JPH04280036A - Flat type display - Google Patents

Flat type display

Info

Publication number
JPH04280036A
JPH04280036A JP3043351A JP4335191A JPH04280036A JP H04280036 A JPH04280036 A JP H04280036A JP 3043351 A JP3043351 A JP 3043351A JP 4335191 A JP4335191 A JP 4335191A JP H04280036 A JPH04280036 A JP H04280036A
Authority
JP
Japan
Prior art keywords
flexible wiring
fpc
terminals
adhesive
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3043351A
Other languages
Japanese (ja)
Inventor
Toichi Takahashi
高橋 東一
Atsushi Sudo
淳 須藤
Tetsuya Ogawa
哲也 小川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP3043351A priority Critical patent/JPH04280036A/en
Publication of JPH04280036A publication Critical patent/JPH04280036A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Landscapes

  • Gas-Filled Discharge Tubes (AREA)

Abstract

PURPOSE:To prevent a flexible wiring plate and a substrate from being separated from each other by enhancing adhesive strength of the end portion of the flexible wiring plate in a flat type display where a drive signal is applied to electrodes on the substrate via the flexible wiring plate. CONSTITUTION:In a flat type display 1 where a substrate 11 with a plurality of electrode terminals 50, 51 arranged in one direction is secured to a flexible wiring plate 60 having a plurality of connecting terminals 70 paired with the electrode terminals 50, 51, respectively via an adhesive material 90, a projecting member 71 for enlarging a adhering area of the adhesive material 90 is provided outside of a terminal row consisted of the connecting terminals 70 on the inner surface of the flexible wiring plate 60.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は、可撓性配線板を介して
基板上の電極に駆動信号を印加するように構成されたフ
ラット形表示装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flat display device configured to apply drive signals to electrodes on a substrate via a flexible wiring board.

【0002】可撓性配線板(フレキシブルプリント配線
板)は、スペースメリットが大きく、また、多数の端子
に対する配線を一括に行うことができるので、薄い奥行
きを特徴とするフラット形表示装置の配線手段として広
く用いられている。
[0002] Flexible wiring boards (flexible printed wiring boards) have a large space advantage and can be used as a wiring means for flat-type display devices, which are characterized by a thin depth, because wiring for a large number of terminals can be done at once. It is widely used as

【0003】特に、電極端子の配列ピッチが小さい高精
細の表示装置において、表示用基板と可撓性配線板との
電気的な接続の手法としては、導電性微小片を混入した
熱硬化樹脂(異方性導電材)を接着材とした熱圧着手法
が主流となっている。
In particular, in high-definition display devices in which the arrangement pitch of electrode terminals is small, thermosetting resin (containing conductive particles) is used as a method for electrically connecting a display substrate and a flexible wiring board. The mainstream is a thermocompression bonding method using an anisotropic conductive material (anisotropic conductive material) as an adhesive.

【0004】0004

【従来の技術】発光させるドット(画素)の組み合わせ
によって文字や図形を表示するマトリクス表示方式のプ
ラズマディスプレイパネル(PDP)は、表示面側及び
背面側の一対のガラス基板を放電空間を設けて対向配置
し、格子状に配列した帯状の電極の各交差部又はその近
傍に画定された各放電セルを選択的に放電させるように
構成される。
[Prior Art] A matrix display type plasma display panel (PDP) that displays characters and figures by a combination of dots (pixels) that emit light has a pair of glass substrates on the display side and the back side facing each other with a discharge space provided. The discharge cells defined at or near the intersections of the band-shaped electrodes arranged in a grid are selectively discharged.

【0005】図3は一般的なPDP1の外観を示す分解
斜視図である。
FIG. 3 is an exploded perspective view showing the appearance of a general PDP 1. As shown in FIG.

【0006】PDP1は、表示面H側及び背面側の一対
のガラス基板11,12、及び各ガラス基板11、12
のそれぞれの両端部に固着されたフレキシブルプリント
配線板(FPC)60などから構成されている。ガラス
基板11,12の対向間隙の周囲が密封され、内部に放
電空間が形成されている。放電空間では、格子状に配列
された図示しない電極の各交差部にドットに対応する放
電セルが画定される。
The PDP 1 includes a pair of glass substrates 11 and 12 on the display surface H side and the back side, and each glass substrate 11 and 12.
It is composed of a flexible printed circuit board (FPC) 60 fixed to both ends of each. The periphery of the opposing gap between the glass substrates 11 and 12 is sealed, and a discharge space is formed inside. In the discharge space, discharge cells corresponding to dots are defined at each intersection of electrodes (not shown) arranged in a grid pattern.

【0007】ガラス基板11,12の内面には、その端
縁に沿って、電極端子50,51が設けられている。そ
して、FPC60の内面には、各電極端子50,51と
対になる接続端子(配線板側端子)70が設けられてお
り、このようなFPC60によってPDP1と外部の図
示しない駆動回路とが電気的に接続される。
Electrode terminals 50 and 51 are provided on the inner surfaces of the glass substrates 11 and 12 along their edges. A connection terminal (wiring board side terminal) 70 that pairs with each electrode terminal 50, 51 is provided on the inner surface of the FPC 60, and such an FPC 60 electrically connects the PDP 1 and an external drive circuit (not shown). connected to.

【0008】なお、電極端子50は表示領域から導出さ
れた表示用の電極に接続されているが、電極端子51(
ガラス基板側端子列の両端の端子)は、表示には関与し
ないいわゆるダミー端子であり、FPC60の収縮によ
る電極端子50の剥離を防止するために設けられ、ガラ
ス基板11,12との接合面積を大とするように、電極
端子50に比べて当該端子の列方向に幅広に形成されて
いる。
Note that the electrode terminal 50 is connected to a display electrode led out from the display area, but the electrode terminal 51 (
The terminals at both ends of the glass substrate side terminal row) are so-called dummy terminals that are not involved in display, and are provided to prevent the electrode terminals 50 from peeling off due to shrinkage of the FPC 60, and to reduce the bonding area with the glass substrates 11 and 12. It is formed wider in the column direction of the terminals than the electrode terminals 50 so as to be large.

【0009】また、FPC60は、例えばポリイミドな
どからなるベース板上に金属膜(膜厚は30μm程度)
のパターンニングによって接続端子70を形成したもの
であり、異方性導電材となる熱硬化樹脂を接着剤として
用いる熱圧着によって、ガラス基板11,12に固着さ
れている。
[0009]FPC60 also has a metal film (thickness is about 30 μm) on a base plate made of polyimide or the like.
The connection terminals 70 are formed by patterning, and are fixed to the glass substrates 11 and 12 by thermocompression bonding using a thermosetting resin as an anisotropic conductive material as an adhesive.

【0010】図4は従来のPDP1jの要部を示す平面
図であり、図5は図4のVーV矢視断面図である。
FIG. 4 is a plan view showing the main parts of a conventional PDP 1j, and FIG. 5 is a sectional view taken along the line V--V in FIG.

【0011】PDP1jでは、ガラス基板11に帯状の
接続端子70を有するFPC60jが熱圧着によって固
着されている。
In the PDP 1j, an FPC 60j having a strip-shaped connection terminal 70 is fixed to the glass substrate 11 by thermocompression bonding.

【0012】FPC60jの固着に際しては、まず、例
えばFPC60jの内面側に、接続端子70の配列方向
(以下これを便宜上「横方向」という)に沿って接続端
子70上を含めて連続するように、一定幅の帯状に上述
の熱硬化樹脂を塗布する。このとき、熱硬化樹脂の塗布
幅及び分量は、樹脂の粘性による拡がりの度合い及びコ
スト面などを考慮して最適化される。
[0012] When fixing the FPC 60j, first, for example, on the inner surface of the FPC 60j, in a continuous manner including the top of the connection terminals 70 along the arrangement direction of the connection terminals 70 (hereinafter referred to as the "lateral direction" for convenience), The above-mentioned thermosetting resin is applied in a band shape of a constant width. At this time, the coating width and amount of the thermosetting resin are optimized in consideration of the degree of spreading due to the viscosity of the resin, cost, etc.

【0013】次に、ガラス基板11に対して、電極端子
50,51と接続端子70とが対向するようにFPC6
0jを配置した後、FPC60j側から200℃程度に
加熱したボンディングツールを所定圧力で押し当てる。 これにより、熱硬化樹脂は接続端子70の延長方向(以
下これを便宜上「縦方向」という)に拡がって硬化し、
FPC60jとガラス基板11とを接着する接着材90
jとなる。
Next, the FPC 6 is placed so that the electrode terminals 50 and 51 and the connection terminal 70 face the glass substrate 11.
After 0j is placed, a bonding tool heated to about 200° C. is pressed against the FPC 60j with a predetermined pressure from the FPC 60j side. As a result, the thermosetting resin spreads in the extending direction of the connecting terminal 70 (hereinafter referred to as "vertical direction" for convenience) and hardens.
Adhesive material 90 for bonding the FPC 60j and the glass substrate 11
becomes j.

【0014】図では示されていないが、電極端子50,
51と接続端子70とは、薄い膜状の接着材90j(上
述したように導電性微小片が混入されている)を介して
対向し、導電性を有して接合する。これに対して、各接
続端子70の間、すなわち各電極端子50の間では、接
着材90j内で導電性微小片が分散した状態(密度の小
さい状態)になるので、各電極端子50間は絶縁される
Although not shown in the figure, the electrode terminals 50,
51 and the connecting terminal 70 are opposed to each other via a thin film-like adhesive 90j (containing conductive micropieces as described above), and are electrically conductive and bonded to each other. On the other hand, between each connection terminal 70, that is, between each electrode terminal 50, the conductive minute pieces are dispersed in the adhesive 90j (low density state). Insulated.

【0015】[0015]

【発明が解決しようとする課題】従来においては、FP
C60jの横方向の両端部において、接着材90jが縦
方向に拡がらず、FPC60jとガラス基板11との接
着面積が小さい。特に、FPC60jの隅部60Cが、
図5によく示されているように、ガラス基板11から浮
いた状態になり、このために、FPC60jがガラス基
板11から剥離し易いという問題があった。
[Problem to be solved by the invention] Conventionally, FP
At both ends of the C60j in the lateral direction, the adhesive 90j does not spread in the vertical direction, and the bonding area between the FPC 60j and the glass substrate 11 is small. In particular, the corner 60C of the FPC 60j is
As clearly shown in FIG. 5, the FPC 60j is in a floating state from the glass substrate 11, which causes the problem that the FPC 60j is easily peeled off from the glass substrate 11.

【0016】このような問題を解決するため、FPC6
0jの両端部については、接着材90jとなる熱硬化樹
脂を、電極端子50との対向領域(上述したように、圧
接時の拡がりを考慮して樹脂の塗布条件を選定すべき領
域)に比べて多目に塗布することが考えられる。しかし
、その場合には、塗布条件が一律の場合に比べて樹脂の
塗布量にバラツキが生じ易く、圧着毎に接着条件に差異
が生じるおそれがある。また、樹脂の塗布工程の生産性
の上でも不利となる。
[0016] In order to solve such problems, FPC6
Regarding both ends of 0j, the thermosetting resin that will become the adhesive 90j is compared to the area facing the electrode terminal 50 (as described above, the resin application conditions should be selected in consideration of the spread during pressure bonding). It is conceivable to apply it in large numbers. However, in that case, the amount of resin applied is more likely to vary than when the application conditions are uniform, and there is a risk that the adhesion conditions will differ for each pressure bond. It is also disadvantageous in terms of productivity in the resin coating process.

【0017】本発明は、上述の問題に鑑み、可撓性配線
板の端部の接着強度を高めることによって、可撓性配線
板と基板との剥離を防止することを目的としている。
SUMMARY OF THE INVENTION In view of the above-mentioned problems, the present invention aims to prevent peeling between a flexible wiring board and a substrate by increasing the adhesive strength at the ends of the flexible wiring board.

【0018】[0018]

【課題を解決するための手段】本発明に係るPDPは、
上述の課題を解決するため、図1に示すように、複数の
電極端子50,51が一方向に配列された基板11と、
前記各電極端子50,51のそれぞれと対になる複数の
接続端子70を有した可撓性配線板60とが、接着材9
0によって固着されたフラット形表示装置1において、
前記可撓性配線板60の内面上の前記接続端子70から
なる端子列の外側に、前記接着材90による接着面積を
拡大するための突起部材71が設けられてなる。
[Means for solving the problems] A PDP according to the present invention includes:
In order to solve the above-mentioned problem, as shown in FIG. 1, a substrate 11 on which a plurality of electrode terminals 50, 51 are arranged in one direction;
A flexible wiring board 60 having a plurality of connection terminals 70 paired with each of the electrode terminals 50 and 51 is bonded to an adhesive 9.
In the flat type display device 1 fixed by 0,
A protruding member 71 for enlarging the bonding area by the adhesive 90 is provided on the outside of the terminal row made up of the connection terminals 70 on the inner surface of the flexible wiring board 60.

【0019】[0019]

【作用】接着材90を介して基板11に可撓性配線板6
0が押し当てられると、基板11と可撓性配線板60と
の対向間隙において、突起部材71の体積分の接着材9
0が押し出されるように拡がり、基板11と可撓性配線
板60との接着面積が拡大する。
[Operation] Flexible wiring board 6 is attached to substrate 11 via adhesive 90.
0 is pressed, the adhesive 9 by the volume of the protruding member 71 is applied in the gap between the substrate 11 and the flexible wiring board 60.
0 expands as if being pushed out, and the bonding area between the substrate 11 and the flexible wiring board 60 increases.

【0020】[0020]

【実施例】図1は本発明に係るPDP1の要部を示す平
面図であり、図2は図1のIIーII矢視断面図である
。これらの図において、図4及び図5と同一の機能を有
する構成要素には同一の符号を付し、その説明を省略又
は簡略化する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a plan view showing the main parts of a PDP 1 according to the present invention, and FIG. 2 is a sectional view taken along the line II--II in FIG. In these figures, components having the same functions as those in FIGS. 4 and 5 are denoted by the same reference numerals, and their explanations will be omitted or simplified.

【0021】PDP1では、端縁に沿って電極端子50
,51が設けられたガラス基板11と、電極端子50,
51のそれぞれと対になる接続端子70を有したFPC
60とが異方性導電材である接着材90を用いた熱圧着
によって固着されている。
[0021] In the PDP 1, electrode terminals 50 are arranged along the edge.
, 51, and an electrode terminal 50,
FPC having connection terminals 70 paired with each of 51
60 are fixed by thermocompression bonding using adhesive 90 which is an anisotropic conductive material.

【0022】電極端子50,51は、例えば、表示用の
電極の形成と同時に、スパッタリング蒸着によって積層
したクロムー銅ークロムの三層薄膜(膜厚は0.5〜1
μm程度)をパターンニングすることによって形成され
る。
The electrode terminals 50 and 51 are, for example, a three-layer thin film of chromium-copper-chromium (thickness 0.5 to 1
It is formed by patterning (on the order of μm).

【0023】電極端子50の幅は例えば0.3mm程度
とされ、電極端子50間の間隔も0.3mm程度とされ
ている。これに対して、電極端子51は、ダミー端子で
あり、横方向の幅が例えば4mm程度とされ、FPC6
0に対して外側に突出するように配置されている。
The width of the electrode terminals 50 is, for example, about 0.3 mm, and the interval between the electrode terminals 50 is also about 0.3 mm. On the other hand, the electrode terminal 51 is a dummy terminal, and the width in the horizontal direction is, for example, about 4 mm, and the FPC 6
It is arranged so as to protrude outward with respect to 0.

【0024】一方、接続端子70は、その幅が電極端子
50に比べて若干小さく、従来と同様に、薄い膜状の接
着材90を介して電極端子50,51と接合されている
。そして、FPC60とガラス基板11との対向間隙は
、接着材90によって埋められている。
On the other hand, the connecting terminal 70 has a slightly smaller width than the electrode terminal 50, and is connected to the electrode terminals 50 and 51 via a thin film-like adhesive 90, as in the conventional case. The gap between the FPC 60 and the glass substrate 11 is filled with an adhesive 90.

【0025】さて、本実施例のPDP1においては、電
極端子51と対になる接続端子70、すなわち複数の接
続端子70からなる端子列の両端の接続端子70の外側
に、接続端子70と平行に2本の帯状の突起部材71が
設けられている。この突起部材71は、FPC60にお
ける各接続端子70の形成と同時に形成される。
Now, in the PDP 1 of this embodiment, the connection terminals 70 that are paired with the electrode terminals 51, that is, the connection terminals 70 at both ends of the terminal row made up of a plurality of connection terminals 70, are provided on the outside and parallel to the connection terminals 70. Two band-shaped protruding members 71 are provided. This protrusion member 71 is formed simultaneously with the formation of each connection terminal 70 in the FPC 60.

【0026】これにより、FPC60とガラス基板11
との熱圧着に際して、従来の技術の項で説明したように
、圧着に先立ってFPC60内面上に横方向に沿って所
定幅(例えば3mm程度)で厚さが例えば35μm程度
となるように塗布された熱硬化樹脂が、FPC60とガ
ラス基板11との圧接にともなって押し出されて縦方向
に拡がる。したがって、図1によく示されているように
、FPC60の端部におけるガラス基板11との接着面
積が大となり、FPC60とガラス基板11との剥離が
抑えられる。
[0026] As a result, the FPC 60 and the glass substrate 11
As explained in the prior art section, prior to the thermocompression bonding, a film is applied to the inner surface of the FPC 60 in a predetermined width (for example, about 3 mm) in the lateral direction and a thickness of about 35 μm, for example. The thermosetting resin is pushed out and spread in the vertical direction as the FPC 60 and the glass substrate 11 are pressed against each other. Therefore, as clearly shown in FIG. 1, the bonding area with the glass substrate 11 at the end of the FPC 60 becomes large, and separation between the FPC 60 and the glass substrate 11 is suppressed.

【0027】つまり、FPC60の熱圧着後に常温に戻
ると、FPC60の方がガラス基板11よりも熱膨張率
が大きいため、FPC60がガラス基板11よりもより
多く収縮してこれらの間に応力が生じる。この応力は、
ガラス基板11の剛性が高いため、FPC60とガラス
基板11との境界面において、せん断応力として作用し
、特にFPC60の両端部においては引張応力としても
作用する。
In other words, when the temperature returns to room temperature after thermocompression bonding of the FPC 60, since the FPC 60 has a larger coefficient of thermal expansion than the glass substrate 11, the FPC 60 contracts more than the glass substrate 11, creating stress between them. . This stress is
Since the glass substrate 11 has high rigidity, it acts as a shear stress at the interface between the FPC 60 and the glass substrate 11, and also acts as a tensile stress particularly at both ends of the FPC 60.

【0028】しかしながら、上述したようにPDP1で
は、接続端子70の外側に広範囲の接着面が形成されて
いるので、上述の応力に対抗する接合力が大きく、FP
C60とガラス基板11との固着状態が保たれる。
However, as described above, in the PDP 1, a wide adhesive surface is formed on the outside of the connection terminal 70, so the bonding force against the above-mentioned stress is large, and the FP
The fixed state between C60 and the glass substrate 11 is maintained.

【0029】上述の実施例によれば、FPC60に導体
パターンを形成する際に、突起部材71を配置するだけ
で、FPC60とガラス基板11との接合強度を従来よ
り高めることができる。
According to the above-described embodiment, the bonding strength between the FPC 60 and the glass substrate 11 can be increased compared to the prior art by simply arranging the projection member 71 when forming a conductor pattern on the FPC 60.

【0030】上述の実施例においては、突起部材71の
厚さ(高さ)が接続端子70の厚さと同一であるものと
して説明したが、突起部材71の厚さは接続端子70の
厚さより小さくてもよい。また、突起部材71とガラス
基板11とを対向させるように電極端子51を配置した
場合には、突起部材71の厚さは、接続端子70の厚さ
と電極端子50の厚さを加えた値より小さければ、接続
端子70の厚さより大きくてもよい。さらに、突起部材
71の平面形状は帯状に限定されず、任意の形状(例え
ば円形)の突起部材71を適当な位置に配置することが
できる。
In the above embodiment, the thickness (height) of the protrusion member 71 is the same as the thickness of the connection terminal 70, but the thickness of the protrusion member 71 is smaller than the thickness of the connection terminal 70. It's okay. Further, when the electrode terminal 51 is arranged so that the protruding member 71 and the glass substrate 11 face each other, the thickness of the protruding member 71 is greater than the sum of the thickness of the connecting terminal 70 and the thickness of the electrode terminal 50. It may be larger than the thickness of the connection terminal 70 as long as it is small. Furthermore, the planar shape of the protrusion member 71 is not limited to a band shape, and the protrusion member 71 of any shape (for example, circular) can be arranged at an appropriate position.

【0031】上述の実施例においては、ガラス基板11
側の端子列の両端に配置される電極端子51を電気回路
上の機能をもたないダミー端子としたが、電極端子51
を表示又は全表示セルを点灯状態にするエージング時に
表示電極列を短絡するための端子としてもよい。
In the above embodiment, the glass substrate 11
The electrode terminals 51 arranged at both ends of the terminal row on the side were made into dummy terminals having no function on the electric circuit.
It may also be used as a terminal for short-circuiting the display electrode array during aging to display or to turn on all display cells.

【0032】[0032]

【発明の効果】本発明によれば、可撓性配線板の端部の
接着強度を高めることができ、可撓性配線板と基板との
剥離を防止することができる。
According to the present invention, it is possible to increase the adhesion strength at the end portion of a flexible wiring board, and it is possible to prevent separation between the flexible wiring board and the substrate.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】本発明に係るPDPの要部を示す平面図である
FIG. 1 is a plan view showing the main parts of a PDP according to the present invention.

【図2】図1のIIーII矢視断面図である。FIG. 2 is a sectional view taken along the line II-II in FIG. 1;

【図3】一般的なPDPの外観を示す分解斜視図である
FIG. 3 is an exploded perspective view showing the appearance of a typical PDP.

【図4】従来のPDPの要部を示す平面図である。FIG. 4 is a plan view showing the main parts of a conventional PDP.

【図5】図4のVーV矢視断面図である。FIG. 5 is a sectional view taken along the line V-V in FIG. 4;

【符号の説明】[Explanation of symbols]

1  PDP(フラット形表示装置) 11  ガラス基板(基板) 50,51  電極端子 60  FPC(可撓性配線板) 70  接続端子 90  接着剤(接着材) 71  突起部材 1 PDP (flat display device) 11 Glass substrate (substrate) 50, 51 Electrode terminal 60 FPC (flexible wiring board) 70 Connection terminal 90 Adhesive (adhesive material) 71 Projection member

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】複数の電極端子(50)(51)が一方向
に配列された基板(11)と、前記各電極端子(50)
のそれぞれと対になる複数の接続端子(70)を有した
可撓性配線板(60)とが、接着材(90)によって固
着されたフラット形表示装置(1)において、前記可撓
性配線板(60)の内面上の前記接続端子(70)から
なる端子列の外側に、前記接着材(90)による接着面
積を拡大するための突起部材(71)が設けられてなる
ことを特徴とするフラット形表示装置。
1. A substrate (11) on which a plurality of electrode terminals (50) (51) are arranged in one direction, and each of the electrode terminals (50).
In the flat display device (1), a flexible wiring board (60) having a plurality of connection terminals (70) paired with each of the flexible wiring boards (60) is fixed with an adhesive (90). A protrusion member (71) is provided on the outside of the terminal row consisting of the connection terminals (70) on the inner surface of the plate (60) for expanding the bonding area by the adhesive (90). flat type display device.
JP3043351A 1991-03-08 1991-03-08 Flat type display Pending JPH04280036A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3043351A JPH04280036A (en) 1991-03-08 1991-03-08 Flat type display

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3043351A JPH04280036A (en) 1991-03-08 1991-03-08 Flat type display

Publications (1)

Publication Number Publication Date
JPH04280036A true JPH04280036A (en) 1992-10-06

Family

ID=12661432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3043351A Pending JPH04280036A (en) 1991-03-08 1991-03-08 Flat type display

Country Status (1)

Country Link
JP (1) JPH04280036A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100820631B1 (en) * 2006-10-10 2008-04-11 엘지전자 주식회사 Plasma display device
EP3761767A1 (en) * 2019-07-02 2021-01-06 Canon Production Printing Holding B.V. An interconnection structure connecting a chip to a printed circuit sheet
JP2021007138A (en) * 2019-06-28 2021-01-21 エルジー ディスプレイ カンパニー リミテッド Electronic devices and their manufacturing methods, and display devices and their manufacturing methods

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100820631B1 (en) * 2006-10-10 2008-04-11 엘지전자 주식회사 Plasma display device
JP2021007138A (en) * 2019-06-28 2021-01-21 エルジー ディスプレイ カンパニー リミテッド Electronic devices and their manufacturing methods, and display devices and their manufacturing methods
EP3761767A1 (en) * 2019-07-02 2021-01-06 Canon Production Printing Holding B.V. An interconnection structure connecting a chip to a printed circuit sheet

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