JPH0428448U - - Google Patents
Info
- Publication number
- JPH0428448U JPH0428448U JP6900790U JP6900790U JPH0428448U JP H0428448 U JPH0428448 U JP H0428448U JP 6900790 U JP6900790 U JP 6900790U JP 6900790 U JP6900790 U JP 6900790U JP H0428448 U JPH0428448 U JP H0428448U
- Authority
- JP
- Japan
- Prior art keywords
- device hole
- semiconductor pellet
- tab
- type semiconductor
- inner lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000008188 pellet Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Description
第１図は、この考案のＴＡＢ式半導体装置の一
実施例を示す要部平面図である。第２図は、従来
のＴＡＢ式半導体装置の一実施例を示す平面図、
第３図は、第２図の側断面図である。
１……（絶縁性）テープ、１ａ……デバイスホ
ール、１ｃ……延在部、２……配線パターン、２
ａ……インナリード、３……半導体ペレツト、４
……樹脂。
FIG. 1 is a plan view of essential parts of an embodiment of the TAB type semiconductor device of this invention. FIG. 2 is a plan view showing an example of a conventional TAB type semiconductor device;
FIG. 3 is a side sectional view of FIG. 2. DESCRIPTION OF SYMBOLS 1... (insulating) tape, 1a... device hole, 1c... extension part, 2... wiring pattern, 2
a...Inner lead, 3...Semiconductor pellet, 4
……resin.
Claims (1)
線パターンの一部をデバイスホール内に延長させ
てインナリードを形成し、このインナリードと半
導体ペレツトの電極とをボンデイングしたＴＡＢ
式半導体装置において、上記インナリードのうち
隣接するインナリードの間隔が疎の部分でデバイ
スホールの内周面を半導体ペレツトに近接させ、
半導体ペレツトを含むデバイスホール内を樹脂に
てコーテイングしたことを特徴とするＴＡＢ式半
導体装置。 A TAB in which a part of the wiring pattern laminated on a tape having a device hole is extended into the device hole to form an inner lead, and the inner lead and the electrode of the semiconductor pellet are bonded.
In the type semiconductor device, the inner circumferential surface of the device hole is brought close to the semiconductor pellet at a portion of the inner leads where the distance between adjacent inner leads is sparse,
A TAB type semiconductor device characterized in that the inside of a device hole containing a semiconductor pellet is coated with a resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6900790U JPH0428448U (en) | 1990-06-28 | 1990-06-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6900790U JPH0428448U (en) | 1990-06-28 | 1990-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0428448U true JPH0428448U (en) | 1992-03-06 |
Family
ID=31603942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6900790U Pending JPH0428448U (en) | 1990-06-28 | 1990-06-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0428448U (en) |
-
1990
- 1990-06-28 JP JP6900790U patent/JPH0428448U/ja active Pending