JPH04285158A - Vacuum deposition device - Google Patents

Abstract

PURPOSE:To surely and continuously liquify and recover the stuck vapor deposition substance by providing a vapor recovering plate in the position different from a base plate in a vacuum tank, and forming a groove continuously changed into a circular shape from a circular arc shape along inclination on the surface of the vapor recovering plate. CONSTITUTION:A vapor deposition film is formed in a vacuum tank by heating and vaporizing the vapor deposition substance housed in a crucible by irradiation of electron beams and sticking this vapor on the base plate arranged to the upside of the crucible. In the vacuum deposition device, a vapor recovering plate 21 is provided in the position different form the base plate. Unavailable vapor flow 10 vaporized in the direction different from the base plate is stuck on the surface of the vapor recovering plate 21. Thereafter, this vapor deposition substance is heated, melted and recovered. A plurality of pieces of groove continuously changed into a circular shape from a circular arc shape are formed along the downside from the upside of inclination on the recovery surface of the vapor recovering plat 21. Thereby, when the stuck vapor deposition substance is heated and melted, droplets of liquid flow down along the grooves and are recovered without separation and dropping. The device is continuously operated for a long time.

Description

[Detailed description of the invention]

[Purpose of the invention]

0001

[Industrial Application Field] The present invention is directed to an electron beam heating type vacuum evaporation apparatus, in particular, by continuously and stably recovering the evaporation material that has become ineffective due to adhesion to other than the substrate, and reusing it for evaporation. , relates to a vacuum evaporation apparatus that improves operating efficiency and economical efficiency of the apparatus.

0002

2. Description of the Related Art Conventionally, for example, in the development of semiconductor film forming processes, thin film forming techniques using vacuum evaporation have generally been employed.

[0003] This thin film production technology involves vaporizing a deposition material in a vacuum and depositing it on a substrate. As a means of vaporizing the material, an electron beam heating method is particularly advantageous due to its technical simplicity and economy in terms of generation and control. It is widely used because of its advantages.

FIG. 6 schematically shows an example of a schematic configuration of a vacuum evaporation apparatus using such an electron beam heating method. In FIG. 6, the vacuum chamber 1 is maintained at a predetermined degree of vacuum (10-5 to 10-6 Torr) by an evacuation device (not shown). This vacuum chamber 1 is provided with a steam enclosure 2 having a circumferential wall surface that is inclined to narrow from the top to the bottom, and a crucible 4 containing a vapor deposition substance 3 is provided at the bottom of the vapor enclosure 2. A substrate 5 to be vapor-deposited is placed above the substrate 5 and supported by a support (not shown). Further, an electron gun 6 is disposed on one side of the crucible 4, and by irradiating the vapor deposition material 3 with an electron beam 7 emitted from the electron gun 6, the vapor deposition material 3 is heated and evaporated to form a vapor flow 8. Generate. In this case, a cooling pipe 9 is embedded in the crucible 4 to prevent the crucible 4 through which cooling water is passed during heating from becoming too high and melting.

Further, above the substrate 5, two vapor recovery plates 11 for recovering the vapor flow 10 that evaporates in a direction different from that of the substrate 5 are arranged symmetrically so as to be inclined obliquely downward from the upper part of the substrate 5. , and is supported by a support member (not shown). Therefore, in the vacuum evaporation apparatus having such a configuration, the electron gun 6 is applied to the evaporation material 3 housed in the crucible 4.
When the vapor deposition material 3 is heated and evaporated by irradiation with an electron beam 7, a vapor flow is generated and diffused, and when the vapor flow 8 rising toward the substrate collides with the substrate 5, a vapor deposition film 12 is formed on the substrate 5. When the vapor flow 10 that is formed and evaporates in a direction different from the direction of the substrate 5 impinges on the vapor recovery plate 11, a vapor deposited film 13 is formed on the vapor recovery plate 11. The vapor deposited film 13 formed on this vapor recovery plate 11 is
By uniformly heating the entire body at a temperature higher than the melting point of the vapor deposition material using a heat source (not shown), it is melted and liquefied, and this is caused to flow down along the sloped surface of the lower surface of the vapor recovery plate 11 to form the vapor enclosure container 2. The liquid is transmitted to the wall and collected into the crucible 4.

[0006]

[Problems to be Solved by the Invention] However, in such a conventional vacuum evaporation apparatus, when the entire vapor recovery plate 11 is uniformly heated to melt the vapor deposited film 13, the vapor recovery plate 11 and Because the contact area with the vapor deposited film 13 melts, the vapor deposited film may peel off due to its own weight and fall, or even if the vapor deposited film does not peel off, the surface tension and specific gravity of the vapor deposited material may be high, or the wettability with the collection plate may be poor. If the droplet is small, the droplet will grow as it flows down the slope of the vapor recovery plate due to the melting of the vapor deposited material on the recovery plate, and if it becomes larger than the falling limit weight, it will drip from the vapor recovery plate. There was a problem that continuous liquefaction and recovery could not be performed and the equipment could not be operated continuously for a long time.

The present invention has been made in view of the above circumstances, and its purpose is to reliably and continuously liquefy and recover the vapor deposited substances adhering to the vapor recovery plate, thereby enabling continuous operation for a long period of time and providing an economically advantageous method. An object of the present invention is to provide a vacuum evaporation device. [Structure of the invention]

[0008]

[Means for Solving the Problems] In order to achieve the above object, the present invention disposes a crucible containing a vapor deposition material in a vacuum chamber, heats and evaporates the vapor deposition material by irradiation with an electron beam, and then evaporates the vapor deposition material. The metal vapor is deposited on a substrate provided above the crucible to form a vapor deposited film, and the metal vapor that evaporates in a direction different from that of the substrate is deposited on a vapor recovery plate provided at a position different from the substrate. In a vacuum evaporation apparatus configured to heat and melt the vapor deposition material and recover it, the recovery surface of the vapor recovery plate has a slope that changes continuously from an arc shape to a circular shape from the upper side to the lower side. It is characterized in that a plurality of grooves are formed.

[0009]

[Operation] In the vacuum evaporation apparatus according to the present invention, the metal vapor flux evaporating toward the substrate is arcuate on the upper side of the vapor recovery plate, but since the droplets are still in the early stage of growth, they do not drip, and the vapor recovery plate is arcuate. Even if the droplets grow as they flow down the slope of the plate, the shape of the groove along the slope is circular, so the droplets will not separate from the surface of the steam recovery plate and will continue to flow. liquefaction recovery becomes possible.

0010

Embodiments Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of a vapor recovery plate of a vacuum evaporation apparatus according to an embodiment of the present invention, FIG. 2 is a view seen from the direction of arrow A in FIG. 1, and FIG. 4 is a partial sectional view taken along line B, FIG. 4 is a partial sectional view taken along line CC in FIG. 1, and FIG. 5 is a partial sectional view taken along line DD. Note that the configuration other than the vapor recovery plate is the same as that of the conventional vacuum evaporation apparatus shown in FIG. 6, which has already been explained, so the explanation thereof will be omitted.

The steam recovery plate 21 of this embodiment is used in place of the conventional steam recovery plate 11 shown in FIG. That is, the two vapor recovery plates 21 are arranged symmetrically and inclined diagonally downward from above the substrate, and the vapor recovery plates 21 are equipped with a heater (not shown) for heating and liquefying the vapor deposited film of ineffective vapor. is provided. Further, a groove is formed on the recovery surface of the steam recovery plate 21 from the upper side to the lower side, and this groove has a near-plane arc shape (center angle 10°) as shown in FIGS. 2 to 4. A plurality of grooves (22a, 22b, 22c) are provided which are formed to gradually become circular from the groove in ).

In this embodiment, by providing the steam recovery plate 21 with such grooves, the following effects can be obtained. That is, metal vapor rises in a direction different from the substrate direction and adheres to the downward surface of the vapor recovery plate 21, and the attached film is liquefied or condensed by heating by a heating means (not shown). As this liquid flows down along the grooves 22a, 22b, and 22c of the inclined vapor recovery plate 21, it becomes a droplet and grows. °), even if the droplet grows, it will not separate from the collection plate 21 during its growth and drop, so the deposited material can be collected continuously. The present invention is not limited to the above embodiments,
Of course, various modifications can be made without changing the gist of the invention.

[0014]

[Effects of the Invention] As explained above, according to the present invention,
The vapor deposition material attached to the vapor recovery plate can be reliably and continuously liquefied and recovered and used again for vapor deposition, allowing the device to operate continuously for a long time and providing an economically advantageous vacuum vapor deposition device. can do.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an embodiment of the present invention.

FIG. 2 is a view seen from the direction of arrow A in FIG. 1.

FIG. 3 is a partial cross-sectional view taken along line BB in FIG. 1;

FIG. 4 is a partial cross-sectional view taken along line CC in FIG. 1;

FIG. 5 is a sectional view taken along line DD in FIG. 1;

FIG. 6 is a schematic configuration diagram of a conventional vacuum evaporation apparatus.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1... Vacuum chamber, 2... Vapor enclosure container, 3... Vapor deposition substance, 4... Crucible, 5... Substrate, 6... Electron gun, 7... Electron beam, 8... Vapor flow, 9... Cooling pipe, 10... Inactive vapor flow, 11... Steam recovery plate, 12... Vapor deposited film, 13... Invalid vapor deposited film, 2
1...Steam recovery plate.

Claims (1)

[Claims] Claim 1: A crucible containing a vapor deposition material is disposed in a vacuum chamber, the vapor deposition material is heated and evaporated by irradiation with an electron beam, and the metal vapor is deposited on a substrate provided above the crucible for vapor deposition. A film is formed, and a metal vapor that evaporates in a direction different from that of the substrate is deposited on a vapor recovery plate provided at a position different from that of the substrate, and this evaporated material is heated and melted to be recovered. A vacuum evaporation apparatus characterized in that a plurality of grooves that continuously change from an arc shape to a circle shape are formed on the recovery surface of the vapor recovery plate from the upper side to the lower side of the inclined surface. .