JPH0427155Y2 - - Google Patents

Description

[Detailed description of the invention] [Industrial field of application] The invention consists of laminating multiple layers of ceramic green sheets with conductors printed on them, and placing resistors on top or in the recesses.
Equipped with electronic components such as capacitors and inductors,
The present invention relates to a ceramic package electronic component in which these electronic components are connected to the conductor.

[Prior Art] Figures 6 and 7 show the basic structure of this type of ceramic package electronic component. As shown in FIG. 6, a substrate 1 is made by laminating and sintering a plurality of ceramic green sheets 2a, 2b... on which electrodes 3, 3... made of conductor layers and through-hole conductors 4, 4... are formed. It is formed. Among the ceramic green sheets, the green sheets 2b, 2b, . It has a recess 5 that opens upward.

As shown in FIG. 7, electronic components 6a, 6b, such as resistors, capacitors, and inductors, are mounted in the recess 5 and on the substrate 1, and these are connected to the electrodes 3, 3, . . . ...is soldered to. In the electronic component thus configured, the electronic component 6 serving as a component is integrally held via the substrate 1, and these also connect the electrodes 3, 3... and through-hole conductors 4, 4... They are electrically connected through the wire and configured as a composite component.

Conventionally, when manufacturing the substrate 1, a plurality of sheets of conductive paste printed on a large ceramic green sheet are laminated, stacked, pressed, and fired, and then the individual substrates are manufactured. A method is used in which the data is divided into 1 parts. In FIG. 6, only one sheet 2a, 2b, . . . of the substrate 1 is shown, but each of these sheets has a different conductor pattern.

[Problems to be Solved by the Invention] However, the conventional ceramic package electronic components have the following problems.

That is, each layer of the ceramic green sheets 2a, 2b, etc. that constitutes the substrate 1 has a different conductor printing pattern, so each layer is printed separately using a different printing plate (for example, a printing screen), and a predetermined pattern is printed on each layer. Must be stacked in this order.
For this reason, not only many types of printing plates are required, but also many steps are required for printing and laminating processes.

In addition, although the same number of good ceramic green sheets for each layer is required, ceramic green sheets 2a and 2b having different conductor patterns are used.
The yield of each layer of ceramic green sheets differs due to shrinkage deviations during the drying stage or positional deviations during printing. For this reason, in order to match the minimum number of layers, ceramic green sheets with half of the other layers are treated as defective products, resulting in a disadvantage in that the manufacturing yield is poor.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a ceramic package electronic component that can solve the above-mentioned conventional problems.

[Means for Solving the Problems] In other words, the gist of the means adopted in the present invention in order to solve the above problems is to provide a substrate 1 made of a laminate of ceramic sheets 2a, 2b...on which conductor layers are formed. And electronic components 6a, 6b mounted on this board 1 and connected to each other by the conductor layer...
In a ceramic package electronic component comprising..., the substrate 1 is made of ceramic sheets 2a, 2b on which conductors are formed in the same pattern.
...and some sheets 2 stacked on the upper layer side
This is a ceramic package electronic component characterized by being formed by stacking a plurality of layers, each of which is punched out in the center.

[Function] Ceramic green sheets 2a, 2b, which constitute the substrate 1 of the ceramic package electronic component...
Since the conductors such as electrodes 3, 3, etc. are formed in the same pattern, the conductor patterns can be printed using the same printing plate. In addition, since all layers have the same conductor pattern, accurate printing can be performed without positional deviation during printing, and the shrinkage rate during firing can be made generally the same for each layer. Therefore, misalignment between each layer becomes less likely to occur. Furthermore, since the ceramic green sheets 2a, 2b, . . . all have the same conductor pattern, they can be manufactured by allocating them to each layer according to the quality of the sheets.

[Example] Next, an example of the present invention will be specifically described with reference to FIGS. 1 to 5.

As shown in FIG.
The substrate 1 is formed by laminating a plurality of ceramic green sheets 2a, 2b, . . . on which through-hole conductors 4, 4, . In this invention, these ceramic green sheets 2
As a, 2b, . . . , conductors are printed and formed in the same pattern. However, the green sheets 2a, 2b, etc. stacked on the upper layer side are those whose central part is punched out into a square or rectangle shape, and only this point differs from the green sheet 2a on the lower layer side.

As shown in FIG. 2, a recess 5 is formed in the central part of the upper sheets 2b, 2b, . Electronic components 6a, etc.
6b... are mounted, and these are the electrodes 3, 3...
...is soldered to. In the electronic component configured in this way, the electronic component 6 serving as a component is integrally held via the substrate 1, and these are connected to the electrodes 3, 3... and the through-hole conductors 4, 4...
It is configured as a composite electronic component having a circuit as shown in FIG. 5, for example.

In the illustrated embodiment, the through-hole conductors 4, 4...
... are formed on the walls of so-called end-face through holes formed on the sides of the ceramic sheets 2a, 2b, etc., but this is to reduce the size of the substrate 1, and the periphery is completely closed. Of course, it is possible to form a general through hole and form through hole conductors 4, 4, . . . on the wall surface thereof. Furthermore, the circuit shown in FIG. 5 is an example of a composite electronic component configured as this ceramic package electronic component, and the types of electronic components that make up the composite electronic component include capacitors, inductors, resistors, semiconductors, etc. Various parts and the like can be used.

FIGS. 3 and 4 show the ceramic sheet 2.
The printing patterns of a and 2b are shown. As shown in the figure, a plurality of conductor patterns that will become the electrodes 3, 3 are printed vertically and horizontally, and sheets 2a, 2b for each of these units are printed.
. . . are divided by cutting lines 7, 7 . . . . Through holes 8, 8... are bored on these cutting lines 7, 7..., and at the same time as printing of conductive paste for forming the electrodes 3, 3..., these through holes 8, 8... A conductive paste is filled, and this becomes the aforementioned through-hole conductor 4, 4...
becomes.

Among these sheets 2a, 2b..., the sheets 2b, 2b... stacked on the upper layer side are punched out into a square or rectangular shape at the center as shown by the dotted line, and then stacked, so that the concave portion 5 of the substrate 1 is punched out. It is formed.

These sheets 2a, 2b, . . . are laminated, crimped, fired, cut along the cutting lines 7, 7, . . ., and divided into individual substrates 1, 1, . Thereafter, electronic components 6a and 6b are mounted on this, and a composite electronic component made of ceramic package electronic components is completed.

[Effects of the invention] As explained above, according to the present invention, it is possible to provide a ceramic package electronic component that is easy to print, is less likely to be misaligned during printing, and is therefore easy to manufacture and has a high yield. .

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view of a ceramic package electronic component showing an embodiment of the present invention, FIG. 2 is a perspective view of the electronic component in its completed state, and FIG. 3 is an example of a conductive print pattern on a ceramic sheet. A plan view showing,
FIG. 4 is a partially enlarged view, FIG. 5 is a wiring diagram showing an example of an equivalent circuit of a ceramic package electronic component, and FIG. 6 is an exploded perspective view of a conventional ceramic package electronic component. FIG. 7 is a perspective view of the conventional example in a completed state. DESCRIPTION OF SYMBOLS 1... Substrate, 2a, 2b... Ceramic sheet, 3... Electrode, 4... Through-hole conductor, 5
...Concavity, 6a, 6b...Electronic component.

Claims (1)

[Scope of utility model registration request] Ceramic green sheet 2 with conductor layer formed
In the ceramic package electronic component, the substrate 1 is composed of a substrate 1 which is a sintered laminate of laminates 6a, 2b, . . . , and electronic components 6a, 6b, . , a plurality of ceramic sheets 2a, 2b... each having a conductor formed in the same pattern, with the center of some of the sheets 2b, 2b... stacked on the upper layer side being punched out. A ceramic package electronic component characterized by being formed by laminating and sintering.