JPH04256309A - semiconductor manufacturing equipment - Google Patents
semiconductor manufacturing equipmentInfo
- Publication number
- JPH04256309A JPH04256309A JP3017928A JP1792891A JPH04256309A JP H04256309 A JPH04256309 A JP H04256309A JP 3017928 A JP3017928 A JP 3017928A JP 1792891 A JP1792891 A JP 1792891A JP H04256309 A JPH04256309 A JP H04256309A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- semiconductor manufacturing
- manufacturing equipment
- chuck
- processing chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Coating Apparatus (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【０００１】0001
【産業上の利用分野】本発明は半導体製造装置に関し、
特に半導体基板（ウェハー）へのフォトレジストの塗布
装置およびフォトレジストの現像装置に関する。[Industrial Application Field] The present invention relates to semiconductor manufacturing equipment.
In particular, the present invention relates to a photoresist coating apparatus for a semiconductor substrate (wafer) and a photoresist developing apparatus.
【０００２】0002
【従来の技術】従来、この種の半導体製造装置において
は、ウェハー裏面を回転真空チャックに吸着固定し、ス
ピンモーターで回転させつつウェハー表面に薬液を塗布
している。この際、チャックの吸着位置はウェハー中心
部一点のみであり、ウェハー周辺部は浮いた状態になっ
ている。2. Description of the Related Art Conventionally, in this type of semiconductor manufacturing apparatus, the back surface of a wafer is suctioned and fixed to a rotating vacuum chuck, and a chemical solution is applied to the surface of the wafer while being rotated by a spin motor. At this time, the chuck's suction position is only at one point at the center of the wafer, and the periphery of the wafer is in a floating state.
【０００３】0003
【発明が解決しようとする課題】上述した従来のウェハ
ー吸着機構では、ウェハーの自重による周辺部のそりの
ため、ウェハー割れ及びウェハーに塗布した薬液の膜厚
変動等が生ずるという問題点があった。[Problems to be Solved by the Invention] The above-mentioned conventional wafer adsorption mechanism has problems such as wafer cracking and variations in the film thickness of the chemical solution applied to the wafer due to warping of the wafer's peripheral portion due to its own weight. .
【０００４】0004
【課題を解決するための手段】本発明は、ウェハーを処
理チャンバー内にて真空吸着後回転運動させ、薬液塗布
処理を行う半導体製造装置において、自重によるウェハ
ー周辺部のそりを防ぐために、ウェハー中心部および周
辺部にて吸着を行うための分岐構造の真空チャックを有
している。[Means for Solving the Problems] The present invention provides a semiconductor manufacturing apparatus in which a wafer is vacuum-adsorbed in a processing chamber and then rotated to perform a chemical coating process. It has a vacuum chuck with a branched structure to perform suction at the central and peripheral parts.
【０００５】[0005]
【実施例】次に本発明について図面を参照して説明する
。図１は本発明の一実施例を示す図で、同図（ａ）は平
面図、同図（ｂ）はその内部構造を示す正面図である。
図１において、１は処理チャンバー、３は処理チャンバ
ー内でウェハー２に遠心力を作用させるチャック、４は
チャックを回転させるスピンモーターである。本実施例
は、処理チャンバー１内にあるウェハー吸着用のチャッ
ク３のウェハー吸着部を分岐させ、ウェハー２の中央部
の他に周辺部に３個所吸着部を設けたことによって、ウ
ェハーの自重による周辺部のそりを防ぎ、ウェハー上に
塗布する薬液の膜厚ばらつきを押さえ、かつ負荷による
割れを低減している。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings. FIG. 1 is a diagram showing an embodiment of the present invention; FIG. 1(a) is a plan view, and FIG. 1(b) is a front view showing its internal structure. In FIG. 1, 1 is a processing chamber, 3 is a chuck that applies centrifugal force to the wafer 2 within the processing chamber, and 4 is a spin motor that rotates the chuck. In this embodiment, the wafer suction part of the wafer suction chuck 3 in the processing chamber 1 is branched, and three suction parts are provided in the periphery of the wafer 2 in addition to the central part, so that the wafer's own weight can be reduced. This prevents warping at the periphery, suppresses variations in the film thickness of the chemical applied to the wafer, and reduces cracking due to load.
【０００６】[0006]
【発明の効果】以上説明したように本発明は、ウェハー
の吸着をウェハーの中央部および周辺部で行うことによ
り、ウェハーのそりを防ぎ、薬液の膜厚変動を押さえ、
かつウェハーの割れを低減するという効果を有する。As explained above, the present invention prevents warping of the wafer by adsorbing the wafer at the center and the periphery of the wafer, suppresses variations in the film thickness of the chemical solution, and prevents the wafer from warping.
It also has the effect of reducing wafer cracking.
【図１】本発明の一実施例を示す図で、同図（ａ）は平
面図、同図（ｂ）はその内部構造を示す正面図である。FIG. 1 is a diagram showing an embodiment of the present invention; FIG. 1(a) is a plan view, and FIG. 1(b) is a front view showing its internal structure.
１ 処理チャンバー ２ ウェハー ３ チャック ４ スピンモーター 1 Processing chamber 2 Wafer 3 Chuck 4 Spin motor
Claims (1)
吸着後回転運動させ、薬液塗布処理を行う半導体製造装
置において、ウェハーの真空吸着用チャックがウェハー
中心部およびウェハー周辺部を支持する分岐構造を備え
たことを特徴とする半導体製造装置。1. In a semiconductor manufacturing apparatus in which a wafer is vacuum suctioned in a processing chamber and then rotated to perform a chemical coating process, a chuck for vacuum suction of the wafer has a branch structure that supports the center of the wafer and the periphery of the wafer. A semiconductor manufacturing device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3017928A JPH04256309A (en) | 1991-02-08 | 1991-02-08 | semiconductor manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3017928A JPH04256309A (en) | 1991-02-08 | 1991-02-08 | semiconductor manufacturing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04256309A true JPH04256309A (en) | 1992-09-11 |
Family
ID=11957437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3017928A Pending JPH04256309A (en) | 1991-02-08 | 1991-02-08 | semiconductor manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04256309A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106887401A (en) * | 2015-12-15 | 2017-06-23 | 浙江鸿禧能源股份有限公司 | A kind of new classification and Detection board rectifier sucker |
-
1991
- 1991-02-08 JP JP3017928A patent/JPH04256309A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106887401A (en) * | 2015-12-15 | 2017-06-23 | 浙江鸿禧能源股份有限公司 | A kind of new classification and Detection board rectifier sucker |
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