープの右側面図
、第３図は第１図のエンボステープの正面図、第４図は
第１１図のエンボステープにデバイスを入れた状態を示
す上面図、第５図は第４図に示すＡ−Ａにおける断面図
、第６図は従来のエンボステープを示す上面図、第７図
は第６図のエンボステープの右側面図、第８図は第６図
のエンボステープの正面図、第９図は第６図のエンボス
テープにデバイスを入れた状態を示す上面図、第１０図
は第９図に示すＢ−Ｂにおける断面図である。 図においてはキャリアテープ、（２）はカバーテープ、
（３）はテープ、（４）はデバイスである。 なお、図中、同一符号は同一、又は相当部分を示す。FIG. 1 is a top view showing an embossed tape according to an embodiment of the present invention, FIG. 2 is a right side view of the embossed tape in FIG. 1, FIG. 3 is a front view of the embossed tape in FIG. 1, and FIG. 11 is a top view showing a state in which a device is placed in the embossed tape, FIG. 5 is a sectional view taken along line A-A shown in FIG. 4, FIG. 6 is a top view showing a conventional embossed tape, and FIG. is a right side view of the embossed tape shown in Fig. 6, Fig. 8 is a front view of the embossed tape shown in Fig. 6, Fig. 9 is a top view showing a state in which a device is inserted into the embossed tape shown in Fig. 6, and Fig. 10. 9 is a sectional view taken along line BB shown in FIG. 9. In the figure, carrier tape is shown, (2) is cover tape,
(3) is a tape, and (4) is a device. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

【特許請求の範囲】[Claims] 粘着性を有したテープを備えたことを特徴とするエンボ
ステープ。An embossed tape characterized by having adhesive tape.
JP33746990A 1990-11-30 1990-11-30 Emboss tape Pending JPH04201869A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33746990A JPH04201869A (en) 1990-11-30 1990-11-30 Emboss tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33746990A JPH04201869A (en) 1990-11-30 1990-11-30 Emboss tape

Publications (1)

Publication Number Publication Date
JPH04201869A true JPH04201869A (en) 1992-07-22

Family

ID=18308937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33746990A Pending JPH04201869A (en) 1990-11-30 1990-11-30 Emboss tape

Country Status (1)

Country Link
JP (1) JPH04201869A (en)

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