JPH0420261U - - Google Patents

Info

Publication number
JPH0420261U
JPH0420261U JP6158590U JP6158590U JPH0420261U JP H0420261 U JPH0420261 U JP H0420261U JP 6158590 U JP6158590 U JP 6158590U JP 6158590 U JP6158590 U JP 6158590U JP H0420261 U JPH0420261 U JP H0420261U
Authority
JP
Japan
Prior art keywords
chip component
soldered
lead
patterns
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6158590U
Other languages
English (en)
Other versions
JP2510466Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990061585U priority Critical patent/JP2510466Y2/ja
Publication of JPH0420261U publication Critical patent/JPH0420261U/ja
Application granted granted Critical
Publication of JP2510466Y2 publication Critical patent/JP2510466Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】
第１図は本考案の原理図、第２図は本考案の第
１実施例の構成図、第３図は本考案の第２実施例
の構成図、第４図は車両用制御器の部分構成図で
ある。 図中、１は面実装ＩＣ、４はチツプ部品、５は
基板、６は半田、１１はリード、４１は裏面電極
、４３は表面電極である。

Claims (1)

  1. 【実用新案登録請求の範囲】 基板５のパターン３２，３４にチツプ部品４の
    裏面電極４１を半田付けし、 該チツプ部品の表面電極４３に面実装ＩＣ１の
    リード１１を直接半田付けするようにしてなるこ
    とを特徴とする高密度実装構造。
JP1990061585U 1990-06-11 1990-06-11 高密度実装構造 Expired - Fee Related JP2510466Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990061585U JP2510466Y2 (ja) 1990-06-11 1990-06-11 高密度実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990061585U JP2510466Y2 (ja) 1990-06-11 1990-06-11 高密度実装構造

Publications (2)

Publication Number Publication Date
JPH0420261U true JPH0420261U (ja) 1992-02-20
JP2510466Y2 JP2510466Y2 (ja) 1996-09-11

Family

ID=31589963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990061585U Expired - Fee Related JP2510466Y2 (ja) 1990-06-11 1990-06-11 高密度実装構造

Country Status (1)

Country Link
JP (1) JP2510466Y2 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS646063U (ja) * 1987-06-30 1989-01-13

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS646063U (ja) * 1987-06-30 1989-01-13

Also Published As

Publication number Publication date
JP2510466Y2 (ja) 1996-09-11

Similar Documents

Publication Publication Date Title
JPH0399466U (ja)
JPH0418474U (ja)
JPH0217854U (ja)
JPH0448661U (ja)
JPH0385682U (ja)
JPH01139418U (ja)
JPH01161360U (ja)
JPS63114074U (ja)
JPS63100871U (ja)
JPH0430760U (ja)
JPH02110374U (ja)
JPH01133745U (ja)
JPS6045430U (ja) チツプ部品
JPH01104768U (ja)
JPH01179446U (ja)
JPS61190177U (ja)
JPS619843U (ja) リ−ドレスチツプキヤリア
JPS62197880U (ja)
JPH0247062U (ja)
JPH0215767U (ja)
JPS6278784U (ja)
JPS63157954U (ja)
JPH0442799U (ja)
JPH0275776U (ja)
JPH01153669U (ja)

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees