JPH0427507B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a flat package type semiconductor package measuring jig having a package lifting mechanism.

As a conventional flat package type IC measuring jig, the one shown in the plan view and side view of FIGS. 1a and 1b is known. In the figure, 1 is a contact that has a shape with spring properties. 2 is a groove with contact 1 located at the bottom, which positions the lead part of a flat package type IC. 3 is a resin base on which the contact 1 is molded. 4 is flat package type
After positioning the lead part 8 of the IC package 7 in the groove 2 of the resin base 3, a resin holding lid presses the lead part 8 against the contact 1 with a convex part 5, and 6 is a claw-like hook part for fixing the lid. . A flat package type IC package 7 is shown in FIG. 1 by a dotted line.

Conventional flat package type IC mentioned above
The package measuring jig requires positioning the IC in the bar-shaped groove 2 of the resin base 3, and then fixing the holding lid 4 with the claws 6, which has very poor workability and is not suitable for testing a large number of IC packages. There was a drawback that it was not easy to use. Therefore, as an improvement on this point, a resin plate 21, the main part of which is shown in FIG.
A flat package type IC package 23 is positioned in the package alignment hole 22 provided in the resin plate 25 with a contactor 24 embedded from above.
A device has been developed that tests the electrical characteristics by lowering the contact and applying the contact 24 to the lead part 26 of the IC package 23. However, when connecting the electrical signal from the contact to an IC measurement tester (not shown), Another drawback is that the signal line becomes long, reducing measurement accuracy.

The present invention has been made in view of the above points, and includes a semiconductor package positioning hole 4 in a flat package type semiconductor package measuring jig.
0 and a spring pin guide hole 41 for the package floating insulating plate 38, the spring pin 33, and the lead terminal 3 of the semiconductor package 35.
6, the insulating plate 32 has a frame 34 which functions to adjust the distance between the parts and the positioning of the insulating plate for floating the package, and the insulating plate 32 is embedded through the spring pin, and the insulating plate for floating the package is moved within the frame. a plate spring 39 having one end fixed to the lead terminal support surface side of the package floating insulating plate that can be elastically supported and the other end freely supported by the frame; a substrate 31 to which the insulating plate 32 is fixed; Support 5 provided on the board
3, a support section 52 rotatably provided around the support column, a mechanism 51 provided on the support section that enables movement in a direction parallel to the axis, and a package provided on the mechanism. It has an insulator pressurizing part 50 configured to press the lead terminal of the semiconductor package supported by the floating insulating plate, and when no force is applied from the insulator pressurizing part to the lead terminal. A semiconductor characterized in that the lead terminal and the spring pin are not in contact with each other, but the lead terminal and the spring pin are in contact when a force to press the lead terminal is applied from the insulator pressurizing part. The present invention provides a package measuring jig.

That is, an object of the present invention is to be able to perform measurements without a carrier and without deteriorating the characteristics, and to easily perform positioning. The feature is that the package positioning plate can be moved by a spring. At the time of alignment, the package is floating above the measurement contact, making it possible to easily set the flat package type IC package without putting stress on the lead terminals. Next, when the lead terminal part of the package is pressed down from above by the insulator pressurizing part, it is pressed together with the positioning plate and comes into contact with the measurement contact, so it is easy to align the IC package and good characteristics can be obtained. It is.

The following has a package floating mechanism of the present invention.
The IC package measurement jig will be explained with reference to the drawings.

FIG. 4 shows a perspective view of a flat package type IC package measuring jig having a package lifting mechanism according to the present invention.

In the figure, 31 is a resin substrate, 34 is a resin frame, and 38 is an insulating plate for floating the package, which is made of a resin plate or the like. 39 is a leaf spring, 40 is a hole for IC package positioning that just fits the IC package, and 50 is a hole for positioning the IC package.
This is a resin insulator pressurizing part that presses the lead terminal part of the IC package. The insulator pressurizing part 50 is a rod 5
It can be raised or lowered by raising or lowering 1. The support portion 52 of the mechanism for moving the rod 51 up and down can be rotated in a horizontal plane about the support 53 as shown by arrow A. FIGS. 3a and 3b show a plan view and a sectional view of the main parts of a flat package type IC package measuring jig according to the present invention, respectively. 31 is a resin substrate, and 32 is an insulating plate made of a resin plate or the like in which spring pins 33 serving as contacts are embedded. 34 is a resin frame that adjusts the distance between the spring pin 33 and the lead terminal 36 of the IC package 35 and functions as a positioner for the insulating plate for floating the package; an insulating plate 32 made of a resin plate, etc.;
1 with screws 37. 38 is leaf spring 3
9 is an insulating plate for floating a package, which has a positioning hole 40 that is large enough to accommodate an IC package 35 supported by a resin frame 34. The leaf spring 39 is fixed only to the package floating insulating plate 38 by screws 42.

First, in the state shown in Figure 3b, place the IC package 35 through the positioning hole 40 of the insulating plate 38 for floating the package.
and position it. At this time, the insulator pressurizing section 50
rotates the support part 52 around the support column 53,
Move the IC package to a position where it can be easily installed. Next, after setting the IC package,
In the state shown in Fig. 4, lower the rod 51 and use the insulator pressurizing part 50 to press the lead terminal part 36 of the IC package.
Pressurize. By lowering the insulator pressurizing portion 50, the package lifting insulating plate 38 is pushed down to the insulating plate 32 as shown in FIG. 3c, and the leaf spring 39 is bent as shown in the figure. Furthermore, the third
In Figure c, the spring pin guide hole is omitted. The lead terminal portion 36 of the IC package 35 compresses the spring pin 33 guided by the spring pin guide hole 41 provided in the package floating insulating plate 38 and comes into contact with the tip of the pin. The other end of the spring pin 33 is connected to an IC tester, and the characteristics of the IC package 35 can be tested in the state shown in FIG. 3c. After measuring the characteristics, pull up the insulator pressurizing section 50 and remove the IC package.

As described above, the IC package can be positioned extremely easily using the IC package positioning hole 40 of the IC package measuring jig having the package lifting mechanism of the present invention, and the insulator pressurizing part 5
0 and lift the package cage floating insulating plate 38.
The spring pin guide hole 41 provided in the spring pin guide hole 41 allows the spring pin 33 to be accurately brought into contact with the lead terminal portion 36 of the IC package.

In this embodiment, one IC package is measured as an example, but a plurality of IC packages may be measured simultaneously. Further, although a plate spring is used as the elastic body, the present invention is not limited to this. Further, the structure is not limited to the embodiments, and any structure may be used as long as it can achieve the object of the present invention.

In the above embodiment, an example is given in which a resin substrate is used as the substrate 31 and a resin frame is used as the frame 34.
The insulating plate 32 for floating the package that supports the lead terminal part of the IC package whose electrical characteristics are to be measured, the insulating pressing part that presses the lead terminal, and the insulating plate 32 in which the spring pin serving as the contact is embedded are made of an insulator. It would be good if it were done.

[Brief explanation of drawings]

Figures 1 and 2 are diagrams explaining a conventional flat package type IC package measurement jig, and Figure 3 is a diagram illustrating a flat package type IC package measurement jig of the present invention.
FIG. 4 is a diagram showing a package measuring jig.
FIG. 2 is a perspective view of an IC package measurement jig. 31: Resin board, 32: Insulating plate, 33: Spring pin, 34: Resin frame, 35: IC package cage,
36: Lead terminal, 37: Screw, 38: Insulating plate for floating the package cage, 39: Leaf spring, 40: Hole for IC package positioning, 41: Hole for spring pin guide, 42: Screw, 50: Insulator pressurizing part, 5
1: rod, 52: support part, 53: pillar.

Claims (1)

[Claims] 1. In a flat package type semiconductor package measuring jig, a package lifting insulating plate 38 provided with a semiconductor package positioning hole 40 and a spring pin guide hole 41, a spring pin 33, An insulating plate 32 having a frame 34 that functions to adjust the interval between the lead terminals 36 of the semiconductor package 35 and positioning the insulating plate for lifting the package, into which the spring pin is embedded and embedded, and the insulating plate for lifting the package. A leaf spring 39 has one end fixed to the lead terminal support surface side of the package floating insulating plate and the other end freely supported by the frame, and the insulating plate 32 is fixed. a substrate 31, a support 53 provided on the substrate, and a support portion 52 rotatably provided around the support,
A mechanism 51 is provided on the support portion and is configured to allow movement in a direction parallel to the axis, and a mechanism 51 is provided on the mechanism and is configured to press lead terminals of a semiconductor package supported by the package floating insulating plate. The lead terminal and the spring pin are not in contact with each other when no force is applied from the insulator pressurizing part to the lead terminal. A semiconductor package measuring jig characterized in that the lead terminal and the spring pin are brought into contact with each other when a force to press the lead terminal is applied.