JPH0427310B2 - - Google Patents
Info
- Publication number
- JPH0427310B2 JPH0427310B2 JP14341985A JP14341985A JPH0427310B2 JP H0427310 B2 JPH0427310 B2 JP H0427310B2 JP 14341985 A JP14341985 A JP 14341985A JP 14341985 A JP14341985 A JP 14341985A JP H0427310 B2 JPH0427310 B2 JP H0427310B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- copper
- nickel
- dissolving
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 64
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 57
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Natural products CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 56
- 239000000243 solution Substances 0.000 claims description 37
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 36
- 229910017604 nitric acid Inorganic materials 0.000 claims description 36
- 229910052759 nickel Inorganic materials 0.000 claims description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 28
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 13
- 229910002651 NO3 Inorganic materials 0.000 claims description 10
- 239000011259 mixed solution Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 36
- 239000010949 copper Substances 0.000 description 36
- 229910052802 copper Inorganic materials 0.000 description 35
- 238000004090 dissolution Methods 0.000 description 28
- 239000007788 liquid Substances 0.000 description 27
- 239000003153 chemical reaction reagent Substances 0.000 description 25
- 239000000126 substance Substances 0.000 description 25
- 238000007747 plating Methods 0.000 description 21
- 229910000881 Cu alloy Inorganic materials 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- -1 salts copper sulfate Chemical class 0.000 description 10
- 238000003756 stirring Methods 0.000 description 8
- 229910052739 hydrogen Inorganic materials 0.000 description 7
- 239000001257 hydrogen Substances 0.000 description 7
- NHNBFGGVMKEFGY-UHFFFAOYSA-N nitrate group Chemical group [N+](=O)([O-])[O-] NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 7
- QAOWNCQODCNURD-UHFFFAOYSA-L sulfate group Chemical group S(=O)(=O)([O-])[O-] QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 238000007922 dissolution test Methods 0.000 description 5
- 239000012153 distilled water Substances 0.000 description 5
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 229910001431 copper ion Inorganic materials 0.000 description 4
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 4
- 239000012456 homogeneous solution Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 description 3
- 229910000365 copper sulfate Inorganic materials 0.000 description 3
- 229940078494 nickel acetate Drugs 0.000 description 3
- MWUXSHHQAYIFBG-UHFFFAOYSA-N nitrogen oxide Inorganic materials O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 description 2
- 239000005695 Ammonium acetate Substances 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 2
- 235000019257 ammonium acetate Nutrition 0.000 description 2
- 229940043376 ammonium acetate Drugs 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910001453 nickel ion Inorganic materials 0.000 description 2
- KBJMLQFLOWQJNF-UHFFFAOYSA-N nickel(ii) nitrate Chemical compound [Ni+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O KBJMLQFLOWQJNF-UHFFFAOYSA-N 0.000 description 2
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 2
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- BNGXYYYYKUGPPF-UHFFFAOYSA-M (3-methylphenyl)methyl-triphenylphosphanium;chloride Chemical compound [Cl-].CC1=CC=CC(C[P+](C=2C=CC=CC=2)(C=2C=CC=CC=2)C=2C=CC=CC=2)=C1 BNGXYYYYKUGPPF-UHFFFAOYSA-M 0.000 description 1
- PAWQVTBBRAZDMG-UHFFFAOYSA-N 2-(3-bromo-2-fluorophenyl)acetic acid Chemical compound OC(=O)CC1=CC=CC(Br)=C1F PAWQVTBBRAZDMG-UHFFFAOYSA-N 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 125000000218 acetic acid group Chemical group C(C)(=O)* 0.000 description 1
- HDYRYUINDGQKMC-UHFFFAOYSA-M acetyloxyaluminum;dihydrate Chemical compound O.O.CC(=O)O[Al] HDYRYUINDGQKMC-UHFFFAOYSA-M 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- DIZPMCHEQGEION-UHFFFAOYSA-H aluminium sulfate (anhydrous) Chemical compound [Al+3].[Al+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O DIZPMCHEQGEION-UHFFFAOYSA-H 0.000 description 1
- 229940009827 aluminum acetate Drugs 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910001510 metal chloride Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 235000011056 potassium acetate Nutrition 0.000 description 1
- 229960004109 potassium acetate Drugs 0.000 description 1
- 239000004323 potassium nitrate Substances 0.000 description 1
- 235000010333 potassium nitrate Nutrition 0.000 description 1
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 description 1
- 229910052939 potassium sulfate Inorganic materials 0.000 description 1
- 235000011151 potassium sulphates Nutrition 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 231100000167 toxic agent Toxicity 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/28—Acidic compositions for etching iron group metals
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacture And Refinement Of Metals (AREA)
- ing And Chemical Polishing (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はニツケル又はニツケル合金溶解用溶液
（以下溶解溶液とする）特に二種以上の金属から
特定の金属を選択的に溶解する寿命の長い溶解用
液に関する。Detailed Description of the Invention (Industrial Field of Application) The present invention provides a solution for dissolving nickel or nickel alloy (hereinafter referred to as dissolving solution), which has a long life and is particularly capable of selectively dissolving a specific metal from two or more metals. Regarding dissolution liquid.
（従来の技術）
従来ニツケルめつきの溶解用液としては濃硝酸
が一般に用いられていた。しかしながら他の金属
の表面の一部にニツケルめつきが施されている場
合、下地金属を溶解することなくニツケルめつき
を溶解することは困難であつた。例えば下地金属
が銅でる場合、銅を溶解することなくニツケルめ
つきを溶解することは困難であるため、銅の溶解
防止策として窒素、硫黄等を含む有機化合物を添
加した溶解用液が一般に用いられていた。しかし
上記の溶解用液では、例えばアニリンのような毒
性を有する化合物を添加する欠点や添加剤がキレ
ートイオンを形成するため廃水処理が複雑になる
欠点等が生じ、さらにニツケルめつきを施した
後、下地金属との密着性を高めるため熱処理を行
うがリンを含有するニツケルめつきの場合、溶解
が困難となる欠点がある。(Prior Art) Concentrated nitric acid has conventionally been generally used as a dissolving solution for nickel plating. However, when nickel plating is applied to a part of the surface of another metal, it is difficult to dissolve the nickel plating without dissolving the underlying metal. For example, when the underlying metal is copper, it is difficult to dissolve the nickel plating without dissolving the copper, so a dissolving solution containing organic compounds containing nitrogen, sulfur, etc. is generally used to prevent the copper from dissolving. It was getting worse. However, the above-mentioned dissolving solution has disadvantages such as adding toxic compounds such as aniline, and complicating wastewater treatment because the additives form chelate ions. Although heat treatment is performed to improve adhesion to the underlying metal, phosphorous-containing nickel plating has the drawback of being difficult to melt.
例えば、下地金属が銅（電気銅、無酸素銅等）
でその一部に熱処理した含リンニツケルめつき
（厚さ2μm）が施されているものを、一般に用い
られている金属塩化物を含有する硝酸の溶解用液
で溶解した場合、時間がかかると共に下地の銅の
露出している部分が30〜60μm、著しい場合には
100μm以上も溶解され、その表面は荒れた状態と
なる。また従来の寿命の短い溶解用液を用いる溶
解方法では金属の溶解速度を均一にするために多
量の溶解用液を用い、これを被溶解材の入つた溶
解槽内に循環させ、この溶解用液の流れを利用す
るのが一般的であつた。このため、大きな溶解用
液のタンク、ポンプ等の循環装置など多くの設備
と多量の溶解用液が必要となつている。 For example, the base metal is copper (electrolytic copper, oxygen-free copper, etc.)
When dissolving a part of which has been heat-treated with phosphorous-containing nickel plating (2 μm thick) using a commonly used nitric acid solution containing metal chlorides, it takes time and damages the base material. The exposed copper area is 30 to 60 μm, in severe cases
More than 100 μm is dissolved, leaving the surface rough. In addition, in the conventional melting method that uses a dissolving liquid with a short life, a large amount of dissolving liquid is used in order to equalize the dissolution rate of the metal, and this is circulated in the melting tank containing the material to be melted. It was common to use the flow of liquid. For this reason, many facilities such as a large tank for dissolving liquid, a circulation device such as a pump, and a large amount of dissolving liquid are required.
（発明が解決しようとする問題点）
本発明は上記の欠点を解決し、ニツケル又はニ
ツケル合金を選択的に、しかも短時間で溶解し、
銅又は銅合金の溶解を全く無いか又は極くわずか
に抑え、しかも寿命の長い溶解用液を提供するこ
とを目的とする。(Problems to be Solved by the Invention) The present invention solves the above-mentioned drawbacks, melts nickel or nickel alloy selectively and in a short time, and
It is an object of the present invention to provide a dissolving liquid that has no or very slight dissolution of copper or copper alloy and has a long life.
（問題を解決するための手段）
本発明は硫酸根21.5〜66.7重量％、硝酸根3.6〜
38.1重量％、酢酸根3.6〜38.1重量％及び水3.6〜
57.1重量％の混合液からなり、該混合液中に硝酸
が20.0重量％以下、かつ硫酸と硝酸との総量を
22.5〜68.2重量％として含有してなる溶解用液に
関する。(Means for solving the problem) The present invention has 21.5 to 66.7% by weight of sulfate radicals and 3.6 to 66.7% by weight of nitrate radicals.
38.1% by weight, acetic acid root 3.6~38.1% by weight and water 3.6~
It consists of a mixed liquid of 57.1% by weight, in which nitric acid is 20.0% by weight or less, and the total amount of sulfuric acid and nitric acid is
It relates to a dissolving liquid containing 22.5 to 68.2% by weight.
本発明における溶解用液中の硫酸根の含有量
は、21.5〜66.7重量％、硝酸根の含有量は3.6〜
38.1重量％であり、該溶解用液中にに硝酸が20.0
重量％以下で、かつ硫酸と硝酸との総量が22.5〜
68.2重量％含有することが必要であり、硫酸根及
び硝酸根の含有量が前述の範囲未満、かつ、硫酸
と硝酸との総量が22.5重量％未満であると金属の
溶解速度が遅く、特に選択的に溶解したいニツケ
ル又はニツケル合金を銅又は銅合金を溶解するこ
となく、もしくは溶解を極くわずかに抑えて溶解
しようとしても、選択的に溶解したいニツケル又
はニツケル合金の溶解速度が遅く、溶解時間が長
くなるために銅又は銅合金の溶解を抑制すること
ができない。 In the present invention, the content of sulfate radicals in the solution for dissolution is 21.5 to 66.7% by weight, and the content of nitrate radicals is 3.6 to 66.7% by weight.
38.1% by weight, and nitric acid is 20.0% by weight in the dissolving solution.
% by weight or less, and the total amount of sulfuric acid and nitric acid is 22.5~
If the content of sulfate groups and nitrate groups is less than the above range and the total amount of sulfuric acid and nitric acid is less than 22.5% by weight, the dissolution rate of the metal will be slow, making it particularly difficult to select. Even if you try to melt the nickel or nickel alloy that you want to melt selectively without dissolving the copper or copper alloy, or with very little dissolution, the dissolution rate of the nickel or nickel alloy that you want to selectively melt is slow, and the melting time is too low. is long, making it impossible to suppress the dissolution of copper or copper alloy.
硫酸根の含有量が66.7重量％を越え、かつ硫酸
と硝酸との総量が68.2重量％を越えるとニツケル
又はニツケル合金の溶解速度が遅くなり、溶解時
間が長くなるために銅又は銅合金の溶解を抑制す
ることができない。また硝酸根の含有量が38.1重
量％を越えると窒素酸化物が多量に発生し作業環
境が悪くなる。さらに硫酸と硝酸との総量が22.5
〜68.2重量％の範囲内であつても、硝酸の含有量
が０重量％を越えると銅又は銅合金の溶解を抑制
することができなくなる。 If the content of sulfuric acid radicals exceeds 66.7% by weight and the total amount of sulfuric acid and nitric acid exceeds 68.2% by weight, the dissolution rate of nickel or nickel alloy will slow down and the dissolution time will become longer, resulting in poor dissolution of copper or copper alloy. cannot be suppressed. Furthermore, if the content of nitrate radicals exceeds 38.1% by weight, a large amount of nitrogen oxides will be generated, resulting in a poor working environment. Furthermore, the total amount of sulfuric acid and nitric acid is 22.5
Even within the range of 68.2% by weight, if the nitric acid content exceeds 0% by weight, dissolution of copper or copper alloy cannot be suppressed.
本発明における酢酸根の含有量は3.6〜38.1重
量％とされ、3.6％未満では酢酸による銅又は銅
合金の溶解抑制効果が小さく、また38.1重量％を
越えると銅又は銅合金の溶解は抑制できるが相対
的に硫酸及び硝酸の含有率が小さくなるため選択
的に溶解したいニツケル又はニツケル合金の溶解
力が低下し不経済となる。 The content of acetic acid radical in the present invention is 3.6 to 38.1% by weight, and if it is less than 3.6%, the effect of suppressing the dissolution of copper or copper alloy by acetic acid is small, and if it exceeds 38.1% by weight, the dissolution of copper or copper alloy can be suppressed. However, since the content of sulfuric acid and nitric acid becomes relatively small, the dissolving power of nickel or nickel alloy to be selectively dissolved decreases, making it uneconomical.
本発明における水の含有量は3.6〜57.1重量％
とされ、水が3.6重量％未満では硫酸根、硝酸根、
酢酸根などがそれらの塩により配合される場合、
これらを均一に混合することが困難となり、均一
な金属溶解性を発現させることは難しい。また
57.1重量％を越えると相対的に硫酸根、硝酸根及
び酢酸根の含有量が低下するのでニツケル又はニ
ツケル合金の溶解速度が遅く溶解時間が長くなる
ために銅又は銅合金の溶解を抑制することができ
ない。 The water content in the present invention is 3.6-57.1% by weight
If the water content is less than 3.6% by weight, sulfate, nitrate,
When acetic acid roots etc. are combined with their salts,
It becomes difficult to mix them uniformly, and it is difficult to express uniform metal solubility. Also
If it exceeds 57.1% by weight, the content of sulfate, nitrate, and acetate groups will be relatively reduced, which will slow down the dissolution rate of nickel or nickel alloy and prolong the dissolution time, thus suppressing the dissolution of copper or copper alloy. I can't.
本発明になる溶解用液はその配合によつてはス
ラリーになるが、スラリーであつてても溶解能力
には何ら欠陥を生じないので問題はない。 The dissolving liquid of the present invention may become a slurry depending on its formulation, but even if it is a slurry, there is no problem since it does not cause any defects in dissolving ability.
本発明において硫酸根は、硫酸、その塩である
硫酸銅、硫酸ニツケル、硫酸アルミニウム、硫酸
アンモニウム、硫酸カリウム等から得られ、硝酸
根は、硝酸、その塩である硝酸銅、硝酸ニツケ
ル、硝酸アルミニウム、硝酸アンモニウム、硝酸
カリウム等から得られるが、これらは溶解する金
属の種類に応じ併用される。 In the present invention, the sulfate group is obtained from sulfuric acid, its salts copper sulfate, nickel sulfate, aluminum sulfate, ammonium sulfate, potassium sulfate, etc., and the nitrate group is obtained from nitric acid, its salts copper nitrate, nickel nitrate, aluminum nitrate, etc. It can be obtained from ammonium nitrate, potassium nitrate, etc., and these are used in combination depending on the type of metal to be dissolved.
また酢酸根は、酢酸、その塩である酢酸銅、酢
酸ニツケル、酢酸アルミニウム、酢酸アンモニウ
ム、酢酸カリウム等から得られ、これらは必要に
応じて併用してもよいい。 Further, acetic acid radicals can be obtained from acetic acid and its salts such as copper acetate, nickel acetate, aluminum acetate, ammonium acetate, and potassium acetate, and these may be used in combination as necessary.
本発明おける水とは一般に用いられる蒸留水、
イオン交換水等をさす。 In the present invention, water refers to commonly used distilled water,
Refers to ion-exchanged water, etc.
（実施例） 以下実施例により本発明を説明する。(Example) The present invention will be explained below with reference to Examples.
実施例 １
硫酸（和光純薬製試薬１級）310重量部、酢酸
（和光純薬製試薬１級）190重量部、硝酸（和光純
薬製試薬１級）10重量部及びイオン交換水500重
量部を秤量し、イオン交換水を撹拌しながら、ま
ず酢酸を、次いで硝酸を、さらに硫酸を徐徐に添
加して均一な溶液とした。この溶液1010重量部に
硝酸ニツケル（和光純薬製試薬１級）を400重量
部添加し50℃加熱して撹拌し、スラリー状溶解用
液(A)を得た。Example 1 310 parts by weight of sulfuric acid (1st class reagent manufactured by Wako Pure Chemical Industries), 190 parts by weight of acetic acid (1st class reagent manufactured by Wako Pure Chemical Industries), 10 parts by weight of nitric acid (1st class reagent manufactured by Wako Pure Chemical Industries), and 500 parts by weight of ion-exchanged water While stirring the ion-exchanged water, first acetic acid was added, then nitric acid, and then sulfuric acid were gradually added to obtain a homogeneous solution. 400 parts by weight of nickel nitrate (grade 1 reagent manufactured by Wako Pure Chemical Industries, Ltd.) was added to 1010 parts by weight of this solution, and the mixture was heated to 50°C and stirred to obtain a slurry-like dissolving liquid (A).
上記とは別に直径30mm、長さ100mmの電気銅の
円周表面リンを約90重量％含有するニツケルめつ
きを厚さ±0.2μ、長さ40±２mmに施した試料棒を
作成した。尚、ニツケルめつきは銅棒の表面を
3M社製のめつきカバー用スコツチテープ（商品
名）でマスキングし日本カニゼン製のブルーシユ
ーマ（商品名）を純水で５倍に希釈し90℃５分間
浸漬して施した。 Separately from the above, a sample rod with a diameter of 30 mm and a length of 100 mm was prepared by plating the circumferential surface of electrolytic copper with nickel plating containing approximately 90% by weight of phosphorus to a thickness of ±0.2 μm and a length of 40 ± 2 mm. In addition, nickel plating is applied to the surface of the copper rod.
Masking was done with Scotch Tape (trade name) for plating covers manufactured by 3M Company, and Blue Xiuma (trade name) manufactured by Nippon Kanigen Co., Ltd. was diluted 5 times with pure water and immersed at 90°C for 5 minutes.
次上記溶解用液(A)の液温を50℃に保つて、これ
に前述の試料棒を浸漬したところ、ニツケルめつ
きは４分間で溶解し、下地である金属銅の溶解量
はわずか2.5μmであり、その表面はきれいであつ
た。次に1dm2（10cm×10cm）で厚さ0.6mmの銅板
にその上下両面の中央部40mm×40mmを残して2μm
のニツケルめつきを施したものを用意し、これを
本実施例になる溶解用液(A)100ｇを50℃に保ち撹
拌しているところへ浸漬し、ニツケルめつきが完
全に落ちたら溶解終了とみなすこととして連続し
て32枚を処理することができた。 Next, when the temperature of the above-mentioned dissolving liquid (A) was maintained at 50°C and the sample rod was immersed in it, the nickel plating was dissolved in 4 minutes, and the amount of the underlying metallic copper dissolved was only 2.5 ℃. μm, and its surface was clean. Next, on a 1dm 2 (10cm x 10cm) 0.6mm thick copper plate, leave a 40mm x 40mm central area on both the top and bottom sides, leaving 2μm.
Prepare a piece with nickel plating, and immerse it in 100g of the dissolving solution (A) used in this example, which is kept at 50℃ and stirred.When the nickel plating is completely removed, the dissolution is complete. It was possible to process 32 sheets in a row.
実施例１おける溶解用液中硫酸根は21.5重量
％、硝酸根は12.8重量％、酢酸根は13.2重量％、
水は46.0重量％及びこのにニツケルイオン5.7重
％、水素イオン0.7重量％含有し、また硝酸の含
有量は0.7重量％及び硫酸と硝酸との総量の含有
量は22.7重量％であつた。 In the dissolution solution in Example 1, the sulfate group was 21.5% by weight, the nitrate group was 12.8% by weight, and the acetate group was 13.2% by weight.
The water contained 46.0% by weight, 5.7% by weight of nickel ions and 0.7% by weight of hydrogen ions, the content of nitric acid was 0.7% by weight, and the total content of sulfuric acid and nitric acid was 22.7% by weight.
実施例 ２
硫酸（和光純薬製試薬１級）400重量部、酢酸
（和光純薬製試薬１級）100重量部及びイオン交換
水350重量部を秤量し、イオン交換水を撹拌しな
がら、まず酢酸を、次いで硫酸を徐徐に添加して
均一な溶液とした。この溶液850重量部に硝酸
（和光純薬製試薬１級）を150重量部添加し、実施
例１と同様50℃に加熱、撹拌しスラリー状の溶解
用液(B)を得た。Example 2 Weigh out 400 parts by weight of sulfuric acid (1st class reagent manufactured by Wako Pure Chemical Industries, Ltd.), 100 parts by weight of acetic acid (1st class reagent manufactured by Wako Pure Chemical Industries, Ltd.), and 350 parts by weight of ion-exchanged water, and while stirring the ion-exchanged water, first. Acetic acid and then sulfuric acid were added slowly to form a homogeneous solution. To 850 parts by weight of this solution, 150 parts by weight of nitric acid (grade 1 reagent manufactured by Wako Pure Chemical Industries, Ltd.) was added, and as in Example 1, the mixture was heated to 50°C and stirred to obtain a slurry-like dissolving solution (B).
次に上記溶解用液(B)の液温を50℃に保つて、こ
れに実施例１で得た試料棒を浸漬したところニツ
ケルめつきは２分間で溶解し、下地である金属銅
の溶解量は2μmであり、その表面はきれいであつ
た。 Next, when the temperature of the above-mentioned dissolving solution (B) was maintained at 50°C and the sample rod obtained in Example 1 was immersed in it, the nickel plating was dissolved in 2 minutes, and the underlying metal copper was dissolved. The amount was 2 μm, and the surface was clean.
尚、本実施例になる溶解用液(B)100ｇを用いて
実施例１と同様のニツケルめつきを施した銅板を
実施例１と同一の条件で連続溶解試験を行つたと
ころ23枚処理できた。 In addition, when a continuous dissolution test was conducted on nickel-plated copper plates similar to those in Example 1 using 100 g of the dissolving solution (B) used in this example under the same conditions as in Example 1, 23 plates could be processed. Ta.
実施例２における溶解用液中の硫酸根は39.2重
量％、硝酸根は14.8重量％、酢酸根は9.8重量％、
水は35.0重量％及びこの他に水素イオン1.2重量
％含有し、また硝酸の含有量は15.0重量％及び硫
酸と硝酸との総量の含有量は55.0重量％であつ
た。 The dissolving solution in Example 2 contained 39.2% by weight of sulfate groups, 14.8% by weight of nitrate groups, 9.8% by weight of acetic acid groups,
The water contained 35.0% by weight and 1.2% by weight of hydrogen ions, the nitric acid content was 15.0% by weight, and the total content of sulfuric acid and nitric acid was 55.0% by weight.
実施例 ３
硫酸（和光純薬製試薬１級）320重量部、硫酸
銅（和光純薬製試薬１級）200重量部、酢酸（和
光純薬製試薬１級）200重量部及びイオン交換水
370重量部を秤量し、イオン交換水を撹拌しなが
ら、まず硫酸銅を次で酢酸を、さらに硫酸を徐徐
に添加して均一な溶液とした。この溶液1090重量
部に硝酸（和光純薬製試薬１級）を100重量部添
加し実施例１と同様50℃に加熱し撹拌してスラリ
ー状の溶解用液(C)を得た。Example 3 320 parts by weight of sulfuric acid (1st class reagent manufactured by Wako Pure Chemical Industries), 200 parts by weight of copper sulfate (1st class reagent manufactured by Wako Pure Chemical Industries), 200 parts by weight of acetic acid (1st class reagent manufactured by Wako Pure Chemical Industries), and ion-exchanged water
370 parts by weight was weighed out, and while stirring the ion-exchanged water, first copper sulfate, then acetic acid, and then sulfuric acid were gradually added to form a uniform solution. To 1090 parts by weight of this solution, 100 parts by weight of nitric acid (grade 1 reagent manufactured by Wako Pure Chemical Industries, Ltd.) was added, and as in Example 1, the mixture was heated to 50°C and stirred to obtain a slurry-like dissolving solution (C).
次に上記溶解用液(C)の液温を50℃に保つてこれ
に実施例１で得た試料棒を浸漬したところニツケ
ルめつきは2.5分間で溶解し、下地である金属銅
の溶解量は1.5μmであり、その表面はきれいであ
つた。 Next, when the sample rod obtained in Example 1 was immersed in the above-mentioned dissolving solution (C) while keeping the temperature at 50°C, the nickel plating was dissolved in 2.5 minutes, and the amount of dissolution of the underlying metallic copper was immersed. was 1.5 μm, and the surface was clean.
尚、本実施例になる溶解用液(C)100ｇを用いて
実施例１と同様のニツケルめつきを施した銅板を
実施例１と同一の条件で連続溶解試験を行つたと
ころ36枚処理することができた。 A continuous dissolution test was conducted on nickel-plated copper plates similar to those in Example 1 using 100 g of the dissolving solution (C) used in this example under the same conditions as in Example 1, and 36 plates were processed. I was able to do that.
実施例３における溶解用液中の硫酸根は32.8重
量％、硝酸根は8.3重量％、酢酸根は16.5重量％、
水は37.1重量％及びこの他に銅イオン4.3重量％、
水素イオン1.0重量％含有し、また硝酸の含有量
は8.4重量％及び硫酸と硝酸との総量の含有量は
35.3重量％であつた。 The dissolving solution in Example 3 contained 32.8% by weight of sulfate radicals, 8.3% by weight of nitrate radicals, 16.5% by weight of acetic acid radicals,
Water is 37.1% by weight and copper ions are 4.3% by weight.
Contains 1.0% by weight of hydrogen ions, 8.4% by weight of nitric acid, and the total content of sulfuric acid and nitric acid.
It was 35.3% by weight.
実施例 ４
硫酸（和光純薬製試薬１級）500重量部、硝酸
（和光純薬製試薬１級）100重量部及び蒸留水50重
量部を秤量し、蒸留水を撹拌しながら、まずず硫
酸を次いで硝酸を徐徐に添加して均一な溶液とし
た。この溶液650重量部に酢酸アンモニウム（和
光純薬製試薬１級）を350重量部添加し、実施例
１と同様50℃に加熱し撹拌して溶解用液(D)を得
た。次に上記溶解用液(D)の液温を50℃に保つて実
施例１で得た試験棒を浸漬したところニツケルめ
つきは３分間で溶解し、下地である金属銅の溶解
量はわずか1.5μmであり、その表面はきれいであ
つた。Example 4 Weigh out 500 parts by weight of sulfuric acid (grade 1 reagent manufactured by Wako Pure Chemical Industries, Ltd.), 100 parts by weight of nitric acid (grade 1 reagent manufactured by Wako Pure Chemical Industries, Ltd.), and 50 parts by weight of distilled water, and while stirring the distilled water, first add sulfuric acid. Next, nitric acid was gradually added to form a homogeneous solution. To 650 parts by weight of this solution, 350 parts by weight of ammonium acetate (grade 1 reagent manufactured by Wako Pure Chemical Industries, Ltd.) was added, and as in Example 1, the mixture was heated to 50°C and stirred to obtain a solution for dissolution (D). Next, when the test bar obtained in Example 1 was immersed in the above-mentioned dissolving liquid (D) while maintaining the liquid temperature at 50°C, the nickel plating was dissolved in 3 minutes, and the amount of the underlying metallic copper dissolved was small. The diameter was 1.5 μm, and the surface was clean.
尚、本実施例になる溶解用液(D)100ｇを用いて
実施例１と同様のニツケルめつきを施した銅板を
実施例１と同一の条件で連続溶解試験を行つたと
ころ26枚処理することができた。 A continuous dissolution test was conducted on nickel-plated copper plates similar to those in Example 1 using 100 g of the dissolving solution (D) used in this example under the same conditions as in Example 1, and 26 pieces were processed. I was able to do that.
実施例４における溶解用液中の硫酸根は49.0重
量％、硝酸根は9.8重量％、酢酸根は26.8重量％、
水は5.0重量％及びこの他に水素イオン1.2重量
％、アンモニウムイオン8.2重量％含有し、また
硝酸の含有量は10.0重量％及び硫酸と硝酸との総
量の含有量は60.0重量％であつた。 The dissolving solution in Example 4 contained 49.0% by weight of sulfate radicals, 9.8% by weight of nitrate radicals, 26.8% by weight of acetic acid radicals,
Water contained 5.0% by weight, and in addition, hydrogen ions and ammonium ions contained 1.2% by weight, nitric acid content was 10.0% by weight, and the total content of sulfuric acid and nitric acid was 60.0% by weight.
実施例 ５
硫酸（和光純薬製試薬１級）650重量部、酢酸
ニツケル（和光純薬製試薬１級）100重量部、硝
酸（和光純薬製試薬１級）10重量部、イオン交換
水150重量部及び硝酸銅（和光純薬製試薬１級）
100重量部を秤量し、イオンン交換水を撹拌しな
がら、まず酢酸ニツケル、次いで硫酸、硝酸さら
に硝酸銅を徐徐に添加して均一な水溶液とした。
次にこの水溶液を実施例１と同様50℃に加熱して
撹拌して溶解用液(E)を得た。Example 5 650 parts by weight of sulfuric acid (1st class reagent manufactured by Wako Pure Chemical Industries), 100 parts by weight of nickel acetate (1st class reagent manufactured by Wako Pure Chemical Industries), 10 parts by weight of nitric acid (1st class reagent manufactured by Wako Pure Chemical Industries), 150 parts by weight of ion-exchanged water Parts by weight and copper nitrate (Wako Pure Chemical Reagent Grade 1)
100 parts by weight was weighed out, and while stirring the ion-exchanged water, first nickel acetate, then sulfuric acid, nitric acid, and finally copper nitrate were gradually added to form a uniform aqueous solution.
Next, this aqueous solution was heated to 50° C. and stirred in the same manner as in Example 1 to obtain a dissolving solution (E).
次に上記溶解用液(E)の液温を50℃に保つて実施
例１で得た試験棒を浸漬したところニツケルめつ
きは1.5分間で溶解し、下地である金属銅の溶解
量は0.5μmであつた。そしてその表面はきれいで
あつた。 Next, when the test bar obtained in Example 1 was immersed in the above-mentioned dissolving liquid (E) while maintaining the liquid temperature at 50°C, the nickel plating was dissolved in 1.5 minutes, and the amount of dissolution of the underlying metal copper was 0.5 It was μm. And its surface was clean.
尚、本実施例になる溶解用液(E)100ｇで実施例
１と同様のニツケルめつきを施した銅板を実施例
１と同一の条件で連続して32枚処理できた。 It should be noted that 32 nickel-plated copper plates similar to those in Example 1 could be continuously processed under the same conditions as in Example 1 using 100 g of the dissolving solution (E) of this example.
実施例５における溶解用液中の硫酸根は63.0重
量％、硝酸根は6.1重量％、酢酸根は6.6重量％、
水は17.0重量％及びこの他に水素イオン1.4重量
％、ニツケルイオン3.3重量％、銅イオン2.6重量
％含有し、また硝酸の含有量は1.0重量及び硫酸
と硝酸との総量の含有量は65.4重量％であつた。 The sulfate group in the dissolution solution in Example 5 was 63.0% by weight, the nitrate group was 6.1% by weight, and the acetate group was 6.6% by weight.
Water contains 17.0% by weight, and in addition, it contains 1.4% by weight of hydrogen ions, 3.3% by weight of nickel ions, and 2.6% by weight of copper ions.The content of nitric acid is 1.0% by weight, and the total content of sulfuric acid and nitric acid is 65.4% by weight. It was %.
比較例 １
硫酸（和光純薬製試薬１級）150重量部、酢酸
（和光純薬製試薬１級）100重量部、硝酸（和光純
薬製試薬１級）70重量部及びイオン交換水680重
量部を秤量し、以下実施例１と同一の方法で混合
し均一な溶液を得た。この溶液1000重量部に硝酸
銅（和光純薬製試薬１級）40重量部添加し実施例
１と同様50℃に加熱して撹拌して溶解用液(F)を得
た。Comparative Example 1 150 parts by weight of sulfuric acid (1st class reagent manufactured by Wako Pure Chemical Industries), 100 parts by weight of acetic acid (1st class reagent manufactured by Wako Pure Chemical Industries), 70 parts by weight of nitric acid (1st class reagent manufactured by Wako Pure Chemical Industries), and 680 parts by weight of ion-exchanged water. and then mixed in the same manner as in Example 1 to obtain a homogeneous solution. To 1000 parts by weight of this solution, 40 parts by weight of copper nitrate (grade 1 reagent manufactured by Wako Pure Chemical Industries, Ltd.) was added, heated to 50°C and stirred in the same manner as in Example 1, to obtain a dissolving solution (F).
次に上記溶解用液(F)の液温を50℃に保つて実施
例１で得た試験棒を浸漬したところニツケルめつ
きは13.5分間で溶解し、下地であある金属銅の溶
解量は40μmであつた。そしてその表面は荒れた
ものであつた。 Next, when the test bar obtained in Example 1 was immersed in the above-mentioned dissolving liquid (F) while maintaining the liquid temperature at 50°C, the nickel plating was dissolved in 13.5 minutes, and the amount of the underlying metal copper dissolved was It was 40 μm. And its surface was rough.
尚、比較例１で得た溶解用液(F)を100ｇを用い
て実施例１と同様のニツケルめつきを施した銅板
を実施例１と同一の条件で連続溶解試験を行つた
ところろ処理枚数はわずか11枚であつた。 In addition, using 100 g of the dissolving liquid (F) obtained in Comparative Example 1, a copper plate plated with nickel as in Example 1 was subjected to a continuous dissolution test under the same conditions as in Example 1. There were only 11 pieces.
比較例１における溶解用液中の硫酸根は14.1重
量％、硝酸根は8.6重量％、酢酸根は9.5重量％、
水は66.2重量％及びこの他に水素イオン0.6重量
％、銅イオン1.0重量％含有し、また硝酸の含有
量は6.7重量％及び硫酸と硝酸との総量の含有量
は21.1重量％であつた。 In Comparative Example 1, the dissolution solution contained 14.1% by weight of sulfate radicals, 8.6% by weight of nitrate radicals, 9.5% by weight of acetic acid radicals,
Water contained 66.2% by weight, and in addition, 0.6% by weight of hydrogen ions and 1.0% by weight of copper ions, the content of nitric acid was 6.7% by weight, and the total content of sulfuric acid and nitric acid was 21.1% by weight.
比較例 ２
硫酸（和光純薬製試薬１級）750重量部、酢酸
（和光純薬製試薬１級）20重量部及び蒸留水230重
量部を秤量し、蒸留水を撹拌しながら、まず酢酸
を、次いで硫酸を徐徐に添加して均一な水溶液と
した。次にこの水溶液1000重量部に硝酸銅（和光
純薬製試薬１級）を20重量部添加し実施例１と同
様50℃に加熱し撹拌して溶解用液(G)を得た。Comparative Example 2 Weigh out 750 parts by weight of sulfuric acid (1st class reagent manufactured by Wako Pure Chemical Industries, Ltd.), 20 parts by weight of acetic acid (1st class reagent manufactured by Wako Pure Chemical Industries, Ltd.), and 230 parts by weight of distilled water, and while stirring the distilled water, first add acetic acid. Then, sulfuric acid was gradually added to form a homogeneous aqueous solution. Next, 20 parts by weight of copper nitrate (grade 1 reagent manufactured by Wako Pure Chemical Industries, Ltd.) was added to 1000 parts by weight of this aqueous solution, and as in Example 1, the mixture was heated to 50°C and stirred to obtain a dissolving solution (G).
次に上記溶解用液(G)の液温を50℃に保つてこれ
に実施例１で得た試験棒を浸漬したところニツケ
ルめつきは16分間で溶解し、下地である金属銅の
溶解量は45μmであつた。そしてその表面は荒れ
たものであつた。 Next, when the test rod obtained in Example 1 was immersed in the above-mentioned dissolving liquid (G) while maintaining the liquid temperature at 50°C, the nickel plating was dissolved in 16 minutes, and the amount of dissolution of the underlying metallic copper was immersed. was 45 μm. And its surface was rough.
尚、比較例２で得た溶解用液(G)100ｇを用いて
実施例１と同様のニツケルめつきを施した銅板を
実施例１と同一の条件で連続溶解試験を行つたと
ころ処理枚数はわずか８枚であつた。比較例22に
おける溶解用液中の硫酸根は72.0重量％、硝酸根
は1.0重量％、酢酸根は1.9重量％、水は23.0重量
％及びこの他に水素イオン1.6重量％、銅イオン
0.5重量％含有し、また硝酸は含有せず、硫酸の
含有量は73.5重量％であつた。 In addition, when a continuous dissolution test was conducted on nickel-plated copper plates similar to those in Example 1 using 100 g of the dissolving liquid (G) obtained in Comparative Example 2 under the same conditions as in Example 1, the number of sheets processed was There were only 8 pieces. The dissolving solution in Comparative Example 22 contained 72.0% by weight of sulfate radicals, 1.0% by weight of nitrate radicals, 1.9% by weight of acetic acid radicals, 23.0% by weight of water, and 1.6% by weight of hydrogen ions and copper ions.
It contained 0.5% by weight, no nitric acid, and the content of sulfuric acid was 73.5% by weight.
本発明の実施例では、金属銅の表面にニツケル
めつきを施したものみを説明したが、本発明は、
プラスチツク材料、セラミツク材料など非金属材
料の表面に物理的（めつき、溶射、嵌合など）手
段により形成した銅又は銅合金と同様に形成され
たニツケル又はニツケル合金とがそれぞれ別個の
箇所に独立して形成されている場合、前記プラス
チツク材料、セラミツク材料などの非金属材料の
表面に物理的手段によりり形成された銅又は銅合
金の表面に同様な方法でニツケル又はニツケル合
金が形成されている場合等において選択的ニツケ
ル又はニツケル合金のみを溶解する場合に有効で
ある。 In the embodiments of the present invention, only those in which nickel plating was applied to the surface of metallic copper were described, but the present invention
Copper or copper alloy formed by physical means (plating, thermal spraying, fitting, etc.) on the surface of non-metallic materials such as plastic materials and ceramic materials, and nickel or nickel alloy formed in the same way, are separated in separate locations. In the case where the nickel or nickel alloy is formed by a similar method on the surface of the copper or copper alloy formed by physical means on the surface of the non-metallic material such as the plastic material or ceramic material. This method is effective when selectively melting only nickel or nickel alloys.
（発明の効果）
本発明になる溶解用液を用いればニツケル又は
ニツケル合金と銅又は銅合金とがある場合、ニツ
ケル又はニツケル合金を選択的にしかも短時間で
溶解することができ、銅又は銅合金の溶解を全く
無くするか又は極くわずかに抑えることができ
る。また、溶解用液がスラリー状であるため、こ
の粒子を含んだ液を撹拌することにより、被溶解
材の表面を研磨する機能が発生し、被溶解材表面
に発生するノロ状のものを除去することができ、
溶解速度を均一にすることができる。さらに本発
明は、溶解用液の寿命を従来のものに比べ倍以上
に延ばすことができるため、従来のような大がか
りな液循環装置などは不要となり、撹拌装置だけ
で済し、使用する溶解用液の量も溶解槽に入れる
分だけでよい。(Effect of the invention) When the dissolving liquid of the present invention is used, when there are nickel or nickel alloy and copper or copper alloy, nickel or nickel alloy can be selectively dissolved in a short time, and copper or copper alloy can be melted selectively and in a short time. Dissolution of the alloy can be completely eliminated or minimized. In addition, since the dissolving liquid is in the form of a slurry, stirring the liquid containing these particles generates a function of polishing the surface of the material to be melted, removing any slag-like substances that occur on the surface of the material to be melted. can,
The dissolution rate can be made uniform. Furthermore, the present invention can extend the life of the dissolving solution by more than twice that of conventional solutions, eliminating the need for large-scale liquid circulation equipment as in the past, and requiring only a stirring device. The amount of liquid required is only the amount that can be put into the dissolution tank.
Claims (1)
量％、酢酸根3.6〜38.1重量％及び水3.6〜57.1重
量％の混合液からなり、該混合液中に硝酸が20.0
重量％以下、かつ硫酸と硝酸との総量を22.5〜
68.2重量％として含有してなるニツケル又はニツ
ケル合金溶解用溶液。1 Consists of a mixed solution of 21.5 to 66.7% by weight of sulfate radicals, 3.6 to 38.1% by weight of nitrate radicals, 3.6 to 38.1% by weight of acetic acid radicals, and 3.6 to 57.1% by weight of water, with 20.0% of nitric acid in the mixed solution.
% by weight or less, and the total amount of sulfuric acid and nitric acid is 22.5~
A solution for dissolving nickel or nickel alloy containing 68.2% by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14341985A JPS624883A (en) | 1985-06-28 | 1985-06-28 | Solution for dissolving metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14341985A JPS624883A (en) | 1985-06-28 | 1985-06-28 | Solution for dissolving metal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS624883A JPS624883A (en) | 1987-01-10 |
| JPH0427310B2 true JPH0427310B2 (en) | 1992-05-11 |
Family
ID=15338310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14341985A Granted JPS624883A (en) | 1985-06-28 | 1985-06-28 | Solution for dissolving metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS624883A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6256584A (en) * | 1985-09-04 | 1987-03-12 | Hitachi Chem Co Ltd | Solution for dissolving metal |
| JP5645188B2 (en) * | 2011-01-13 | 2014-12-24 | 独立行政法人産業技術総合研究所 | Electroless nickel alloy film patterning method |
-
1985
- 1985-06-28 JP JP14341985A patent/JPS624883A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS624883A (en) | 1987-01-10 |
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