JPH0423146U - - Google Patents

Info

Publication number
JPH0423146U
JPH0423146U JP1990064360U JP6436090U JPH0423146U JP H0423146 U JPH0423146 U JP H0423146U JP 1990064360 U JP1990064360 U JP 1990064360U JP 6436090 U JP6436090 U JP 6436090U JP H0423146 U JPH0423146 U JP H0423146U
Authority
JP
Japan
Prior art keywords
semiconductor element
mounting part
base
package
tantalum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990064360U
Other languages
English (en)
Other versions
JPH0810952Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990064360U priority Critical patent/JPH0810952Y2/ja
Publication of JPH0423146U publication Critical patent/JPH0423146U/ja
Application granted granted Critical
Publication of JPH0810952Y2 publication Critical patent/JPH0810952Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Packaging Frangible Articles (AREA)

Description

【図面の簡単な説明】
第１図は本考案にかかる半導体素子収納用パツ
ケージの一実施例を示す断面図、第２図は従来の
半導体素子収納用パツケージの断面図である。 １……基体、１ａ……半導体素子載置部、２…
…絶縁枠体、４……容量素子。

Claims (1)

    【実用新案登録請求の範囲】
  1. 上面中央部に半導体素子が載置される載置部を
    有する基体上に、該載置部を囲繞するようにして
    絶縁枠体を取着して成る半導体素子収納用パツケ
    ージにおいて、前記基体を金属タンタルで形成し
    、且つ基体の半導体素子載置部表面に陽極酸化処
    理によつて得られる酸化タンタルを誘電体とした
    容量素子を形成したことを特徴とする半導体素子
    収納用パツケージ。
JP1990064360U 1990-06-18 1990-06-18 半導体素子収納用パッケージ Expired - Lifetime JPH0810952Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990064360U JPH0810952Y2 (ja) 1990-06-18 1990-06-18 半導体素子収納用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990064360U JPH0810952Y2 (ja) 1990-06-18 1990-06-18 半導体素子収納用パッケージ

Publications (2)

Publication Number Publication Date
JPH0423146U true JPH0423146U (ja) 1992-02-26
JPH0810952Y2 JPH0810952Y2 (ja) 1996-03-29

Family

ID=31595235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990064360U Expired - Lifetime JPH0810952Y2 (ja) 1990-06-18 1990-06-18 半導体素子収納用パッケージ

Country Status (1)

Country Link
JP (1) JPH0810952Y2 (ja)

Also Published As

Publication number Publication date
JPH0810952Y2 (ja) 1996-03-29

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term