JPH0423252U - - Google Patents
Info
- Publication number
- JPH0423252U JPH0423252U JP6444790U JP6444790U JPH0423252U JP H0423252 U JPH0423252 U JP H0423252U JP 6444790 U JP6444790 U JP 6444790U JP 6444790 U JP6444790 U JP 6444790U JP H0423252 U JPH0423252 U JP H0423252U
- Authority
- JP
- Japan
- Prior art keywords
- mirror
- finishing
- weight
- semiconductor substrate
- stacked
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 239000004745 nonwoven fabric Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Description
第１図は本考案に用いるウエイトの実施例を示
すａ平面図およびｂＡ−Ａ矢視側面図、第２図は
本考案のウエイトを装置加圧部内に積み重ねた状
態を示す平面図、第３図は半導体基板のサイズと
研磨速度の関係を示す特性図、第４図は半導体基
板のサイズと歩留りの関係を示す特性図、第５図
はウエイトの従来例を示すａ平面図、ｂ側断面図
、第６図は加圧部の従来例を示す断面図である。
２……加圧部昇降用シヤフト、３……加圧部底
板、４……ボルト、５……セラミツクプレート、
６……定盤、７……不織布、８……半導体基板、
９……ノズル、１０……ウエイト、１１，２１…
…半円状ウエイト。
Fig. 1 is a plan view and b a side view taken along arrow A-A of the weight used in the present invention, Fig. 2 is a plan view showing the weight of the present invention stacked in the pressurizing section of the device, and Fig. 3 is a plan view showing an embodiment of the weight used in the present invention. The figure is a characteristic diagram showing the relationship between semiconductor substrate size and polishing rate, Figure 4 is a characteristic diagram showing the relationship between semiconductor substrate size and yield, and Figure 5 is a plan view and b side cross section showing a conventional weight example. FIG. 6 is a sectional view showing a conventional example of a pressurizing section. 2... Shaft for lifting and lowering the pressure section, 3... Bottom plate of the pressure section, 4... Bolt, 5... Ceramic plate,
6...Surface plate, 7...Nonwoven fabric, 8...Semiconductor substrate,
9... Nozzle, 10... Weight, 11, 21...
...Semicircular weight.
Claims (1)
した加圧部を用いて不織布に押しつけながら鏡面
に仕上げる鏡面化加工装置において、前記ウエイ
トは２分割されて半円形状とされ、その一方の面
に凹部が他方の面に凸部がそれぞれ設けられ、凹
部に凸部を嵌合させて積み重ねるようにしたこと
を特徴とする半導体基板の鏡面化加工装置。 ２ 前記ウエイトを９０°ずつずらして積み重ね
ることを特徴とする請求項１記載の半導体基板の
鏡面化加工装置。[Claims for Utility Model Registration] 1. In a mirror-finishing device that finishes the surface of a semiconductor substrate to a mirror surface while pressing it against a nonwoven fabric using a pressure unit equipped with a disc-shaped weight, the weight is divided into two parts to form a semicircular shape. 1. An apparatus for mirror-finishing semiconductor substrates, characterized in that the semiconductor substrate has a concave portion on one surface and a convex portion on the other surface, and is stacked by fitting the convex portions into the concave portions. 2. The apparatus for mirror-finishing semiconductor substrates according to claim 1, wherein the weights are stacked while being shifted by 90 degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6444790U JPH0423252U (en) | 1990-06-20 | 1990-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6444790U JPH0423252U (en) | 1990-06-20 | 1990-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0423252U true JPH0423252U (en) | 1992-02-26 |
Family
ID=31595407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6444790U Pending JPH0423252U (en) | 1990-06-20 | 1990-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0423252U (en) |
-
1990
- 1990-06-20 JP JP6444790U patent/JPH0423252U/ja active Pending