JPH04275452A - Resin-sealed semiconductor device - Google Patents

Resin-sealed semiconductor device

Info

Publication number
JPH04275452A
JPH04275452A JP3037252A JP3725291A JPH04275452A JP H04275452 A JPH04275452 A JP H04275452A JP 3037252 A JP3037252 A JP 3037252A JP 3725291 A JP3725291 A JP 3725291A JP H04275452 A JPH04275452 A JP H04275452A
Authority
JP
Japan
Prior art keywords
heat dissipation
dissipation block
semiconductor device
printed circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3037252A
Other languages
Japanese (ja)
Inventor
Tetsuo Muramatsu
哲雄 村松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP3037252A priority Critical patent/JPH04275452A/en
Publication of JPH04275452A publication Critical patent/JPH04275452A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve the thermal conductivity and the heat dissipation efficiency of a built-in heat dissipation block of the title device for a printed circuit board. CONSTITUTION:A title device with a built-in heat dissipation block is provided with a projection on the unsealed face of the heat dissipation block 1; further, a heat sink 2 having a recess shape which can be which can be fitted with the projection of the heat dissipation block is fixed on a printed circuit board 3. Mounting a semiconductor device onto the board 3 requires fitting the projection into the recess-shaped heat sink 2 fixed on the board and soldering only external terminals 4 to a metal wiring thin film 5, thereby enabling substrate mounting of high efficiency of heat dissipation.

Description

【発明の詳細な説明】[Detailed description of the invention]

【０００１】0001

【産業上の利用分野】本発明は、樹脂封止型半導体装置
とくに放熱ブロック内蔵型のものに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-sealed semiconductor device, particularly one with a built-in heat dissipation block.

【０００２】0002

【従来の技術】従来の放熱ブロック内蔵型の樹脂封止型
半導体装置のプリント基板への実装技術は、図３に示す
ように外部端子４と、放熱ブロック１の露出した部分を
、プリント基板上にある金属薄膜６に半田を使い接着を
行ってきた。2. Description of the Related Art A conventional technique for mounting a resin-sealed semiconductor device with a built-in heat dissipation block onto a printed circuit board is as shown in FIG. We used solder to bond the metal thin film 6 on the metal thin film 6.

【０００３】0003

【発明が解決しようとする課題】上述の従来例による半
田接着は、プリント基板上金属薄膜と放熱ブロック露出
部の間に半田をはさみ、熱を加えて半田を溶融させた後
、冷して凝固させ、固定接，着させる方法である。しか
しながら半田を溶融させる時に生じるガスが、放熱ブロ
ックとプリント基板上の金属薄膜の間より外に逃げる前
に半田が凝固し、半田内部でガスの空洞ができてしまう
問題があった。外部端子などの比較的接着面積が小さい
ものはガスの逃げる距離が短いため、ガスは逃げやすく
、半田内のガス空洞になりにくいが、放熱ブロックなど
の面積が大きいものは、逃げる距離が長いために問題に
なりやすい。[Problems to be Solved by the Invention] In the conventional solder bonding described above, solder is sandwiched between the metal thin film on the printed circuit board and the exposed part of the heat dissipation block, the solder is melted by applying heat, and then cooled to solidify. This is a method of attaching and fixing it. However, there is a problem in that the solder solidifies before the gas generated when melting the solder escapes from between the heat dissipation block and the thin metal film on the printed circuit board, creating a gas cavity inside the solder. Objects with a relatively small bonding area, such as external terminals, have a short distance for gas to escape, so gas easily escapes and is less likely to form a gas cavity in the solder, but objects with a large area, such as a heat dissipation block, have a long escaping distance. can easily become a problem.

【０００４】また、半田ガスによる空洞は、放熱ブロッ
ク内蔵樹脂封止半導体装置内の半導体回路装置から発生
する熱を効率よくプリント基板に放熱しないため、半導
体回路装置の動作が損なわれる問題もある。本発明の目
的は、放熱ブロックを内蔵する樹脂封止型半導体装置に
おいて、プリント基板との熱伝導性，放熱効果の大なる
ものを得ることにある。[0004] Furthermore, cavities caused by solder gas do not efficiently radiate heat generated from the semiconductor circuit device in the resin-sealed semiconductor device with built-in heat dissipation block to the printed circuit board, resulting in a problem that the operation of the semiconductor circuit device is impaired. An object of the present invention is to provide a resin-sealed semiconductor device with a built-in heat dissipation block that has high thermal conductivity with a printed circuit board and a high heat dissipation effect.

【０００５】[0005]

【課題を解決するための手段】上記目的を達成するため
、本発明の放熱ブロック内蔵型樹脂封止型半導体装置は
、放熱ブロックの一部封止されていない面に突起を設け
る。この場合、プリント基板上に、前記放熱ブロック突
起部と丁度嵌合できる凹部形状を有する放熱板を固定し
ておく必要がある。プリント基板上凹部に、放熱ブロッ
クの突起をはめ込めば良い。[Means for Solving the Problems] In order to achieve the above object, a resin-sealed semiconductor device with a built-in heat dissipation block of the present invention provides a projection on a partially unsealed surface of the heat dissipation block. In this case, it is necessary to fix on the printed circuit board a heat dissipation plate having a recess shape that can fit into the heat dissipation block protrusion. All you have to do is fit the protrusion of the heat dissipation block into the recess on the printed circuit board.

【０００６】[0006]

【作用】前記の構造によれば、プリント基板に取り付け
てある凹部に突起を差し込むのみで放熱効果を与えるの
で、従来の技術のような半田接着を行わないため、半田
内のガスによる空洞形成による放熱効果低下の問題がな
い。さらに、取り付けが差し込みのみであるので、従来
の半田接着のように熱を半導体回路装置にかけることが
ないために品質の信頼性向上にもつながる。また基板に
取り付けてある放熱ブロック凹部は、放熱ブロック内蔵
樹脂封止型半導体装置内の半導体回路装置による動作時
の発生熱を効率良く逃す役割を持っている。[Operation] According to the above structure, the heat dissipation effect is provided by simply inserting the protrusion into the recessed part attached to the printed circuit board, so unlike the conventional technology, solder bonding is not performed, so the formation of a cavity due to the gas in the solder There is no problem of deterioration of heat dissipation effect. Furthermore, since installation is only done by inserting, there is no need to apply heat to the semiconductor circuit device as in conventional solder bonding, which leads to improved quality and reliability. Further, the heat dissipation block concave portion attached to the substrate has the role of efficiently dissipating heat generated during operation of the semiconductor circuit device in the resin-sealed semiconductor device with built-in heat dissipation block.

【０００７】[0007]

【実施例】本発明の実施例を図に基づき説明する。[Embodiment] An embodiment of the present invention will be explained based on the drawings.

【０００８】図１は本発明の突部付き放熱ブロック１を
、プリント基板３に取り付けてある凹型放熱ブロック２
に差し込む前の図である。放熱ブロック突起部１は凹型
放熱ブロック２に差し込むために少し間隙を設けてある
。FIG. 1 shows a concave heat dissipation block 2 attached to a printed circuit board 3.
This is a diagram before inserting it into the . A slight gap is provided between the heat dissipation block protrusion 1 and the concave heat dissipation block 2 so that the protrusion 1 can be inserted into the concave heat dissipation block 2.

【０００９】図２は差し込み固定が行なわれた図である
。固定した後、外部端子４をプリント基板上金属配線薄
膜５に半田付けを行い完成である。FIG. 2 is a diagram showing the insertion and fixation. After fixing, the external terminals 4 are soldered to the metal wiring thin film 5 on the printed circuit board to complete the process.

【００１０】0010

【発明の効果】本発明によれば、基板に取り付ける凹部
ブロックに内部放熱ブロック内蔵樹脂封止型半導体装置
の放熱ブロック凸起部をはめ込み、外部端子のみの半田
付けで固定できるので、熱的影響を受けることが少なく
信頼性向上にもつながる。そして基板に取り付けてある
放熱凹部ブロックが放熱効果を良くしているので半導体
回路装置による動作時の発生熱を効率良く逃がすことが
でき、動作を安定にすることができる。According to the present invention, the convex portion of the heat dissipation block of a resin-sealed semiconductor device with an internal heat dissipation block is fitted into the concave block attached to the substrate, and can be fixed by soldering only the external terminals. This also leads to improved reliability. Since the heat dissipation recess block attached to the substrate improves the heat dissipation effect, the heat generated during operation of the semiconductor circuit device can be efficiently dissipated, and the operation can be stabilized.

【図面の簡単な説明】[Brief explanation of the drawing]

【図１】本発明の凸部付内部放熱ブロック内蔵樹脂封止
型半導体装置を、プリント基板に取り付けてある凹部放
熱ブロックに差し込む前の断面図FIG. 1 is a cross-sectional view of a resin-sealed semiconductor device with a built-in convex internal heat dissipation block of the present invention before it is inserted into a concave heat dissipation block attached to a printed circuit board.

【図２】図１の状態から差し込んだ後の完成した断面図
[Figure 2] Completed sectional view after inserting from the state shown in Figure 1

【図３】従来使用されている放熱方法を示す断面図[Figure 3] Cross-sectional view showing conventionally used heat dissipation methods

【符号の説明】[Explanation of symbols]

１　　凸部付内部放熱ブロック ２　　凹部放熱ブロック ３　　プリント基板 ４　　外部端子 ５　　金属配線薄膜 ６　　金属薄膜 1 Internal heat dissipation block with protrusion 2　Recessed heat dissipation block 3 Printed circuit board 4 External terminal 5 Metal wiring thin film 6 Metal thin film

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】内部放熱ブロックを有し、放熱ブロックの
一部が封止樹脂で被覆してあり、上記放熱ブロックの一
端面が封止樹脂に被覆されてない半導体装置において、
前記の封止樹脂に被覆されていない放熱ブロック一端面
に凸部を有せしめることを特長とする樹脂封止型半導体
装置。1. A semiconductor device having an internal heat dissipation block, a part of the heat dissipation block covered with a sealing resin, and one end surface of the heat dissipation block not covered with the sealing resin,
A resin-sealed semiconductor device characterized in that a convex portion is provided on one end surface of the heat dissipation block that is not covered with the sealing resin.
JP3037252A 1991-03-04 1991-03-04 Resin-sealed semiconductor device Pending JPH04275452A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3037252A JPH04275452A (en) 1991-03-04 1991-03-04 Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3037252A JPH04275452A (en) 1991-03-04 1991-03-04 Resin-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPH04275452A true JPH04275452A (en) 1992-10-01

Family

ID=12492454

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3037252A Pending JPH04275452A (en) 1991-03-04 1991-03-04 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPH04275452A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8338944B2 (en) 2009-03-26 2012-12-25 Mitsubishi Electric Corporation Semiconductor device, semiconductor module, radiating fin and fitting portions

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8338944B2 (en) 2009-03-26 2012-12-25 Mitsubishi Electric Corporation Semiconductor device, semiconductor module, radiating fin and fitting portions

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