JPH04208552A - Substrate table for dicing - Google Patents

Abstract

PURPOSE:To remove the pressure sensitive adhesive and the chip adhering to the blade so as to prevent the enlargement of chipping and the chipping at the rear by providing a dresser in the vicinity of the circumference of the substrate stuck to the table, and cutting in the dresser with the blade together with the dicing of the substrate. CONSTITUTION:In a table 1, a wafer 3 is stuck to approximately the center of a circular adhesive tape 2 being the base, which has a pressure sensitive adhesive 2a, and a circular dresser plate 4 with a specified width is stuck to the vicinity of the wafer 3. This dresser plate 4 is made of, for example, the sintered substance, which has silicon carbide for its main ingredient, and the pressure sensitive adhesive, etc., adhering to the blade are removed. Moreover, a frame 5 is provided at the periphery of the adhesive tape 2, and it dices the wafer 3 into chip units along the specified cutting line in longitudinal and lateral directions. And after the blade dices the one line of the board, it is brought into contact with the dresser to polish the blade. Hereby, the chipping in the board does not enlarge, and it ceases to cause the chipping at the rear.

Description

[Detailed description of the invention]

[00011

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing substrate table used for dicing a substrate into predetermined units. In recent years, for example, when cutting a wafer substrate into chips, a full-cut method has become mainstream for automation and quality improvement. Full-cutting increases cutting resistance because it cuts into the adhesive that adheres the wafer to the table, and is likely to cause defects such as chipping, so dicing with fewer defects is required. Therefore, it is necessary to periodically polish the dicing blade. [0002] FIG. 3 is a diagram for explaining conventional wafer dicing. Table 2 in Figure 3(A)
0, a wafer 21 is stuck on an adhesive tape 22 approximately at the center, a frame 23 is provided on the peripheral edge of the table 20, and the wafer 21 is diced along a cutting line 24. [0003] When dicing such a wafer 21, as shown in FIG. 3(B), the blade 25 cuts into the adhesive tape 22 on the table 20 by 20 to 50 μm to completely cut the wafer 21. However, as the wafer is diced, the adhesive 22a of the adhesive tape 22 adheres to the blade 25, resulting in larger chimping 26a and chipping 26b on the back surface of the wafer. The chipping 26b etc.
If it is placed on the chip surface when the chip is picked up, it may cause shorts between wires or pads during the assembly process. In this case, the table 20 is replaced with a dresser plate, and dicing is performed after polishing the blade 25 with the dresser plate, or the dresser is moved to contact the blade 25 during dicing and dicing is performed while polishing. [0004] FIG. 3(C) shows a case where the blade is polished during dicing. That is, a dresser 27 is movably arranged near the blade 25, and is moved in the direction of the arrow by a drive mechanism (not shown) to cover the blade 2.
5, contact and non-contact are repeated. [0005]

[Problem to be solved by the invention] However, Table 20
Polishing of the blade 25, which is performed by replacing the blade, is performed after the chipping of the wafer 21 becomes large or after chipping occurs on the back of the wafer, so chipping cannot be completely prevented, and polishing The problem is that it takes a lot of time. [0006] Furthermore, polishing of the blade 25 by moving the dresser 27 as shown in FIG.
There is a problem in that a separate drive mechanism is required to move the . SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate table for dicing that is compact and inexpensive, and reduces defects caused by chipping of the substrate and chipping of the back surface. [0007]

[Means for Solving the Problems] The above-mentioned problem is solved by using a dicing substrate table in which substrates to be diced into predetermined units by a blade are set. This can be solved by providing a dresser with a predetermined shape for removing the adhesive and other chips adhering to the blade. [0008]

[Operation] As described above, the table of the present invention is provided with a dresser near the periphery of the adhered substrate. When the blade is used to fully cut the substrate in predetermined units, the blade is brought into contact with a dresser to polish the blade after dicing one line of the substrate. [0009] This prevents large chipping on the substrate and prevents chipping from occurring on the back surface. Furthermore, since the dresser is not moved, a drive mechanism is not required, making it possible to reduce the cost and size. [00101

[Embodiment] FIG. 1 shows a configuration diagram of an embodiment of the present invention. FIG. 1(A) is a plan view, and FIG. 1(B) is a sectional view. On the table 1 shown in FIGS. 1A and 1B, a wafer 3, which is a substrate, is attached to the substantially central portion of a circular adhesive tape 2, which is a base material having an adhesive 2a. A circular dresser plate 4 having a predetermined width is attached near the periphery of the wafer 3 . This dresser plate 4 is formed of, for example, a sintered body mainly composed of silicon carbide, and is used to remove adhesive and the like adhering to the blade, which will be described later. Further, a frame 5 is provided at the peripheral edge of the adhesive tape 2. Then, the wafer 3 is diced into chips along predetermined cutting lines 6 in the vertical (Y) direction and the horizontal (X) direction. [00111 Next, FIG. 2 shows a diagram for explaining dicing of the present invention. Table 1 as shown in Figure 1 is
It is placed in a dicing device, and the blade 7 performs dicing along the cutting line 6 in the X and Y directions. Figure 2 (
In A), the blade 7 cuts into the adhesive tape 2 (adhesive 2a) to a depth of about 20 to 50 μm to fully cut the wafer 3 in the direction of the arrow. And, Figure 2 (B
), the blade 7 is made to cut into the dresser plate 4 after dicing the wafer 3. That is,
When dicing the wafer 3, the adhesive 2a and chips adhere to the cutting edge of the blade 7, causing larger chipping and chipping on the back of the wafer. In addition to removing these particles, they are also polished. Therefore, the cutting resistance of the blade 7 is always stable at a small level. [0012] Thereby, as described above, it is possible to prevent the chipping from increasing in size and the back surface from being chipped, and the quality of the semiconductor element can be improved. Further, since the dresser plate 4 is provided on the table 1 and not on the blade 4 side, a drive mechanism or the like is not required, and the dicing apparatus can be made inexpensive and compact. In the above embodiment, a case where a wafer as a substrate is diced in units of chips is shown, but the present invention is not limited to this and can be applied to a case where a printed circuit board or the like is diced in minute units. Moreover, the draining plate 4 does not necessarily have to be circular, but may have any shape as long as it is located in the extension direction of the dicing direction for each -line. [0013] As described above, according to the present invention, a dresser is provided near the periphery of a substrate adhered to a table, and the adhesive adhering to the blade is removed by cutting into the dresser while dicing the substrate with a blade. By removing chemicals and chips, it is possible to prevent larger chips and chipping on the back surface. Furthermore, since the dresser is not provided on the blade side, the dicing apparatus can be made inexpensive and compact.

[Brief explanation of the drawing]

FIG. 1 is a configuration diagram of an embodiment of the present invention.

FIG. 2 is a diagram for explaining dicing of the present invention.

FIG. 3 is a diagram for explaining conventional wafer dicing.

[Explanation of symbols]

1 Table 2 Adhesive tape 2a Adhesive 3 Wafer 4 Dresser plate 5 Frame 6 Cutting line 7 Blade

Claims (1)

[Claims] 1. In a dicing substrate table on which a substrate (3) to be diced into predetermined units by a blade (7) is set, the adhesive (2a) is attached to a base material (2) provided with an adhesive (2a). A substrate table for dicing, characterized in that a dresser (4) of a predetermined shape is provided near the periphery of the substrate (3) to remove the adhesive (2a) and other chips adhering to the blade (7).