JPH0243048A - Manufacture of multi-layer laminated board - Google Patents
Manufacture of multi-layer laminated boardInfo
- Publication number
- JPH0243048A JPH0243048A JP63192677A JP19267788A JPH0243048A JP H0243048 A JPH0243048 A JP H0243048A JP 63192677 A JP63192677 A JP 63192677A JP 19267788 A JP19267788 A JP 19267788A JP H0243048 A JPH0243048 A JP H0243048A
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- inner layer
- laminated
- boards
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
- B32B38/1833—Positioning, e.g. registration or centering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野]
本発明は位置ずれの少ない高品質の多層積層板を製造す
る方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method for producing a high quality multilayer laminate with little misalignment.
近年の電子機器の高性能化の要求に伴って、電子部品を
搭載する配線基板として内部に1rM以上の導体金属箔
を有する多層板の使用が増加している。2. Description of the Related Art With the recent demand for higher performance of electronic devices, the use of multilayer boards having internal conductive metal foils of 1 rM or more is increasing as wiring boards on which electronic components are mounted.
この多層板のうち例えば6層板は、第1図に示す様に構
成されている。Among these multilayer boards, for example, a six-layer board is constructed as shown in FIG.
即ち絶縁層1の両面に金属導体回路2が形成された内層
板3を2枚用意し、その2枚をプリプレグ4aを介在し
て重ね合せ、さらにその両面にそれぞれプリプレグ4b
と金属導体箔5を順に重ね合せた構造とされている。そ
してこれら全体が熱プレスにより一体成形されている。That is, two inner layer plates 3 each having a metal conductor circuit 2 formed on both sides of an insulating layer 1 are prepared, the two inner plates 3 are stacked with a prepreg 4a interposed therebetween, and prepregs 4b are placed on both sides of each inner layer plate 3.
It has a structure in which a metal conductor foil 5 and a metal conductor foil 5 are sequentially stacked one on top of the other. The whole is integrally molded by hot pressing.
しかしてこのとき、2枚の内層板3.3の金属導体回路
2の位置を合せる必要があり、従来から種々の方法が採
用されている0例えば、(イ)ビンラミネーシッン法が
あるが、これは、第2図に示す様に、2枚のw4箔5.
5;3枚のプリプレグ4.4.4;2枚の内層板3.3
の総てに位置決め様孔をあけ、これらをステンレス板6
.6の間にはさみ専用金型7.7の型面に立てた合わせ
ピン8にこれら総ての孔を嵌合させて位置合せを行った
後、熱プレスにより成型するものである。However, at this time, it is necessary to align the positions of the metal conductor circuits 2 of the two inner layer plates 3.3, and various methods have been used in the past.For example, there is the (a) bottle lamination method. , which consists of two sheets of W4 foil 5. as shown in Figure 2.
5; 3 prepregs 4.4.4; 2 inner layers 3.3
Drill holes for positioning in all of them, and attach them to the stainless steel plate 6.
.. After aligning by fitting all of these holes into the dowel pins 8 set up on the mold surface of the scissor mold 7.7 between the holes 6 and 7, the molding is performed by hot press.
又、リベットやハトメにより内層板とプリプレグ積層体
を機械的に固定した後、熱プレスにより一体成型する方
法(ロ)、やシアノアクリレートの様な瞬間接着剤を用
い内層板同志をプリプレグを介して相互に接着固定して
から熱プレスにより一体成型する方法(ハ)等もある。In addition, after mechanically fixing the inner layer plate and the prepreg laminate with rivets or eyelets, they are integrally molded by heat press (b), or by using an instant adhesive such as cyanoacrylate to bond the inner layer plates together through the prepreg. There is also a method (c) in which they are adhesively fixed to each other and then integrally molded by heat pressing.
しかしながら(イ)ピンラミネーション法は、熱プレス
成型後にピン抜き及びピン回りに付着した樹脂除去の為
ステンレス板の研磨を行なわなければならず、生産性を
著しく阻害していた。However, (a) the pin lamination method requires polishing the stainless steel plate after hot press molding to remove the pins and remove the resin attached around the pins, which significantly impedes productivity.
また成型前後の厚み差を吸収する為、及びガイドピンを
立てる為に金型厚みを大きくする必要があり、作業性の
低下と大型寸法品を成型出来ないという欠点があり、更
に金型に孔を開けなければならないという欠点もあった
。In addition, it is necessary to increase the thickness of the mold in order to absorb the difference in thickness before and after molding and to erect guide pins, which has the disadvantage of reducing workability and not being able to mold large-sized products. It also had the disadvantage of having to be opened.
また(口)機械的カシメ法はリベット、へトメがステン
レス板を損傷する恐れがあり、しばしば品質管理上、大
きな問題を起こしていた。In addition, the mechanical crimping method has the risk of rivets and dents damaging the stainless steel plate, often causing major problems in terms of quality control.
さらに(ハ)シアノアクリレートの様な瞬間接着剤を用
いる方法は前述の(イ)、<o)法の問題は無いものの
位置合せ作業と接着剤硬化時間のタイミングが取り難く
、結果的に位置ずれを発生する事がしばしばであった。Furthermore, (c) a method using an instant adhesive such as cyanoacrylate does not have the problems of methods (a) and <o) mentioned above, but it is difficult to time the alignment work and the adhesive curing time, resulting in misalignment. This often occurred.
本発明の方法は、これらの課題を解決する為になされた
ものであり、内層板同志で位置決めが必要な少なくとも
2枚の内層板を用いた多層積層板を、生産性を阻害する
事無く、品質のバラツキ無く製造する方法を提供する事
を目的とする。The method of the present invention has been made to solve these problems, and can produce multilayer laminates using at least two inner layers that require positioning among the inner layers without impeding productivity. The purpose is to provide a manufacturing method with no variation in quality.
本発明の多層積層板製造方法は、少なくとも2枚の内層
板を用いた多層積層板を製造するにあたり、少なくとも
該2枚の内層板をプリプレグを介在させて位置合せして
積層後、紫外線硬化型樹脂で固定接着させてから熱プレ
スにより成型する事を特徴とする多層積層板の製造方法
、を要旨とする。The method for manufacturing a multilayer laminate of the present invention includes, in manufacturing a multilayer laminate using at least two inner laminates, aligning and laminating at least two inner laminates with a prepreg interposed therebetween, and then applying an ultraviolet curing type. The gist of this invention is a method for manufacturing a multilayer laminate, which is characterized by fixing and adhering with resin and then molding by hot pressing.
以下、本発明を図面を参照しながら説明する。Hereinafter, the present invention will be explained with reference to the drawings.
本発明の方法においては、例えば第3図に示す様に、ま
ずガラスエポキシ樹脂等の銅張積層板のIR箔面に所定
の回路パターンを形成した内層板aの少なくとも2枚の
所定枚数を、上記銅張積層板と好ましくは同材質のプリ
プレグb1を介在させて位置合わせして積層するが、そ
の時内層板及び/又はプリプレグの適当な箇所、好まし
くはその周辺すなわち端部に紫外線硬化型樹脂Cを塗付
しておく、樹脂を塗付する端部の態様を、例えば第7図
((a)、Cb+; (C) >に示す(図の斜線部が
樹脂塗布部を示す)が、特にこれに限定されるものでは
ない。In the method of the present invention, for example, as shown in FIG. 3, a predetermined number of at least two inner layer plates a each having a predetermined circuit pattern formed on the IR foil surface of a copper-clad laminate made of glass epoxy resin or the like, A prepreg b1 preferably made of the same material as the copper clad laminate is interposed and laminated in alignment, and at this time, an appropriate location of the inner laminate and/or prepreg, preferably the periphery, that is, the end thereof, is coated with ultraviolet curable resin C. The mode of the end portion to be coated with resin is shown, for example, in FIG. It is not limited to this.
次いで、位置合せ(位1決め)積層された内層板及びプ
リプレグに側面から紫外線を照射し、紫外線硬化型樹脂
を硬化させ、固定接着させる。Next, the laminated inner plate and prepreg are aligned and laminated with ultraviolet rays from the side, thereby curing the ultraviolet curable resin and fixing and adhering them.
次いで、接着固定された内層板の外側に同様のプリプレ
グb2 、b2 ;銅7id、dを重ね合せ、積層体
eを得る。その後、この積層体eの複数組を第4図に示
す通り、ステンレス板f、f、f−・・・・・−−・・
・・・−・・・を介在させて熱プレスの熱Fig、g間
に挿入、所定の条件で加熱、加圧成形して一体化させる
。Next, similar prepregs b2, b2; copper 7id, d are superimposed on the outside of the adhesively fixed inner layer plate to obtain a laminate e. Thereafter, as shown in FIG. 4, multiple sets of this laminate e are assembled into stainless steel plates f, f, f------.
. . . is inserted between the heat parts of the heat press, heated and pressure-molded under predetermined conditions, and integrated.
なお、紫外線硬化型樹脂としてはエポキシアクリレート
系、ウレタンアクリレート系、ポリエステルアクリレー
ト系、等が代表的である。また内層板aに介在するプリ
プレグbについては、第5−a図に示したように、内層
板に紫外線硬化型樹脂Cを塗付した部分を切欠き、内層
板同志を直接接合する方法でもかまわない。Note that typical examples of the ultraviolet curable resin include epoxy acrylate, urethane acrylate, and polyester acrylate. Regarding the prepreg b interposed in the inner layer plate a, as shown in Figure 5-a, the inner layer plate may be cut out at the part coated with ultraviolet curable resin C, and the inner layer plates may be directly bonded to each other. do not have.
さらに第5−b図に示すように、紫外線硬化型樹脂Cを
、プレス圧力で変形可能なスペースブロックhの両面に
塗付して内層板8間に挿入する方法、或いは内装板a側
にのみ樹脂を塗付し樹脂を塗付していないスペースブロ
ックhを挿入する方法、或いは内層板aとスペースブロ
ックhの両方に樹脂を塗布しておく方法でもかまわない
。Furthermore, as shown in Figure 5-b, there is a method in which the ultraviolet curable resin C is applied to both sides of the space block h which can be deformed by press pressure and inserted between the inner plates 8, or only on the inner plate a side. A method in which a space block h coated with resin and a space block h not coated with resin may be inserted, or a method in which both the inner layer plate a and the space block h are coated with resin may be used.
また紫外線硬化型樹脂を硬化するための紫外線を照射す
る時期は、プリプレグを介在させて内層板を位置決め積
層した後にすぐ行うとは限らず、さらに最外層プリプレ
グや銅箔を重ね合せた後でもかまわず、さらにそれらの
積層体をステンレス板を介して複数組積重ねた状態でも
良いことは勿論である。In addition, the timing of irradiating ultraviolet rays to cure the ultraviolet curable resin does not necessarily have to be done immediately after positioning and laminating the inner layer plates with the prepreg interposed, but it can also be done after the outermost layer prepreg or copper foil is laminated. Of course, a plurality of these laminates may be stacked with stainless steel plates interposed therebetween.
〔実施例]
以下に本発明の実施例及び比較例について記載し本発明
の実施の態様をより詳細に説明する。[Examples] Examples and comparative examples of the present invention will be described below to explain the embodiments of the present invention in more detail.
実施例1
サイズが5001111×50011nのガラスエポキ
シ樹脂両面銅張積層板の銅箔面に所定の内層回路パター
ンを形成して得た内層板2枚の板端に紫外線硬化型樹脂
MT−A U−2004−2(三井東圧化学製)を塗付
し2枚の内層板の間に内層板と同一サイズで内層板接合
部を切欠いたプリプレグを介在させて、基準孔を利用し
て位置合せ積層後、側面より紫外線を照射し、樹脂を固
化させ固定接着させた0次いでその両側に、内層板と同
サイズのプリプレグと銅箔を重ね合せ、これを1つの積
層体として第4図に示した方法で各種屠体間にステンレ
ス板を介在させ7組の積層体を熱板間に挿入し、熱プレ
スにより加熱加圧成型し、多層積層板を製造した。Example 1 A predetermined inner layer circuit pattern was formed on the copper foil surface of a glass epoxy resin double-sided copper-clad laminate having a size of 5001111 x 50011 nm.Ultraviolet curing resin MT-A U- was applied to the edges of two inner layer boards obtained by forming a predetermined inner layer circuit pattern on the copper foil surface. 2004-2 (manufactured by Mitsui Toatsu Chemical Co., Ltd.) was applied, a prepreg with the same size as the inner layer plates and a notched inner layer joint was interposed between the two inner layer plates, and after alignment and lamination using the reference holes, The resin was irradiated with ultraviolet rays from the side to solidify and adhere firmly. Next, prepreg and copper foil of the same size as the inner layer board were superimposed on both sides, and this was made into a single laminate using the method shown in Figure 4. Seven sets of laminates were inserted between hot plates with stainless steel plates interposed between the various carcasses, and heated and pressure molded using a hot press to produce multilayer laminates.
実施例2
サイズが500 mmX500 mmのガラスエポキシ
樹脂両面銅張積層板の銅箔面に所定の内層回路パターン
を形成して得た内層板2枚の板端に第5図に示した両面
に紫外線硬化型樹脂材−All−2004−2(三井東
圧化学製)を塗付したスペースブロックを配管しつつ2
枚の内層板の間に、内層板と同一サイズで内層板接合部
を切り欠いたプリプレグを介在させて、基準孔を利用し
て位置合せ積層後、側面より紫外線を照射し、樹脂を固
化させ固定接着させた0次いで、その側面に内層板と同
一サイズのプリプレグと銅箔を重ね合せ、これを1つの
積層体として第4図に示した方法で各屠体間にステンレ
ス板を介在させ7組の積層体を熱板間に挿入し熱プレス
により加熱加圧成型し、多層積層板を製造した。Example 2 A predetermined inner layer circuit pattern was formed on the copper foil surface of a glass epoxy resin double-sided copper-clad laminate having a size of 500 mm x 500 mm. The edges of two inner layer boards were exposed to ultraviolet rays on both sides as shown in FIG. While piping a space block coated with hardening resin material - All-2004-2 (manufactured by Mitsui Toatsu Chemical) 2
A prepreg with the same size as the inner layer plates and a cutout at the joint of the inner layer plates is interposed between the two inner layer plates, and after alignment and lamination using the reference holes, ultraviolet rays are irradiated from the side to solidify the resin and fix it. Next, a prepreg and copper foil of the same size as the inner layer board were stacked on the side of the carcass, and this was made into one laminate using the method shown in Figure 4 with a stainless steel plate interposed between each carcass to form 7 sets. The laminate was inserted between hot plates and heated and pressed using a hot press to produce a multilayer laminate.
比較例
実施例1.2で用いたのと同じ内層板、プリプレグ、銅
箔を用い第2図に示す様なピンラミネーション法にて位
置合せ積層し、熱板間に挿入し熱プレスして加熱加圧し
た。これらの実施例1.2及び比較例について内層板間
の位置精度を測定した結果を表−1に示す。Comparative Example Using the same inner layer board, prepreg, and copper foil as used in Example 1.2, they were aligned and laminated by the pin lamination method as shown in Figure 2, and then inserted between hot plates and heated by hot pressing. Pressurized. Table 1 shows the results of measuring the positional accuracy between the inner layer plates for these Examples 1.2 and Comparative Examples.
(なお、測定ポイントA、B、C,DおよびEは第6図
に示したごとき位置に対応する。)表−1位置精度測定
値(単位μ)
表−1から明らかな様に、位置精度について、本発明の
実施例と従来法を示す比較例の精度の差は無く、本発明
に従えば、従来法に比較して、溝かに容易に従来の厄介
な方法により得られるものと同精度の製品が得られるこ
とがわかる。(Measurement points A, B, C, D, and E correspond to the positions shown in Figure 6.) Table 1 Position accuracy measurement values (unit μ) As is clear from Table 1, position accuracy Regarding this, there is no difference in accuracy between the embodiment of the present invention and the comparative example showing the conventional method, and according to the present invention, compared to the conventional method, the groove can be easily obtained and the same as that obtained by the conventional cumbersome method. It can be seen that a highly accurate product can be obtained.
〔発明の効果〕
以上の樺に、本発明に従えば、予め位置合せ(位置決め
)積層したものを紫外線硬化型樹脂で固定するので、位
置決め精度が良好であり、固定に嬰する時間も短時間で
済み、かつ、熱圧時の金型やピンが不要となり高い品質
を維持したまま作業性、生産性を著しく向上させる事が
出来るのであるから、その産業上の利用可能性は極めて
大きいと言わざるを得ないのである。[Effects of the Invention] According to the present invention, the above-mentioned birch is laminated in advance and fixed with ultraviolet curing resin, so the positioning accuracy is good and the time required for fixing is short. It is said that its industrial applicability is extremely large, as it eliminates the need for molds and pins during hot pressing, significantly improving workability and productivity while maintaining high quality. It is inevitable.
なお図による本発明の説明及び実施例は、6層仮につい
て述べているが8層以上についても同様の効果を得る事
ができることは勿論である。Although the explanation and examples of the present invention with reference to the drawings are based on six layers, it goes without saying that similar effects can be obtained with eight or more layers.
第1図は、6層板の構成を説明する断面図、第2図は、
従来の多層積層板の製造方法を説明する断面図、第3図
、第4図、第5−a図、第5−b図は本発明の詳細な説
明する断面図、第6図は、位置精度の測定点を示す説明
図である。第7図(a)、第7図(b)、第7図(C)
は、紫外線効果型樹脂を塗付する位置を示す平面図であ
る。Figure 1 is a cross-sectional view explaining the structure of the six-layer board, and Figure 2 is
FIG. 3, FIG. 4, FIG. 5-a, and FIG. 5-b are cross-sectional views explaining the present invention in detail. FIG. 2 is an explanatory diagram showing accuracy measurement points. Figure 7(a), Figure 7(b), Figure 7(C)
FIG. 2 is a plan view showing a position where an ultraviolet-effect resin is applied.
Claims (1)
造するにあたり、少なくとも該2枚の内層板をプリプレ
グを介在させて位置合せして積層後、紫外線硬化型樹脂
で固定接着させてから熱プレスにより成型する事を特徴
とする多層積層板の製造方法。(1) When manufacturing a multilayer laminate using at least two inner laminates, at least the two inner laminates are aligned and laminated with prepreg interposed, and then fixed and bonded with ultraviolet curable resin. A method for manufacturing a multilayer laminate, characterized by molding by heat pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63192677A JP2609298B2 (en) | 1988-08-03 | 1988-08-03 | Manufacturing method of multilayer laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63192677A JP2609298B2 (en) | 1988-08-03 | 1988-08-03 | Manufacturing method of multilayer laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0243048A true JPH0243048A (en) | 1990-02-13 |
| JP2609298B2 JP2609298B2 (en) | 1997-05-14 |
Family
ID=16295209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63192677A Expired - Lifetime JP2609298B2 (en) | 1988-08-03 | 1988-08-03 | Manufacturing method of multilayer laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2609298B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005276873A (en) * | 2004-03-23 | 2005-10-06 | Tatsuta System Electronics Kk | Shielding film for printed wiring board and its manufacturing method |
| JP2010064441A (en) * | 2008-09-12 | 2010-03-25 | Fujifilm Corp | Structure using ring-opening photopolymerizable composition, and bonding method |
| EP1998594A3 (en) * | 2007-05-30 | 2010-04-28 | Siemens Medical Instruments Pte. Ltd. | Hearing device element support with battery recess |
-
1988
- 1988-08-03 JP JP63192677A patent/JP2609298B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005276873A (en) * | 2004-03-23 | 2005-10-06 | Tatsuta System Electronics Kk | Shielding film for printed wiring board and its manufacturing method |
| EP1998594A3 (en) * | 2007-05-30 | 2010-04-28 | Siemens Medical Instruments Pte. Ltd. | Hearing device element support with battery recess |
| JP2010064441A (en) * | 2008-09-12 | 2010-03-25 | Fujifilm Corp | Structure using ring-opening photopolymerizable composition, and bonding method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2609298B2 (en) | 1997-05-14 |
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