JPH04287338A - Semiconductor wafer probing equipment - Google Patents

Abstract

PURPOSE:To optimize the shape and the size of a marking trace in accordance with the shape of a pellet. CONSTITUTION:Desired values concerning to shape, size, etc., of a marking trace are inputted in a marking data input equipment 6. On the basis of said input values, a stage travel amount operating equipment 7 calculates the travel amount of a wafer stage 5. Immediately after the measurement of a pellet is ended, a making equipment 9 performs marking when the pellet is imperfect. At this time, the wafer stage 5 travels according to the calculated travel amount, and performs marking while changing a marking position in the pellet. The stage travelling and the marking are repeated for the imperfect pellet, until the shape and the size of the marking trace satisfy the input values.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention relates to a semiconductor measuring device for determining the quality of pellets at the wafer stage of a semiconductor manufacturing process, and more particularly to a wafer measuring device for supplying a wafer to a measuring device and connecting each pellet in the wafer to the measuring device. This invention relates to a probing device.

0002

[Prior Art] Conventionally, this type of probing device selects an appropriate marker from among markers with different diameters according to the pellet size and manually inserts the marker in order to make marking marks of arbitrary shapes and sizes. I was adjusting the position. Furthermore, marking was performed at one point for each defective pellet.

0003

[Problems to be Solved by the Invention] In the conventional probing device described above, in order to change the size of the marking trace according to the pellet size, markers with different diameters are prepared and the correspondence between the pellet size and the marker diameter is managed. I had to. Therefore, when probing wafers with significantly different pellet sizes using the same probing device, the markers must be replaced and adjusted each time, which poses a problem of reducing work efficiency.

[0004] Furthermore, the marking marks are circular or oval, and in the case of elongated pellets, the area ratio of the marking marks to the pellet area is increased in order to prevent the marking marks from protruding from the short sides of the pellet. However, depending on the shape of the pellet, automatic recognition of good and defective products may not be possible in subsequent processes.

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor wafer probing apparatus which is capable of marking defects in a shape and size corresponding to the pellet shape.

[0006]

Means for Solving the Problems In order to achieve the above object, a semiconductor wafer probing apparatus according to the present invention includes an input mechanism, a calculation mechanism, and a marking mechanism. is a mechanism for inputting the shape and size of the marking trace, and the calculation mechanism is a mechanism for calculating the moving direction and amount of movement of the wafer stage within one defective pellet in order to satisfy the input contents. This is a mechanism that performs marking multiple times within one defective pellet based on the output from the calculation mechanism while actually moving the wafer stage and changing the marking position. This is used to mark defects.

[0007]

[Operation] The semiconductor wafer probing apparatus of the present invention has the following features:
Input the shape and size of the marking trace, calculate the movement direction and amount of movement of the wafer stage within one defective pellet to satisfy the input contents, and then actually move the wafer stage within one defective pellet based on the data. Marking is performed multiple times while moving the marking position and changing the marking position.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings. FIG. 1 is a block diagram showing one embodiment of the present invention. FIG. 2 is a schematic diagram showing the appearance of a marked pellet.

In the figure, a test start signal is sent from a tester 1 to a probing control device 3 via a tester interface 2. Based on this signal, the amount of movement in the X-Y direction is sent from the probing control device 3 to the stage control device 4, and the wafer stage 5 moves to start measuring the pellet to be measured. Furthermore, based on the information inputted in advance to the marking information input device 6, the stage movement amount calculation device 7 calculates the number of marking times for one defective pellet and the amount of movement of the wafer stage 5 corresponding to each marking. ing.

If the pellet to be measured is a defective product, the data calculated by the stage movement amount calculation device 7 is sent to the probing control device 3. Based on this data, the probing control device 3 sends signals alternately to the stage control device 4 and marking control device 8, causing the wafer stage 5 to move and the marking device 9 to perform marking until the marking trace has the desired shape and size. As shown in Figure 2,
A marking mark 11 on a pellet 10 is made to have a shape and size according to the shape of the pellet. Bad pellet 1
When the marking of one pellet is completed, the wafer stage 5 moves to the next pellet and starts measurement.

On the other hand, if the pellet to be measured is a good product, no marking is performed and the next pellet is moved to the wafer stage 5.
moves and starts measurement.

Thereafter, the above-described operations are repeated for all pellets of the set wafer.

[0013]

Effects of the Invention As explained above, the present invention enables marking of defective pellets with a single marker by moving the wafer stage and marking the defective pellets multiple times while changing the marking position. can be done. Therefore, there is no need to change the marker diameter, which has the effect of improving work efficiency. Furthermore, since marking traces having a shape and size corresponding to the pellet shape can be obtained, it has the effect of reducing malfunctions in an automatic recognition device for good and defective products in a subsequent process.

[Brief explanation of the drawing]

FIG. 1 is a block diagram showing one embodiment of the present invention.

FIG. 2 is a schematic diagram of the appearance of a pellet marked in the present invention.

[Explanation of symbols]

1 Tester 2 Tester interface 3. Probing control device 4 Stage control device 5 Wafer stage 6 Marking information input device 7 Stage movement calculation device 8 Marking control device 9 Marking device 10 Pellets 11 Marking traces

Claims (1)

[Claims] 1. A semiconductor wafer probing apparatus comprising an input mechanism, a calculation mechanism, and a marking mechanism, wherein the input mechanism is a mechanism for inputting the shape and size of a marking trace, and the calculation mechanism is a mechanism for inputting the shape and size of a marking trace. This is a mechanism that calculates the moving direction and amount of movement of the wafer stage within one defective pellet in order to satisfy the content, and the marking mechanism actually moves the wafer stage within one defective pellet based on the output from the calculation mechanism. What is claimed is: 1. A semiconductor wafer probing device, which is characterized in that it is a mechanism that performs marking multiple times while changing the position of the marking, and is capable of marking defects of any shape and size with a single marking device.