JPH04206997A - Circuit board layering tool - Google Patents

Abstract

PURPOSE:To prevent relative offset with the layer material caused by measurement differences and enhance the alignment precision by specifying a hole diameter for the two metal boards layered on the top and bottom and the board layered in between during the layering formation process for at least 2 sets in cases when there are at least 4 sets of alignment cylindrical pins and metal board holes. CONSTITUTION:The diameter of the standard alignment holes 3, 6 on the upper/lower boards 1 and the intermediate board 2 is made slightly larger than the diameter of the standard pin 7 with this difference kept to a maximum of 0.1mm and to a size which achieves the desired alignment precision between the material layers in the layered circuit board 8 connected by the adhesion sheet 9. Further, the diameter of the escape holes 4, 5 found on the same upper/lower boards 1 and the intermediate board 2 are made substantially larger than the diameter of the pin 1 and even if there are shifts in the standard pin alignment caused by differences in the intermediate board 2 and the upper/lower boards 1 which arise because of temperature differences during the layer formation process, the hole diameter is set to a size so that the layered circuit board 8 is not prevented from coming into contact and shifting its position. As a result, disalignment of the intermediate board 2 caused by thermal expansion can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a lamination jig for pin positioning of circuit boards, and particularly to a lamination jig for pin positioning of circuit boards, and particularly for laminating a laminated structure when two or more multilayer printed circuit wiring boards are laminated at the same time. The present invention relates to a circuit board lamination jig suitable for use in highly accurate positioning between circuit boards.

(Conventional technology) Conventionally, circuit boards have been used to reduce the size of equipment that uses them.
In order to achieve higher functionality, attempts are being made to increase the number of wiring layers and narrow the wiring spacing. Holes are made at predetermined positions on the circuit board for mounting components so that the lamination jig and these wirings do not come into contact with each other, or for connecting layers within the board. At this time, it is desired that the relative positional accuracy between each layer within the substrate be matched as precisely as possible.

In recent years, various types of lamination jigs for circuit boards have been devised for this purpose. In particular, the upper and lower plates of the lamination jig,
A circuit board lamination jig is known in which the hole diameter of the intermediate plate is considerably larger than the diameter of the reference pin in an attempt to prevent the positional deviation caused by bending of the reference pin due to thermal expansion between the intermediate plates. .

(Problems to be Solved by the Invention) When using a conventional lamination jig, a reference pin is set up on the lower plate of the -1-1 lower plate, and the laminated object is attached to this pin.

Align the holes in the intermediate plate and raise them 1° while penetrating them. At this time, if you use a laminating jig in which all of the holes in the intermediate plate are considerably larger than the reference pins that penetrate the holes, the position of the intermediate plate must be within the range of the difference between the reference pin and the hole diameter in the intermediate plate. A shift occurs, and the reference pin and the hole in the intermediate plate are in a state of being partially in contact with each other.

When heated and pressurized in this state, each 1゛.

The temperature difference or restraint difference between the lower plate and the intermediate plate creates a difference in the thermal dilatometer, and when extending along the plane direction, the reference pin comes into contact with a part of the hole in the intermediate plate, and the direction in which the intermediate plate extends subject to restrictions. As a result, a positional shift occurs with respect to the laminated material that contacts this intermediate plate.

In other words, in the conventional method described above, all the holes in the intermediate plate are considerably larger than the diameter of the reference pin, so during lamination molding, the relative position shift is adjusted within that range until the maximum reference pin and part of the hole in the intermediate plate come into contact. It will happen. Therefore, when this is heated and cooled, there is a problem that the dimensional difference caused by thermal expansion and contraction is pushed by the reference pin and acts only in one direction, making it impossible to maintain the relative position correctly.

In addition, in a lamination jig in which all the differences between the conventional reference pin diameter and the hole diameter of the intermediate plate are reduced to 0 to 0.1 mm, the dimensional difference due to expansion and contraction is absorbed as the bending of the reference pin. Therefore, depending on how the bend occurs, -1,
As with the force distribution method, there was a problem in that the relative positions were not maintained correctly.

The purpose of the present invention is to solve these problems, to enable highly accurate positioning lamination molding, and to make it possible to perform laminated molding with three or more sheets as necessary.
1. A circuit board that can absorb dimensional differences caused by thermal expansion and contraction without impairing alignment accuracy even when the lower plate and intermediate plate are installed with different coefficients of thermal expansion. The object of the present invention is to provide a lamination jig for

(Means for Solving the Problems) In order to achieve the object stated in -1-, the present invention provides four or more points.
A circuit wiring board consisting of three or more metal plates with alignment holes provided therein, and a cylindrical pin for alignment that penetrates each of the alignment holes, and at the same time two or more metal plates (1). In a lamination jig for circuit boards used when stacking with pin alignment, among the combinations of four or more cylindrical positioning pins and holes in the metal plate at four or more locations,
For combinations of two or more locations, during lamination molding, -1- the hole diameter of the two metal plates placed on the lower side should be set by 0. ], the diameter of the hole in the metal plate placed in the middle is made larger than the diameter of the cylindrical pin by 0 mm or more.
．． 1+ηm larger than the diameter of the cylindrical pin, and for the other two or more combinations of 1-, the hole diameter of the two metal plates placed on the lower side of 1- during lamination molding should be at most 0.1 mm larger than the diameter of the cylindrical pin. The hole diameter of the metal plate placed in the middle is made larger than the diameter of the cylindrical pin.
．． It is characterized in that it is formed larger by 1 mm or more.

The lamination jig for circuit boards according to the present invention is one of three or more metal plates! -1 This is a jig for performing the alignment 1'4 of the holes provided in the lower plate, the intermediate plate, and the laminated +4 with the reference pins. What kind of fixture should be used for at least two types of pin receiving parts?
One of them is to align the laminated paper and the 1-1 lower plate, and one of the songs is to align the laminated plate and the middle plate.

In other words, holes in the upper and lower plates and the laminated +4 material are formed in at least two places on the non-inventive jig so that the hole diameter is 1 mm to align with the reference pin diameter, and the holes in the middle of these parts are The hole in the plate should be an escape hole with a size considerably larger than the diameter of the standard pin to be inserted.

Two more places! , the diameter of the hole in the intermediate plate and the material to be laminated +4 is formed to be 1° to align with the diameter of the reference pin, and the hole in the 1-1 lower plate in this part is made with a through hole. It is assumed that the standard pin diameter is considerably larger than the diameter of the matching standard pin = the escape hole of the J method.

(Function) When using the circuit board lamination jig of the present invention in order to laminate and mold a circuit board to be laminated H, a reference pin is placed on the lower plate of three or more 1"- The pin is stacked on the pin while passing through the hole in the intermediate plate. At this time, in the present invention, the pin is
In order to prevent misalignment by 1, there is a hole diameter and a reference pin diameter through which the hole diameter is 1 minute to ensure the alignment between the laminated plate and the intermediate plate.

Also, in order to align the lower plate of the laminated 10A, -1-1, the hole diameter and the reference pin diameter are connected by (1).For this reason, the lower plate and Make sure that both sides of the intermediate plate (1
゛L aligned.

As a result, the above-mentioned positional displacement of the intermediate plate does not occur during lamination molding. Therefore, even during heating and pressurization, there is no restriction on the elongation direction due to thermal expansion, so that lamination work without misalignment of each layer within the substrate is guaranteed.

(Example) An embodiment of the present invention will be described in detail below with reference to the drawings.

FIG. 1 is a main plan view showing a laminated layer having a thickness of +16 using the circuit board lamination jig of the present invention, and FIG. 2 is a sectional view taken along the line A-B in FIG. 1.

In both figures, ] is -1-9 lower plate, 2 is middle plate, 7
are reference pins, and these kings are constituent parts of the circuit board lamination jig according to the present invention. This lamination jig is a jig used when laminating two or more multilayer printed wiring boards at the same time with pin alignment.

3.6 is a reference hole for positioning provided in the -1-1 lower plate 1- and the intermediate plate 2, and the hole diameter is about 10 times larger than the diameter of the reference pin 7, and the difference is 0° at most. The diameter of the hole is set to be 1 mm, and the diameter of the hole is set to be large enough to ensure the desired positional accuracy between the layers of the laminated circuit board 8 bonded to the adhesive sheet 1 (uncured substrate H material). . In addition, 4 and 5 are escape holes provided in the lower plate 1 and the intermediate plate 2, and the diameter thereof is made considerably larger than the diameter of the reference pin 1. Even if the reference pin position moves due to the dimensional difference between the intermediate plate 2.1 and the lower plate 1, the hole diameter is set to be large enough to prevent the laminated circuit board 8 from touching and moving. has been done. This prevents the intermediate plate 2 from shifting due to thermal expansion.

Figure 3 shows an example in which the +4 quality of the intermediate plate 2, which is a component of a laminating jig for circuit boards, is different from the position of the upper and lower plates 1, as in Figure 2. -4 Lower plate 1, middle plate 2
Reference holes 3, 6 and relief holes 4.6 are formed in each of the holes. In this way, when the lower plate 1 and the intermediate plate 2 of 1-1 have different properties, even if there is no temperature difference between each layer in the substrate during lamination molding, even if the temperature is simply increased by -1, the material will deteriorate. Due to differences in thermal expansion coefficients, there is a large amount of space between each layer within the board.
Gender differences may occur. However, this example has the effect of absorbing and removing dimensional differences due to temperature differences, as in the previous embodiment, without reducing alignment accuracy.

(Effects of the Invention) As described in 1-1 above, according to the lamination jig for circuit boards of the present invention, in-plane damage occurs due to differences in thermal expansion and contraction due to temperature differences during lamination molding or differences in jig quality. Even if a dimensional difference occurs, relative displacement of the stacked shrines due to this ζ-shaped difference can be prevented, and the positioning accuracy can be improved to n1 compared to the conventional method.

Furthermore, even if layer jigs of different quality are used in combination for some reason, it is possible to effectively prevent misalignment between the layers of the layer to be laminated. The effect of being able to perform laminated molding is -f
r.

[Brief explanation of the drawing]

Figure 1 is a bottom view showing a structure obtained by laminating H materials to be laminated using the circuit board lamination jig of the present invention, Figure 2 is a sectional view taken along the line A-B in Figure 1, and Figure 3 The figure is a sectional view showing an example in which the thickness of the intermediate plate is different from that of the upper and lower plates. ]...-1-, Lower plate 2... Intermediate plate 3.6... Reference hole 4.5... Relief hole 7... Reference pin = 10- 8... (Covered) Laminated circuit board

Claims (1)

[Claims] 1. Consists of three or more metal plates with alignment holes in four or more locations, and a cylindrical alignment pin that penetrates each of the alignment holes, and pins two or more multilayer printed circuit wiring boards at the same time. In the lamination jig for circuit boards used when aligning and laminating, two or more of the four or more combinations of the alignment cylindrical pin and the hole in the metal plate are used during lamination molding. The hole diameter of the two metal plates placed on both the upper and lower sides is formed to be at least 0.1 mm larger than the diameter of the cylindrical pin, and the hole diameter of the metal plate placed in the middle is made to be at most 0.1 mm larger than the diameter of the cylindrical pin. For other combinations of two or more locations, the hole diameters of the two metal plates placed on both the upper and lower sides during laminated molding are formed to be at most 0.1 mm larger than the diameter of the cylindrical pin. The hole diameter of the metal plate placed in is 0.1 smaller than the diameter of the cylindrical pin.
A laminating jig for a circuit board, characterized in that it is formed larger than mm.